Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/28/2012CN202564221U Single-pad embedded multi-loop single-chip horizontal packaging structure
11/28/2012CN202564220U Single-substrate embedded type packaging structure with multi-circle pins, single normal chip, passive devices and electrostatic release ring
11/28/2012CN202564219U Multi-base-island embedding type multi-circle single-chip normally-equipped packaging structure
11/28/2012CN202564218U Multi-base-island embedding type single-circle single-flip-chip packaging structure
11/28/2012CN202564217U Single-base-island embedding type multi-ring and multi-chip forward packaging structure of electrostatic discharge rings of passive devices
11/28/2012CN202564216U Single-base-island embedding-type single-circle multi-chip upward-arranged package structure
11/28/2012CN202564215U Multi-base-island embedded type single-coil multi-chip formal-assembling package structure
11/28/2012CN202564214U Multi-base-island embedding type single-circle multi-chip normally-equipped and normally-equipped passive-component packaging structure
11/28/2012CN202564213U Multi-base-island embedding-type multi-circle multi-chip upward-arranged reversely-arranged package structure
11/28/2012CN202564212U Single-base-island-embedded type multi-circle multi-chip normal chip and flip chip packaging structure
11/28/2012CN202564211U Multi-pad embedded multi-loop multi-chip horizontal and horizontal packaging structure
11/28/2012CN202564210U Chip straight-placing multi-coil single-chip front-installed packaging structure
11/28/2012CN202564209U Single-island embedded type single-circle multi-chip flip package structure
11/28/2012CN202564208U Single-base-island-embedded type multi-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564207U Multi base island embedded type multi-circle multi-chip inverse packaging structure
11/28/2012CN202564206U Single-substrate embedded type packaging structure with multi-circle pins, multiple normal and flip chips and passive devices
11/28/2012CN202564205U Single-base-island embedded type single-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564204U Multi-base-island embedding type single-circle multi-chip normal chip and flip chip passive-component packaging structure
11/28/2012CN202564203U Chip straight-put type single-ring multi-chip normal passive device package structure
11/28/2012CN202564202U Multiple base island embedded type multi-turn multi-chip flipping passive device packaging structure
11/28/2012CN202564201U Multiple base island embedded type single-turn multi-chip flipping passive device packaging structure
11/28/2012CN202564200U Sixteen-pin emission chip package structure
11/28/2012CN1906416B Gas jetting device, electronic device and gas jetting method
11/28/2012CN102804428A Leadframe or substrate for LED, semiconductor device, and method for manufacturing leadframe or substrate for LED
11/28/2012CN102804381A Applying chiplets to substrates
11/28/2012CN102804374A Integrated Circuit Package Having Security Feature And Method Of Manufacturing Same
11/28/2012CN102804373A Enhanced electromigration performance of copper lines in metallization systems of semiconductor devices by surface alloying
11/28/2012CN102804372A Microelectronic assembly with joined bond elements having lowered inductance
11/28/2012CN102804371A Method for manufacturing tight pitch, flip chip integrated circuit packages
11/28/2012CN102804370A Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
11/28/2012CN102804369A Heat sink
11/28/2012CN102804368A Semiconductor device
11/28/2012CN102804367A Use of ionomeric silicone thermoplastic elastomers in electronic devices
11/28/2012CN102804366A IC package stiffener with beam
11/28/2012CN102804365A High-frequency circuit board
11/28/2012CN102804364A Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
11/28/2012CN102804363A Ductor device and method for manufacturing semiconductor device
11/28/2012CN102804362A Optoelectronic component and method for the production thereof
11/28/2012CN102804361A Optoelectronic component and method for the production thereof
11/28/2012CN102804352A Wiring layer structure and process for manufacture thereof
11/28/2012CN102804351A Barrier layer, film deposition method, and treating system
11/28/2012CN102804341A Method for producing electronic device, electronic device, semiconductor device, and transistor
11/28/2012CN102804097A Heat-dissipating Device And Electronic Apparatus Having The Same
11/28/2012CN102803888A 散热器及其制造方法 And a method of manufacturing the heat sink
11/28/2012CN102803333A Epoxy resin composition, prepreg and cured products thereof
11/28/2012CN102803132A Thermoelectric alloys with improved thermoelectric power factor
11/28/2012CN102802929A Device and method for manufacturing molded objects
11/28/2012CN102802864A Method of forming microstructures, laser irradiation device, and substrate
11/28/2012CN102802381A Power electronic system with subsystem and a cooling device
11/28/2012CN102802352A Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof
11/28/2012CN102801338A Three-phase super-power rectification bridge group
11/28/2012CN102800801A Electrically-cooled power module
11/28/2012CN102800710A Semiconductor diode packaging structure
11/28/2012CN102800706A Thin-film semiconductor device and display equipped with same
11/28/2012CN102800699A Semiconductor structure and forming method thereof
11/28/2012CN102800693A Semiconductor devices and related methods
11/28/2012CN102800674A 半导体器件 Semiconductor devices
11/28/2012CN102800673A Semiconductor cell and semiconductor device
11/28/2012CN102800668A Thin-film field effect transistor array substrate and manufacturing method thereof
11/28/2012CN102800665A Integrated circuit with sensor and method of manufacturing such an integrated circuit
11/28/2012CN102800662A Layered semiconductor device and manufacturing method thereof
11/28/2012CN102800660A Module and method of manufacturing a module
11/28/2012CN102800658A Test key structure and wafer test method
11/28/2012CN102800657A Alignment structure
11/28/2012CN102800656A Chip package, method for forming the same, and package wafer
11/28/2012CN102800655A 测试布局结构 Test layout structure
11/28/2012CN102800654A Structure designs and methods for integrated circuit alignment
11/28/2012CN102800653A Interposer testing using dummy connections
11/28/2012CN102800652A Overlay mark and method for fabricating the same
11/28/2012CN102800651A Semiconductor device and method of manufacturing semiconductor device
11/28/2012CN102800650A Uniformity control for ic passivation structure
11/28/2012CN102800649A Multilayer package substrate and package member
11/28/2012CN102800648A Semiconductor inductor structure and semiconductor circuit device
11/28/2012CN102800647A Three-dimensional spiral inductor and forming method thereof
11/28/2012CN102800646A Capacitor structure
11/28/2012CN102800645A Symmetric differential inductor structure
11/28/2012CN102800644A Double data rate (DDR) signal wiring encapsulation substrate and DDR signal wiring encapsulation method
11/28/2012CN102800643A Conductive via structure
11/28/2012CN102800642A Multi-chip encapsulation structure with lead frame type contact finger
11/28/2012CN102800641A Semiconductor flip chip combining structure and method
11/28/2012CN102800640A Digital regulating and control type ACW (Alternating Continuous Wave) transmission line structure
11/28/2012CN102800639A Mixed integrated packaging structure
11/28/2012CN102800638A High performance electronic system with first and second subsystem
11/28/2012CN102800637A Power electronics system with connectors between first and second subsystem
11/28/2012CN102800636A Electronic component package and manufacturing method thereof
11/28/2012CN102800635A Semiconductor device
11/28/2012CN102800634A Mounting structure of semiconductor package component and manufacturing method therefor
11/28/2012CN102800633A Semiconductor component and method of fabricating the same
11/28/2012CN102800601A Package-on-package process for applying molding compound
11/28/2012CN102800599A Projection process and structure thereof
11/28/2012CN102800598A Substrate for embedding active element and embedding method
11/28/2012CN102800596A Resin substrate for embedding active elements and preparation method thereof
11/28/2012CN102800566A Method for protecting alignment mark through contact area lead wire process in semiconductor device
11/28/2012CN102800565A Stack capacitor structure and forming method
11/28/2012CN102799247A Three-channel water-cooling structure of computer CPU (Central Processing Unit)
11/28/2012CN102799244A Multi-channel water-cooling device structure of computer CPU (Central Processing Unit)
11/28/2012CN102799243A Three-channel cooling structure of CPU (Central Processing Unit)
11/28/2012CN102799241A Double-channel water cooling device of computer CPU (Central Processing Unit)
11/28/2012CN102798810A Semiconductor-based test device that implements random logic functions
11/28/2012CN102796486A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
1 ... 295 296 297 298 299 300 301 302 303 304 305 306 307 308 309 310 311 312 313 314 315 ... 2262