Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/28/2012CN202564321U Single-base-island embedded type single-circle multi-chip normally-equipped and normally-equipped packaging structure
11/28/2012CN202564320U Non-base-island single-circle multi-chip stacked reversely-arranged upward-arranged passive device package structure
11/28/2012CN202564319U Single-base-island embedded type multi-coil single-chip reversed-assembling static release ring package structure
11/28/2012CN202564318U Multi-base-island embedding single-circle single-chip normally-equipped passive-component static-release-ring packaging structure
11/28/2012CN202564317U Multi-base-island embedding type single-circle single-chip normally-equipped electrostatic-discharge-ring packaging structure
11/28/2012CN202564316U Multi-pad embedded multi-loop single-chip horizontal passive device static electricity discharge loop package structure
11/28/2012CN202564315U Single-base-island embedded type single-circle multi-chip normal chip and flip chip passive-component packaging structure
11/28/2012CN202564314U Single-pad embedded single-loop single-chip flip package structure
11/28/2012CN202564313U Single-substrate embedded type packaging structure with multi-circle pins, single flip chip and passive devices
11/28/2012CN202564312U Multi-base embedding-type single-circle multi-chip normal static electricity releasing circle packaging structure
11/28/2012CN202564311U Multiple base island embedded type multi-ring single-chip flip passive device package structure
11/28/2012CN202564310U Multi-base-island embedding type multi-circle single-chip normally-equipped static-release-ring packaging structure
11/28/2012CN202564309U Single-base-island embedded type single-circle single-flip-chip passive-component packaging structure
11/28/2012CN202564308U Single-substrate embedded packaging structure with multi-circle pins and multiple normal chips
11/28/2012CN202564307U Single-base-island embedded type single-circle multi-chip normally-equipped passive-component packaging structure
11/28/2012CN202564306U Multi-base-island embedding single-circle multi-chip normally-equipped passive-component static-release-ring packaging structure
11/28/2012CN202564305U Single-base-island-embedded type multi-circle multi-chip normally-equipped and normally-equipped passive-component packaging structure
11/28/2012CN202564304U Multi-base-island embedding type single-circle single-flip-chip passive-component packaging structure
11/28/2012CN202564303U Single-base-island-embedded type multi-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure
11/28/2012CN202564302U Single-base-island-embedded type multi-circle multi-chip normally-equipped packaging structure
11/28/2012CN202564301U Single-substrate embedded type packaging structure with single-circle pins, single normal chip and electrostatic release ring
11/28/2012CN202564300U Single-base-island-embedded type multi-circle single-flip-chip packaging structure
11/28/2012CN202564299U Multi-base-island embedding type single-circle single-chip normally-equipped packaging structure
11/28/2012CN202564298U Single-base-island embedded type multi-coil multi-chip reversed-assembling and formal-assembling package structure
11/28/2012CN202564297U Single pad embedded single-loop multi-chip horizontal mounting electrostatic discharge ring package structure
11/28/2012CN202564296U Package structure for multi-base-island embedded type single-circle single-chip positively-mounted passive device
11/28/2012CN202564295U Multi-island embedded type multi-circle multi-chip flip-mounting up-mounting package structure employing passive devices
11/28/2012CN202564294U Multi base island embedded type multi-circle multi-chip positive packaging passive device packaging structure
11/28/2012CN202564293U Chip straightly placed type multi-circle multi-chip positive packaging structure
11/28/2012CN202564292U Chip on board type multi-loop multi-chip horizontal passive device package structure
11/28/2012CN202564291U Multi-base-island embedding-type multi-circle multi-chip reversely-arranged upward-arranged package structure
11/28/2012CN202564290U Packaging structure with multi-circle pins, single normal chip and passive devices
11/28/2012CN202564289U Multi-pad embedded single-loop multi-chip horizontal and flip packaging structure
11/28/2012CN202564288U Multi-base-island embedding type single-circle multi-chip flip packaging structure
11/28/2012CN202564287U Multiple base island embedded type single-turn multi-chip flipping normal packaging structure
11/28/2012CN202564286U Chip direct placement type single-turn multi-chip normal packaging structure
11/28/2012CN202564285U Chip direct placement type single-turn single-chip normal packaging structure
11/28/2012CN202564284U Multiple base island embedded type multi-turn multi-chip normal flipping passive device packaging structure
11/28/2012CN202564283U Single base island embedded type multi-turn multi-chip flipping and packaging structure
11/28/2012CN202564282U Multiple base island embedded type single-turn multi-chip flipping normal passive device packaging structure
11/28/2012CN202564281U 半导体模块 Semiconductor Modules
11/28/2012CN202564280U 引线框架及半导体模块 Lead frame and semiconductor module
11/28/2012CN202564279U Projection type mold cleaning/wetting alternative lead frame/semiconductor substrate
11/28/2012CN202564278U Enhanced type integrated-circuit lead frame plate with intersected and staggered arrangement
11/28/2012CN202564277U Lead frame of integrated circuit
11/28/2012CN202564276U Non-base-island multi-circle multi-chip stacked normally-equipped and normally-equipped packaging structure
11/28/2012CN202564275U Non-base-island single-circle multi-chip stacked normally-equipped and normally-equipped packaging structure
11/28/2012CN202564274U Non-base-island multi-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564273U Island-free multi-circle single-chip flip package structure employing passive devices
11/28/2012CN202564272U Non-base-island single-circle multi-chip stacked normal chip and flip chip packaging structure
11/28/2012CN202564271U Chip straightly placing type single-circle single-chip normal passive device packaging structure
11/28/2012CN202564270U Electronic component package structure
11/28/2012CN202564269U Base-free multi-circle multi-chip stacking normal passive device packaging structure
11/28/2012CN202564268U Package structure for base-island-free multi-circle multi-chip stacked positively-mounted and inversely-mounted type passive device
11/28/2012CN202564267U Single-island exposed type single-circle single-chip up-mounting package structure employing an electrostatic discharge ring
11/28/2012CN202564266U Single base island exposed type multi-ring single-chip normal static release ring package structure
11/28/2012CN202564265U Single-base-island uncovering type single-circle multi-chip reversely-arranged upward-arranged passive device package structure
11/28/2012CN202564264U Pad-free multi-loop multi-chip stacking horizontal and flip package structure
11/28/2012CN202564263U Single-base-island exposed single-circle single-chip normally-equipped passive-component electrostatic discharge-ring packaging structure
11/28/2012CN202564262U Multi-base-island exposed type single-coil single-chip reversed-assembling package structure
11/28/2012CN202564261U Multi-base exposed single-loop single-chip normal packaging structure
11/28/2012CN202564260U Package structure for electrostatic releasing rings of multi-base-island exposed multi-circle single-chip positively-mounted type passive device
11/28/2012CN202564259U Non-base-island multi-circle multi-chip stacked flip and normally-equipped packaging structure
11/28/2012CN202564258U Single-base-island-exposed-type single-circle multi-chip normal chip and flip chip packaging structure
11/28/2012CN202564257U Single-base-island uncovering type multi-circle single-chip reversely-arranged passive device package structure
11/28/2012CN202564256U Multi-base-island-exposed type multi-circle single-flip-chip packaging structure
11/28/2012CN202564255U Single-base-island-exposed-type multi-circle multi-chip flip and normally-equipped packaging structure
11/28/2012CN202564254U Single-base-island-exposed-type single-circle multi-chip normally-equipped passive-component packaging structure
11/28/2012CN202564253U Multi-base exposed multi-loop multichip normal passive device packaging structure
11/28/2012CN202564252U Single-base-island uncovering type single-circle single-chip reversely-arranged passive device package structure
11/28/2012CN202564251U Single base island exposed type single-circle multi-chip positive-and-inverse packaging passive device packaging structure
11/28/2012CN202564250U Single-base-island exposed type single-ring and single-chip inverted packaging structure
11/28/2012CN202564249U Multi-base-island uncovering type multi-circle single-chip reversely-arranged passive device package structure
11/28/2012CN202564248U Base-free single-circle multi-chip stacking inverse and normal packaging structure
11/28/2012CN202564247U Single-base-island exposed multi-circle multi-chip normally-equipped passive-component electrostatic discharge-ring packaging structure
11/28/2012CN202564246U Multi-base-island exposed type single-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure
11/28/2012CN202564245U Single-base-island-exposed-type single-circle multi-chip flip packaging structure
11/28/2012CN202564244U Multi-base-island exposed type single-circle multi-chip normally-equipped packaging structure
11/28/2012CN202564243U Multi-base exposed single-loop multichip inverted packaging structure
11/28/2012CN202564242U Multi-base-island exposed type single-circle single-chip normally-equipped passive-component packaging structure
11/28/2012CN202564241U Multi-base-island-exposed type multi-circle multi-chip flip and normally-equipped passive-component packaging structure
11/28/2012CN202564240U Multi base island exposed type multi-circle multi-chip positive-and-inverse packaging passive device packaging structure
11/28/2012CN202564239U Single-base-island uncovering type multi-circle multi-chip reversely-arranged package structure
11/28/2012CN202564238U Multi-base-island-exposed type multi-circle multi-chip flip packaging structure
11/28/2012CN202564237U Multi-base-island exposed type single-circle multi-chip normal chip and flip chip passive-component packaging structure
11/28/2012CN202564236U Multi-base-island-exposed type multi-circle multi-chip normally-equipped packaging structure
11/28/2012CN202564235U Single base island exposed type multi-circle multi-chip inverse packaging passive device packaging structure
11/28/2012CN202564234U Multi-base-island exposed type single-circle multi-chip flip and normally-equipped packaging structure
11/28/2012CN202564233U No base island one-loop multi-chip inverse packaging passive device packaging structure
11/28/2012CN202564232U Multi-base exposure-type multi-circle multi-chip normal and inverse packaging structure
11/28/2012CN202564231U Single-substrate embedded type packaging structure with single-circle pins and single normal chip
11/28/2012CN202564230U Non-base-island single-circle multi-chip flip packaging structure
11/28/2012CN202564229U Single-base-island-embedded type multi-circle single-chip normally-equipped passive-component packaging structure
11/28/2012CN202564228U Single-base-island embedded type single-circle multi-chip normal chip and flip chip packaging structure
11/28/2012CN202564227U Single-island embedded single-circle single-chip up-mounting package structure employing passive devices and an electrostatic discharge ring
11/28/2012CN202564226U Single-pad embedded multi-loop multi-chip flip and horizontal passive device package structure
11/28/2012CN202564225U Multi-base-island embedding type multi-circle single-flip-chip packaging structure
11/28/2012CN202564224U Multi-base-island embedding type multi-ring and multi-chip forward packaging structure of electrostatic discharge rings
11/28/2012CN202564223U Multi-base-island embedding type multi-circle multi-chip normally-equipped packaging structure
11/28/2012CN202564222U Multi-island embedded type multi-circle single-chip up-mounting package structure employing passive devices
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