Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2012
11/29/2012US20120299175 Systems and methods to cool semiconductor
11/29/2012US20120299174 Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected By Bumps and Conductive Vias
11/29/2012US20120299173 Thermally Enhanced Stacked Package and Method
11/29/2012US20120299172 Lead frame for semiconductor device
11/29/2012US20120299171 Leadframe-based ball grid array packaging
11/29/2012US20120299170 Module and Method of Manufacturing a Module
11/29/2012US20120299168 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
11/29/2012US20120299167 Uniformity control for ic passivation structure
11/29/2012US20120299166 Conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device
11/29/2012US20120299165 Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer
11/29/2012US20120299162 Barrier film for electronic device, method of manufacture thereof, and articles including the same
11/29/2012US20120299161 Conductive via structure
11/29/2012US20120299160 Method of Forming Contacts for Devices with Multiple Stress Liners
11/29/2012US20120299159 Structure designs and methods for integrated circuit alignment
11/29/2012US20120299119 Stacked power semiconductor device using dual lead frame and manufacturing method
11/29/2012US20120299069 Copper-filled trench contact for transistor performance improvement
11/29/2012US20120298994 Semiconductor device
11/29/2012US20120298993 Semiconductor device and method of manufacturing semiconductor device
11/29/2012US20120298992 Test layout structure
11/29/2012US20120298597 Solar Panels Fixtures and Installations
11/29/2012US20120298202 Solar cell assembly i
11/29/2012DE112010003177T5 Gehäuse mt integrierter Schaltung mit Sicherheitsmerkmal und Verfahren zu dessen Herstellung Housing mt integrated circuit having a security feature and process for its preparation
11/29/2012DE112009005359T5 Kühlkörper, Kühlkörperanordnung, Halbleitermodul und Halbleitereinrichtung mit einer Kühleinrichtung Heat sink, heat sink assembly, the semiconductor module and semiconductor device with a cooling device
11/29/2012DE102012208745A1 Elektrisch gekühltes Stromversorgungsmodul Electrically cooled power supply module
11/29/2012DE102012208633A1 Leistungshalbleitermodul mit eingebettetem Chipgehäuse The power semiconductor module with an embedded chip package
11/29/2012DE102012207310A1 Halbleitervorrichtung Semiconductor device
11/29/2012DE102011076570A1 Module e.g. molded electronic module, for control device in vehicle, has cooling body made of sapphire crystals, whose orientations correspond to heat dissipation direction and comprises outer surface exposed to outer side of module
11/29/2012DE102011076325A1 Leistungselektronisches System mit Subsystemen und einer Kühleinrichtung Power electronic system comprising subsystems, and a cooling device
11/29/2012DE102011076324A1 Leistungselektronisches System mit Verbindungseinrichtung erster und zweiter Subsysteme Power electronic system with connection means, first and second subsystems
11/29/2012DE102011076323A1 Leistungselektronisches System mit erstem und zweitem Subsystem Electronic power system having first and second subsystem
11/29/2012DE102011050585A1 Method for producing plastic molded structure as display and/or functional element in motor vehicle, involves providing conductor track plane of lower functional film with electronic components, after molding of plastic molded structure
11/29/2012DE102008028943B4 Integrierter Schaltungschip mit einer beanspruchungspuffernden Schicht, Halbleiterbauelement, Verfahren zum Schützen eines Chips und Einzelchipbaustein The integrated circuit chip having a stress buffering layer, semiconductor device, method for protecting a chip and single chip module
11/29/2012CA2836845A1 Method for forming a vertical electrical connection in a layered semiconductor structure
11/28/2012EP2528424A1 Display device with heat spreader
11/28/2012EP2528100A1 Circuit board, display device, and process for production of circuit board
11/28/2012EP2528095A1 High performance electronic system with first and second subsystem
11/28/2012EP2528092A1 Semiconductor device
11/28/2012EP2528091A2 High performance electronic system with subsystem and a cooling device
11/28/2012EP2528090A1 Semiconductor component and method for its manufacture
11/28/2012EP2528089A1 Method for forming a vertical electrical connection in a layered semiconductor structure
11/28/2012EP2528086A2 Semiconductor device comprising a resistor and two capacitors of different capacitance
11/28/2012EP2527388A1 Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
11/28/2012EP2527385A1 Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
11/28/2012EP2526565A2 Semiconductor package and method
11/28/2012EP2526545A1 Sensor having damping
11/28/2012EP2525922A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process
11/28/2012CN202565639U Heat radiation structure of heat radiation device
11/28/2012CN202565219U Speed regulating device for automobile radiator fan motor
11/28/2012CN202564724U Electrical connection module and its chip module
11/28/2012CN202564372U Single-base-island-exposed type single-circle single-chip normally-equipped packaging structure
11/28/2012CN202564371U Single-base-island uncovering type single-circle single-chip upward-arranged passive device package structure
11/28/2012CN202564370U Single-base-island-exposed-type multi-circle single-chip normally-equipped packaging structure
11/28/2012CN202564369U Single-base-island-exposed-type single-circle multi-chip flip and normally-equipped packaging structure
11/28/2012CN202564368U Single-base-island-exposed-type single-circle multi-chip normally-equipped packaging structure
11/28/2012CN202564367U Single-base exposed single-loop multichip normal passive device electrostatic discharge ring packaging structure
11/28/2012CN202564366U Multi base island exposed type one-loop single-chip positive packaging passive device electrostatic release coil packaging structure
11/28/2012CN202564365U Multi-base-island-exposed type multi-circle single-chip normally-equipped passive-component packaging structure
11/28/2012CN202564364U Multi-base-island exposed type single-circle single-flip-chip passive-component packaging structure
11/28/2012CN202564363U Packaging structure of single-base-island exposed-type multi-ring multi-chip inversion passive device
11/28/2012CN202564362U Single-base-island-exposed-type single-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure
11/28/2012CN202564361U Single-pad exposed type multi-loop multi-chip horizontal package structure
11/28/2012CN202564360U Single-base-island exposed multi-coil single-chip formal-assembling passive device static release ring package structure
11/28/2012CN202564359U Pad-free multi-ring multi-chip stacked flip and horizontal mounting passive device package structure
11/28/2012CN202564358U Single-base-island-exposed-type multi-circle multi-chip normally-equipped electrostatic discharge-ring packaging structure
11/28/2012CN202564357U Multi-base-island exposed single-coil multi-chip formal-assembling passive device static release ring package structure
11/28/2012CN202564356U Face-up passive device packaging structure having exposed single die pad, multi-circle leads and single chip
11/28/2012CN202564355U Multi-base-island-exposed type multi-circle single-chip normally-equipped packaging structure
11/28/2012CN202564354U Single-pad exposed type single-loop multi-chip horizontal and horizontal passive device package structure
11/28/2012CN202564353U Single-base-island-exposed-type multi-circle single-flip-chip packaging structure
11/28/2012CN202564352U Multi-base-island uncovering type single-circle single-chip upward-arranged static discharge ring package structure
11/28/2012CN202564351U Multi-substrate exposed type packaging structure with single-circle pins and multiple normal and flip chips
11/28/2012CN202564350U Face-up passive device packaging structure having exposed single die pad, multi-circle leads and multiple chips
11/28/2012CN202564349U Multi-base-island-exposed type multi-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564348U Multi-base island exposed multi-circle multi-chip normally-equipped passive-component electrostatic-discharge-ring packaging structure
11/28/2012CN202564347U Face-up passive device packaging structure having exposed multiple die pads, single-circle leads and multiple chips
11/28/2012CN202564346U Face-up electrostatic discharge ring packaging structure having exposed multiple die pads, multi-circle leads and multiple chips
11/28/2012CN202564345U Pad free single-loop single-chip flip passive device package structure
11/28/2012CN202564344U Single-base-island-exposed-type single-circle multi-chip normally-equipped and normally-equipped packaging structure
11/28/2012CN202564343U Base-island-free multi-circle multi-chip flip-chip package structure
11/28/2012CN202564342U Multi-base-island-exposed type multi-circle single-chip normally-equipped static-release-ring packaging structure
11/28/2012CN202564341U Multi-pad exposed multi-loop multi-chip flip and horizontal mounting passive device package structure
11/28/2012CN202564340U Non-base-island single-circle multi-chip stacked normally-equipped and normally-equipped passive-component packaging structure
11/28/2012CN202564339U Single base island embedded type single-ring multi-chip inverted normal passive device package structure
11/28/2012CN202564338U Single base island exposed type multi-ring multi-chip normal/flip package structure
11/28/2012CN202564337U Single-island embedded type single-circle single-chip up-mounting package structure employing passive devices
11/28/2012CN202564336U Single-base-island-exposed-type multi-circle multi-chip normally-equipped and normally-equipped packaging structure
11/28/2012CN202564335U Multi-base-island-exposed type multi-circle multi-chip flip and normally-equipped packaging structure
11/28/2012CN202564334U Multi-base-island exposed type single-circle multi-chip normally-equipped passive-component packaging structure
11/28/2012CN202564333U Multi-base-island-exposed type multi-circle multi-chip normally-equipped and normally-equipped passive-component packaging structure
11/28/2012CN202564332U Base-island-free single-coil multi-chip stack formal-assembling and reversed-assembling passive device package structure
11/28/2012CN202564331U Single-base-island-exposed-type single-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564330U Multi-base-island exposed type single-circle multi-chip flip passive-component packaging structure
11/28/2012CN202564329U Single-substrate exposed packaging structure with multi-circle pins, multiple normal chips and passive devices
11/28/2012CN202564328U Single-pad exposed type multi-loop multi-chip horizontal and flip passive device packaging structure
11/28/2012CN202564327U Non-base-island single-circle single-flip-chip packaging structure
11/28/2012CN202564326U Single-island embedded type single-circle multi-chip up-mounting/up-mounting package structure employing passive devices
11/28/2012CN202564325U Non-base-island multi-circle single-flip-chip packaging structure
11/28/2012CN202564324U Multi-base-island uncovering type single-circle multi-chip upward-arranged upward-arranged package structure
11/28/2012CN202564323U Multi-base-island-exposed type multi-circle multi-chip normally-equipped and normally-equipped packaging structure
11/28/2012CN202564322U Single-island embedded type single-circle multi-chip flip-mounting up-mounting package structure
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