Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/05/2012CN101385140B Microelectronic assemblies having very fine pitch stacking
12/05/2012CN101355073B Leadframe panel
12/05/2012CN101315178B Cooling apparatus
12/05/2012CN101221023B Heat transmission device
12/05/2012CN101207092B 液晶显示器件及其制造方法 The liquid crystal display device and manufacturing method thereof
12/05/2012CN101124233B Novel curable resin, method for producing same, epoxy resin composition and electronic component device
12/04/2012US8326344 High-frequency device and communications apparatus
12/04/2012US8324922 Selective core functional and bypass circuitry
12/04/2012US8324744 Driving circuit and liquid crystal display device including the same
12/04/2012US8324742 Alignment mark for opaque layer
12/04/2012US8324741 Layered chip package with wiring on the side surfaces
12/04/2012US8324740 Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device
12/04/2012US8324739 Semiconductor device
12/04/2012US8324738 Self-aligned protection layer for copper post structure
12/04/2012US8324737 Modified chip attach process
12/04/2012US8324736 Manufacturing process and structure of through silicon via
12/04/2012US8324735 Semiconductor device
12/04/2012US8324734 Tunnel junction via
12/04/2012US8324733 Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same
12/04/2012US8324732 Semiconductor component
12/04/2012US8324730 Copper interconnection structure and method for forming copper interconnections
12/04/2012US8324729 Stacked die package for MEMS resonator system
12/04/2012US8324728 Wafer level packaging using flip chip mounting
12/04/2012US8324727 Low profile discrete electronic components and applications of same
12/04/2012US8324726 Semiconductor device, electrode member and electrode member fabrication method
12/04/2012US8324725 Stacked die module
12/04/2012US8324723 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
12/04/2012US8324722 Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity
12/04/2012US8324721 Integrated shunt resistor with external contact in a semiconductor package
12/04/2012US8324720 Power semiconductor module assembly with heat dissipating element
12/04/2012US8324719 Electronic package system
12/04/2012US8324718 Warp-suppressed semiconductor device
12/04/2012US8324717 Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module
12/04/2012US8324714 Semiconductor device and method for making the same
12/04/2012US8324712 Metal capacitor and method of making the same including dielectric layer of different mechanical strength regions
12/04/2012US8324709 Semiconductor device
12/04/2012US8324688 Electrostatic discharge protection device for high voltage operation
12/04/2012US8324687 Semiconductor device
12/04/2012US8324674 Semiconductor memory device including multi-layer gate structure
12/04/2012US8324664 Fuse of a semiconductor device
12/04/2012US8324663 Area efficient high-speed dual one-time programmable differential bit cell
12/04/2012US8324662 Semiconductor device
12/04/2012US8324654 Light emitting device and light unit having the same
12/04/2012US8324622 Method of repairing probe pads
12/04/2012US8324515 Housings for electronic components
12/04/2012US8324512 Multilayer printed wiring board
12/04/2012US8324326 Epoxy resin composition and semiconductor device
12/04/2012US8324098 Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applications
12/04/2012US8323998 Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
12/04/2012US8323991 Method for detecting stress migration properties
12/04/2012US8323989 Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices
12/04/2012US8323758 Electronic apparatus
12/04/2012US8323743 Acrylic-fiber finish, acrylic fiber for carbon-fiber production, and carbon-fiber production method
12/04/2012US8322879 Multi-wavelength semiconductor laser device
12/04/2012US8322404 Heat dissipation device for at least two electronic devices with two sets of fins
12/01/2012WO2012005003A1 Nonvolatile semiconductor memory device and method for fabricating same
11/2012
11/29/2012WO2012162369A1 Apparatus and methods for multi-scale alignment and fastening
11/29/2012WO2012161334A1 Sealed casing
11/29/2012WO2012161044A1 Semiconductor device
11/29/2012WO2012161002A1 Flat plate cooling device, and method for using same
11/29/2012WO2012160837A1 High frequency package
11/29/2012WO2012160736A1 Semiconductor device
11/29/2012WO2012160564A1 Heat exchanger device
11/29/2012WO2012160063A1 Method for forming a vertical electrical connection in a layered semiconductor structure
11/29/2012WO2012160059A1 Printed circuit board for electric components, and printed circuit board system
11/29/2012WO2012159533A1 Thermally enhanced stacked package and method
11/29/2012WO2012098446A3 Thermoelectric device
11/29/2012WO2012093910A3 Curable composition
11/29/2012WO2012093909A3 Curable composition
11/29/2012WO2012093908A3 Curable composition
11/29/2012WO2012093907A3 Curable composition
11/29/2012US20120300557 Semiconductor cell and semiconductor device
11/29/2012US20120300522 Semiconductor Device, Power Semiconductor Module and Power Conversion Device Equipped with Power Semiconductor Module
11/29/2012US20120299640 Integrated Circuit Die Stacks Having Initially Identical Dies Personalized With Fuses
11/29/2012US20120299204 Overlay mark and method for fabricating the same
11/29/2012US20120299203 Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
11/29/2012US20120299202 Mounting structure of semiconductor package component and manufacturing method therefor
11/29/2012US20120299201 Use of a Local Constraint to Enhance Attachment of an IC Device to a Mounting Platform
11/29/2012US20120299199 Stacked wafer level package having a reduced size
11/29/2012US20120299198 Integrated circuit apparatus, systems, and methods
11/29/2012US20120299197 Semiconductor packages
11/29/2012US20120299196 Integrated circuit packaging system with interlock and method of manufacture thereof
11/29/2012US20120299195 Construction of reliable stacked via in electronic substrates - vertical stiffness control method
11/29/2012US20120299194 Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
11/29/2012US20120299193 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
11/29/2012US20120299192 Pad structure, circuit carrier and integrated circuit chip
11/29/2012US20120299190 Methods and apparatus to improve reliability of isolated vias
11/29/2012US20120299189 Semiconductor memory device, method of manufacturing the same and method of forming contact structure
11/29/2012US20120299188 Wiring structure and method of forming the structure
11/29/2012US20120299187 Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products
11/29/2012US20120299186 Semiconductor device
11/29/2012US20120299184 System and method for monitoring copper barrier layer preclean process
11/29/2012US20120299183 Semiconductor device and stacked-type semiconductor device
11/29/2012US20120299182 Copper bonding wire for semiconductor and bonding structure thereof
11/29/2012US20120299181 Package-on-Package Process for Applying Molding Compound
11/29/2012US20120299180 Bonding pad structure and integrated circuit comprising a plurality of bonding pad structures
11/29/2012US20120299179 Through mold via polymer block package
11/29/2012US20120299178 Semiconductor device
11/29/2012US20120299177 Semiconductor component and method of fabricating the same
11/29/2012US20120299176 Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
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