Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/05/2012EP2528874A1 Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co fired ceramic materials and devices made therefrom
12/05/2012DE202012010602U1 Kühlvorrichtung Cooler
12/05/2012CN202587732U Liquid-cooled power semiconductor module
12/05/2012CN202587722U Porous heat dissipation module
12/05/2012CN202586956U High performance radio frequency division duplex receiving module
12/05/2012CN202586843U High power MOSFMT module
12/05/2012CN202586720U Novel IGBT module
12/05/2012CN202585425U Double-channel GPP (Glass Passivation Pellet) passivation protection diode chip
12/05/2012CN202585407U 光伏二极管 PV diode
12/05/2012CN202585406U Novel rectifier bridge
12/05/2012CN202585405U Three-phase rectifier module
12/05/2012CN202585404U Igbt module
12/05/2012CN202585403U Full-bridge single-tube IGBT packaging module
12/05/2012CN202585401U A semiconductor package structure
12/05/2012CN202585400U Capacitor array of analog-to-digital (A/D) converter
12/05/2012CN202585399U 引线框架 Leadframe
12/05/2012CN202585398U Plastic package lead frame suitable for one-sided multi-lead bonding
12/05/2012CN202585397U Multiple basic island embedding multi-loop multi-chip normal passive device static electricity release ring packaging structure
12/05/2012CN202585396U Multi-base-island embedded type single-coil multi-chip front-mounting encapsulating structure
12/05/2012CN202585395U DIP (Dual inline-pin Package) lead frame structure
12/05/2012CN202585394U Single massive diode
12/05/2012CN202585393U Water cooling plate for turbulent flow resistance of power module
12/05/2012CN202585392U Liquid-cooled radiator
12/05/2012CN202585391U Liquid-cooling heat dispassion system
12/05/2012CN202585390U Radiating fin
12/05/2012CN202585389U Cooling structure for car power amplifier integrated circuit
12/05/2012CN202585388U Improved chip structure
12/05/2012CN202585387U Structure of a heat dissipating pedestal
12/05/2012CN202585386U Single basic island embedding type multi-loop multi-chip normal passive device packaging structure
12/05/2012CN202585385U Multiple basic island embedding type multi-loop multi-chip normal passive device packaging structure
12/05/2012CN202585384U Component encapsulation structure
12/05/2012CN202585383U Ignition module having thick film packaging structure
12/05/2012CN202585382U A semiconductor package structure
12/05/2012CN1826670B Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements
12/05/2012CN102812551A Tie Bar And Mold Cavity Bar Arrangements For Multiple Leadframe Stack Package
12/05/2012CN102812550A System-in-package using embedded-die coreless substrates, and processes of forming same
12/05/2012CN102812549A Thermal Plug For Use With A Heat Sink And Method Of Assembling Same
12/05/2012CN102812548A 多芯片集成电路 Multi-Chip Integrated Circuits
12/05/2012CN102812542A Surface preparation of die for improved bonding strength
12/05/2012CN102812541A Flexible semiconductor device and method for producing same, image display device using the flexible semiconductor device and manufacturing method thereof
12/05/2012CN102812540A Flexible semiconductor device and method for producing same, image display device using the flexible semiconductor device and manufacturing method thereof
12/05/2012CN102810979A Semiconductor module and driving apparatus including semiconductor module
12/05/2012CN102810543A Semiconductor device and manufacturing method thereof, display apparatus and electronic apparatus
12/05/2012CN102810532A Semiconductor device and driving apparatus including semiconductor device
12/05/2012CN102810531A Semiconductor module system,semiconductor module and method for manufacturing semiconductor module
12/05/2012CN102810530A Solar battery cell
12/05/2012CN102810529A Overlay mark set and method for positioning two different layout patterns
12/05/2012CN102810528A Interposer test structures and methods
12/05/2012CN102810527A Semiconductor package and fabrication method of the same
12/05/2012CN102810526A Power converter, semiconductor device and method for manufacturing power converter
12/05/2012CN102810525A Multi-unit light emitting diode
12/05/2012CN102810524A Power module and production method of power module
12/05/2012CN102810523A Semiconductor device
12/05/2012CN102810522A Packaging structures and methods
12/05/2012CN102810521A Temperature-equalizing plate and manufacturing method thereof
12/05/2012CN102810520A Thermally enhanced integrated circuit package
12/05/2012CN102810519A Gas barrier film and method for manufacturing the same
12/05/2012CN102810518A Wafer loading board structure and wafer bonding method
12/05/2012CN102810517A Semiconductor wafer and method of producing the same
12/05/2012CN102810507A Semiconductor device and method of using leadframe bodies to form openings
12/05/2012CN102810491A Method for monitoring processing procedure for removing polycrystalline silicon replaced gate through gate-last technology
12/05/2012CN102810488A Semiconductor sensor device and method of packaging same
12/05/2012CN102810487A Method for joining metal-ceramic substrates to metal bodies
12/05/2012CN102810484A Semiconductor device fabrication method and semiconductor device
12/05/2012CN102810367A Electronic element capable of being repeatedly used
12/05/2012CN102810366A Long-service-life electronic element
12/05/2012CN102807757A Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel
12/05/2012CN102361023B Ceramic shell capable of enhancing radiation shielding and preparation method thereof
12/05/2012CN102196657B Circuit substrate
12/05/2012CN102194811B 热电装置 Thermoelectric devices
12/05/2012CN102194796B Wafer detection structure, manufacturing method thereof and wafer detection method
12/05/2012CN102176442B Test structure and method for measuring HCI (hot carrier injection) reliability of MOS (metal oxide semiconductor) device
12/05/2012CN102097413B Structure and method for testing integrity of grid oxide layer and dielectric layer
12/05/2012CN102064156B Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect
12/05/2012CN102063584B Chip attack protection
12/05/2012CN102054762B Semiconductor structure and method for forming dual-damascene structure
12/05/2012CN102005396B Bump making method and bump structure
12/05/2012CN101997010B Digital X-ray detection panel and manufacturing method thereof
12/05/2012CN101989589B Power device package and method of fabricating the same
12/05/2012CN101969070B Active element array substrate and manufacturing method thereof
12/05/2012CN101908490B Circuit substrate module with heat radiator and production method thereof
12/05/2012CN101887871B Chip packaging structure, chip packaging mould and chip packaging technology
12/05/2012CN101861647B Process for producing substrate for power module, substrate for power module, and power module
12/05/2012CN101846298B Lamp heat-radiating device
12/05/2012CN101821415B Metal-graphite composite material having high thermal conductivity and method for producing the same
12/05/2012CN101792520B Low-corrosive epoxy resins and production method thereof
12/05/2012CN101784579B One-pack type epoxy resin composition and use thereof
12/05/2012CN101764123B Millimeter wave transmission line for slow phase velocity and operation method thereof
12/05/2012CN101764121B Interlayer insulated stacked composite material and preparation method thereof
12/05/2012CN101752339B Pad connecting structure, lead wire jointing structure and encapsulating structure
12/05/2012CN101714823B Power transducer
12/05/2012CN101685811B Substrate based unmolded package
12/05/2012CN101675518B Power lead-on-chip ball grid array package
12/05/2012CN101657899B 功率半导体模块 Power semiconductor module
12/05/2012CN101604670B Grid welding spot structure for preventing metal layers from shedding in chip pressure welding and forming method thereof
12/05/2012CN101577262B Power semiconductor module system
12/05/2012CN101562193B Organic electroluminescence apparatus
12/05/2012CN101546802B Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
12/05/2012CN101484989B Applications of smart polymer composites to integrated circuit packaging
12/05/2012CN101404862B Electronic circuit device and method of making the same
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