Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/06/2012US20120307544 Semiconductor memory apparatus
12/06/2012US20120306328 Semiconductor device and driving apparatus including semiconductor device
12/06/2012US20120306107 Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet
12/06/2012US20120306106 Semiconductor device having dummy pattern and design method thereof
12/06/2012US20120306105 Multi-Component Power Structures and Methods For Forming The Same
12/06/2012US20120306104 Semiconductor Device and Method of Forming Interconnect Structure With Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties
12/06/2012US20120306103 Stacked electronic component and manufacturing method thereof
12/06/2012US20120306102 Integrated circuit packaging system with package stacking and method of manufacture thereof
12/06/2012US20120306101 Semiconductor device
12/06/2012US20120306100 Semiconductor device and method of manufacturing the same
12/06/2012US20120306099 Multilayered board semiconductor device with bga package
12/06/2012US20120306098 Curing Low-k Dielectrics for Improving Mechanical Strength
12/06/2012US20120306097 Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP
12/06/2012US20120306096 Method and model of carbon nanotube based through silicon vias (tsv) for rf applications
12/06/2012US20120306095 Semiconductor package and fabrication method of the same
12/06/2012US20120306094 Signal routing using through-substrate vias
12/06/2012US20120306093 Converting metal mask to metal-oxide etch stop layer and related semiconductor structure
12/06/2012US20120306092 Conductive pads defined by embedded traces
12/06/2012US20120306091 Connecting System for Electrically Connecting Electronic Devices and Method for Connecting an Electrically Conductive First Connector and Electrically Conductive Second Connector
12/06/2012US20120306090 Conductive structures, systems and devices including conductive structures and related methods
12/06/2012US20120306089 Apparatuses including stair-step structures and methods of forming the same
12/06/2012US20120306088 Method and system for internal layer-layer thermal enhancement
12/06/2012US20120306087 Semiconductor device including excess solder
12/06/2012US20120306086 Semiconductor device and wiring substrate
12/06/2012US20120306085 Protective layer for protecting tsv tips during thermo-compressive bonding
12/06/2012US20120306084 Semiconductor Constructions Having Through-Substrate Interconnects, and Methods of Forming Through-Substrate Interconnects
12/06/2012US20120306083 Semiconductor integrated circuit with multi-cut via and automated layout method for the same
12/06/2012US20120306082 Semiconductor device and structure for heat removal
12/06/2012US20120306081 Semiconductor device and semiconductor device manufacturing method
12/06/2012US20120306080 Packaging Structures and Methods
12/06/2012US20120306079 Semiconductor device
12/06/2012US20120306078 Exposed interconnect for a package on package system
12/06/2012US20120306077 Semiconductor device
12/06/2012US20120306076 Semiconductor Micro-Connector With Through-Hole Via and a Method for Making the Same
12/06/2012US20120306075 Semiconductor package apparatus
12/06/2012US20120306074 Semiconductor chip having bump electrode, semiconductor device having the semiconductor chip, and method for manufacturing the semiconductor device
12/06/2012US20120306073 Connector Design for Packaging Integrated Circuits
12/06/2012US20120306072 Semiconductor Wafer with Reduced Thickness Variation and Method for Fabricating Same
12/06/2012US20120306071 Wafer-level package device
12/06/2012US20120306070 Electrical Connection for Chip Scale Packaging
12/06/2012US20120306069 Electronic module
12/06/2012US20120306068 Semiconductor device fabrication method and semiconductor device
12/06/2012US20120306067 Thermally Enhanced Integrated Circuit Package
12/06/2012US20120306066 Electronic device including a packaging substrate having a trench
12/06/2012US20120306065 Semiconductor package with pre-soldered grooves in leads
12/06/2012US20120306064 Chip package
12/06/2012US20120306063 High-frequency module manufacturing method
12/06/2012US20120306062 Semiconductor device, semiconductor package, and electronic device
12/06/2012US20120306061 Apparatus and Method for Grounding an IC Package Lid for EMI Reduction
12/06/2012US20120306059 Selective wet etching of hafnium aluminum oxide films
12/06/2012US20120306048 Electrically programmable metal fuse
12/06/2012US20120305977 Interposer and manufacturing method thereof
12/06/2012US20120305931 Gold-free ohmic contacts
12/06/2012US20120305917 Semiconductor device
12/06/2012US20120305916 Interposer Test Structures and Methods
12/06/2012US20120305305 Electronic component including micro balls
12/06/2012US20120305226 Electric machine module cooling system and method
12/06/2012US20120304773 Estimation of presence of void in through silicon via (tsv) based on ultrasound scanning
12/06/2012DE202012010600U1 Kühlkörper Heat Sink
12/06/2012DE112011100378T5 Phenolische Verbindung, Epoxyharz, Epoxyharz-Zusammensetzung, Prepreg, und gehärtetes Produkt daraus Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
12/06/2012DE112008000371B4 Halbleiterelement-Struktur mit Latentwärmespeichermaterial Semiconductor element structure with latent heat storage material
12/06/2012DE112004002121B4 Kühlsystem, Computerbaugruppe und Verfahren zum Kühlen einer elektronischen Komponente Cooling system, computer module and method for cooling an electronic component
12/06/2012DE10349163B4 Drucksensorvorrichtung mit Temperatursensor Pressure sensor device with temperature sensor
12/06/2012DE10245179B4 Leitungen auf mehreren Ebenen mit reduziertem Rasterabstand und Verfahren zur Herstellung Lines on several levels with a reduced pitch and methods for preparing
12/06/2012DE102012209284A1 Halbleitervorrichtung Semiconductor device
12/06/2012DE102012208246A1 Halbleitervorrichtung Semiconductor device
12/06/2012DE102012208146A1 Verbindungssystem zur herstellung elektrischer verbindungen eines leistungshalbleitermoduls und verfahren zur herstellung solcher verbindungen A connection system for making electrical connections of the power semiconductor module and process for the preparation of such compounds
12/06/2012DE102012104377A1 Halbleitervorrichtung und Antriebsvorrichtung, die eine Halbleitervorrichtung aufweist Semiconductor device and drive device comprising a semiconductor device
12/06/2012DE102012104376A1 Halbleitermodul und Antriebsvorrichtung, die ein Halbeitermodul aufweist Semiconductor module and the drive device, comprising a semiconductor module
12/06/2012DE102012104345A1 Halbleitervorrichtung, Halbleitergehäuse und elektronische Vorrichtung A semiconductor device, semiconductor packages and electronic device
12/06/2012DE102011103746A1 Verfahren zum Fügen von Metall-Keramik-Substraten an Metallkörpern A method for joining metal-ceramic substrates in metal bodies
12/06/2012DE102011103516A1 Method for filling cavity within micro-electro mechanical system (MEMS) component e.g. microphone, involves forming aperture in the sealing layer using pulsed laser beam so as to open the closed cavity
12/06/2012DE102011076900A1 Method for moving electrical conductive cell contact tapes to e.g. photovoltaic thin layer solar cell modules, involves cutting-off tapes in initial position of head unit, so that renewed release of tapes is carried-out over moving length
12/06/2012DE102011076774A1 Semiconductor component for use in e.g. power electronic area, has solderable layers formed at surfaces of carrier and cooling body, respectively, where surfaces of carrier and body face body and carrier, respectively
12/06/2012DE102011076750A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements Optoelectronic component and method of manufacturing an optoelectronic component
12/06/2012DE102011076742A1 Verfahren zum Ablegen einer Halbleiterscheibe auf einem Suszeptor mit einer vorgegebenen Winkelorientierung A method for depositing a semiconductor wafer on a susceptor at a predetermined angular orientation
12/06/2012DE102011076662A1 Halbleiterbauelement und entsprechendes Herstellungsverfahren Semiconductor component and corresponding production method
12/06/2012DE102010017768B4 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device
12/06/2012DE102009044494B4 Halbleiterdiode und Brückenschaltung Semiconductor diode and bridge circuit
12/06/2012DE102008025223B4 Elektronikbaugruppe mit eingebettetem Chipbaustein und Verfahren zu ihrer Herstellung Electronic assembly with embedded chip package and process for its preparation
12/06/2012DE102006005271B4 Halbleitervorrichtung unter Verwendung einer Lötlegierung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device using a solder alloy and method of manufacturing a semiconductor device
12/06/2012DE102005046710B4 Verfahren zur Herstellung einer Bauelementanordnung mit einem Träger und einem darauf montierten Halbleiterchip A method of manufacturing a component assembly comprising a support and a semiconductor chip mounted thereon
12/06/2012DE102005012218B4 Halbleiterbauelement sowie Kühlkörperelement für ein Halbleiterbauelement Semiconductor device and heat sink member for a semiconductor device
12/06/2012DE10063041B4 Verfahren zum Herstellen einer integrierten Leadless-Gehäuse-Schaltung und integrierte Leadless-Gehäuse-Schaltung A method of fabricating an integrated circuit leadless package and integrated circuit leadless housing
12/05/2012EP2530712A2 Power converter and method for manufacturing power converter
12/05/2012EP2530711A1 Power semiconductor arrangement
12/05/2012EP2530710A2 Bonding wire, connection structure, semiconductor device and manufacturing method of same
12/05/2012EP2530709A1 Semiconductor wafer and method of producing the same
12/05/2012EP2530708A1 Flip-chip mounting structure and flip-chip mounting method
12/05/2012EP2530707A2 Method for joining metal-ceramic substrates to metal bodies
12/05/2012EP2530377A1 Cooling system for a light
12/05/2012EP2530123A2 Curable composition
12/05/2012EP2530122A2 Curable composition
12/05/2012EP2530105A1 Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet
12/05/2012EP2530104A2 Silicone resin
12/05/2012EP2530103A1 Polyimide resin composition, adhesive agent and laminate each comprising same, and device
12/05/2012EP2529420A1 Metal based electronic component package and the method of manufacturing the same
12/05/2012EP2529398A1 Improving the evenness by means of cutouts on the embossing points
12/05/2012EP2529395A1 Method for improving plating on non-concuctive substrates
12/05/2012EP2529325A2 Method and apparatus for interconnect layout in an integrated circuit
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