| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/14/2015 | CN104284557A 散热装置 Cooling devices |
| 01/14/2015 | CN104283554A 时钟调整电路与存储器储存装置 Clock adjustment circuit and memory storage device |
| 01/14/2015 | CN104283406A 一种mcm封装的电源模块及制备方法 One kind mcm encapsulated power modules and preparation methods |
| 01/14/2015 | CN104282679A 带有功率半导体的电子组件 Electronic assembly with power semiconductors |
| 01/14/2015 | CN104282677A 一种快恢复二极管模块 In fast recovery diode module |
| 01/14/2015 | CN104282668A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282667A 一种mos 静电保护结构及保护方法 One kind mos electrostatic protection structure and protection methods |
| 01/14/2015 | CN104282666A 电气信号传输装置及集成电路 Electrical signal transmission device and IC |
| 01/14/2015 | CN104282665A 高压静电保护结构 High-voltage electrostatic protection structure |
| 01/14/2015 | CN104282664A 具有屏蔽结构的半导体装置 A semiconductor device having a shield structure |
| 01/14/2015 | CN104282663A 太阳能电池及其模组 Solar cell and module |
| 01/14/2015 | CN104282662A 等离子损伤测试结构以及等离子损伤测试方法 Plasma damage test structures and plasma damage test methods |
| 01/14/2015 | CN104282661A 集成电路中可靠性分析的测试结构及其测试方法 IC test structures and test methods in reliability analysis |
| 01/14/2015 | CN104282660A 测试结构及其形成方法、测试方法 Test structure and method of forming the test method |
| 01/14/2015 | CN104282659A 测试结构及测试方法、对应的晶圆、熔丝的激光切割方法 Test structures and test methods, corresponding to the wafer, the laser fuse cutting method |
| 01/14/2015 | CN104282658A 半导体元件 Semiconductor device |
| 01/14/2015 | CN104282657A 超薄多层封装体及其制作方法 Ultrathin multilayer package and fabrication method thereof |
| 01/14/2015 | CN104282656A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282655A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282654A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282653A 管芯堆积方法及利用其的半导体封装 Die stacking method and a semiconductor package using its |
| 01/14/2015 | CN104282652A 具有源极向下和感测配置的半导体裸片和封装体 Having a source semiconductor die and package pole down and sensing configurations |
| 01/14/2015 | CN104282651A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282650A 具有坝体结构的中介层上管芯组件及其制造方法 Die assembly and method of manufacturing the interposer having a dam structure |
| 01/14/2015 | CN104282649A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282648A 半导体装置及其制法 Semiconductor device Jiqizhifa |
| 01/14/2015 | CN104282647A 高功率半导体模块 High power semiconductor module |
| 01/14/2015 | CN104282646A 半导体器件 Semiconductor devices |
| 01/14/2015 | CN104282645A 沟渠式功率半导体器件及其制作方法 Trench type power semiconductor device and manufacturing method |
| 01/14/2015 | CN104282644A 一种可编程硅通孔结构及其制备方法 A silicone via structure and preparation method Programmable |
| 01/14/2015 | CN104282643A 基于tec的微型传感器温控系统 Tec micro-sensors based temperature control system |
| 01/14/2015 | CN104282642A 一种水冷散热装置 One kind of water cooling device |
| 01/14/2015 | CN104282641A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282640A 半导体芯片与具有该半导体芯片的层叠型半导体封装 The semiconductor chip and the multilayer semiconductor package having the semiconductor chip |
| 01/14/2015 | CN104282639A 散热器 Heat sink |
| 01/14/2015 | CN104282638A 间歇工作型cpu散热器 Intermittent type cpu heatsink |
| 01/14/2015 | CN104282637A 倒装芯片半导体封装结构 Flip-chip semiconductor package structure |
| 01/14/2015 | CN104282636A 一种使用热管的压接式igbt封装结构 A method of using a heat pipe crimping igbt package structure |
| 01/14/2015 | CN104282635A 具有互锁连接的半导体模块 Interlocking connection of the semiconductor module having |
| 01/14/2015 | CN104282634A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282633A 半导体封装件及制法与半导体结构暨半导体基板及制法 The semiconductor package and manufacturing method of the semiconductor substrate and a semiconductor structure and manufacturing method cum |
| 01/14/2015 | CN104282632A 基于lcp基板的封装外壳及制备方法 Based on the package housing and substrate preparation lcp |
| 01/14/2015 | CN104282631A 一种新型指纹传感器注胶结构 A new fingerprint sensor dispensing structure |
| 01/14/2015 | CN104282590A 半导体晶粒及其制备方法和检测该半导体晶粒裂缝的方法 Semiconductor die and its preparation method and a method to detect cracks in the semiconductor die |
| 01/14/2015 | CN104282580A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN104282578A 内嵌式封装体工艺及其结构 Embedded technology package and its structure |
| 01/14/2015 | CN104282577A 用于在半导体衬底上产生接触区的方法 The method of generating the contact area on the semiconductor substrate for |
| 01/14/2015 | CN104282237A 一种led集成像素封装模组及其高清显示屏 One kind of led module and integrated package pixel HD display |
| 01/14/2015 | CN104281010A 形成方法和基板 Formation method and substrate |
| 01/14/2015 | CN104280614A 测量mos器件侧墙厚度相关参数的结构和方法 Structures and methods of measuring the thickness of the sidewall mos device-related parameters |
| 01/14/2015 | CN104277417A 包含复合阻燃剂的环氧树脂组合物 The epoxy resin composition comprises a composite flame retardant |
| 01/14/2015 | CN102906309B 防银变色剂、防银变色树脂组合物、防银变色方法、及使用该防银变色剂的发光二极管 Anti-tarnishing agents, anti-silver color resin composition, anti-silver color method, and the use of the anti-tarnishing agent emitting diodes |
| 01/14/2015 | CN102856294B 单芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 After etching the first single-chip package being installed base island buried package structure and its manufacturing method |
| 01/14/2015 | CN102832182B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 01/14/2015 | CN102769016B 一种抗辐射的cmos器件及其制备方法 Cmos devices, an anti-radiation and its preparation method |
| 01/14/2015 | CN102768965B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/14/2015 | CN102738119B 用于半导体衬底的贯穿硅通孔及其生产方法 Through silicon vias for semiconductor substrate and its production method |
| 01/14/2015 | CN102651359B 具有低阻值基材与低功率损耗的半导体结构 A semiconductor structure having low resistance and low power loss substrate |
| 01/14/2015 | CN102610585B 一种封装硅芯片的方法及其形成的电子元件 A method of encapsulating the silicon chip and the electronic component is formed |
| 01/14/2015 | CN102474988B 电子元件单元和加强粘合剂 The electronic component element and the strengthening adhesive |
| 01/14/2015 | CN102412210B 流固耦合散热器及散热方法 Radiator and cooling fluid-solid coupling method |
| 01/14/2015 | CN102254878B 半导体装置 Semiconductor device |
| 01/14/2015 | CN102130046B 用于镶嵌互连件中的电迁移电阻改进的界面层 Damascene interconnect member for electromigration resistance improved interfacial layer |
| 01/14/2015 | CN101509653B 带有风扇的大功率led灯结构 High power led lamp structure with fan |
| 01/13/2015 | US8935143 Semiconductor sensor reliability |
| 01/13/2015 | US8934277 Semiconductor system with at least one three-level electric power inverter circuit |
| 01/13/2015 | US8934259 Substrates with transferable chiplets |
| 01/13/2015 | US8934250 Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
| 01/13/2015 | US8934249 Electronic device with heat dissipation assembly |
| 01/13/2015 | US8934245 Heat conveying structure for electronic device |
| 01/13/2015 | US8934053 Hand-held quad core processing apparatus |
| 01/13/2015 | US8934027 Portable device with image sensors and multi-core processor |
| 01/13/2015 | US8933747 Semiconductor chip package including voltage generation circuit with reduced power noise |
| 01/13/2015 | US8933570 Three dimensional structure memory |
| 01/13/2015 | US8933569 Pressure contact arrangement and method for producing a pressure contact arrangement |
| 01/13/2015 | US8933568 Semiconductor device |
| 01/13/2015 | US8933567 Electrically broken, but mechanically continuous die seal for integrated circuits |
| 01/13/2015 | US8933565 Integrated circuit wiring fabrication and related methods and apparatus |
| 01/13/2015 | US8933564 Landing structure for through-silicon via |
| 01/13/2015 | US8933563 Three-dimension circuit structure and semiconductor device |
| 01/13/2015 | US8933562 In-situ thermoelectric cooling |
| 01/13/2015 | US8933561 Semiconductor device for semiconductor package having through silicon vias of different heights |
| 01/13/2015 | US8933560 Semiconductor device |
| 01/13/2015 | US8933559 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules |
| 01/13/2015 | US8933558 Semiconductor package, wiring board unit, and electronic apparatus |
| 01/13/2015 | US8933557 Semiconductor module and cooling unit |
| 01/13/2015 | US8933556 Wiring board |
| 01/13/2015 | US8933555 Semiconductor chip package |
| 01/13/2015 | US8933554 Semiconductor device and method for manufacturing semiconductor device |
| 01/13/2015 | US8933553 Semiconductor unit |
| 01/13/2015 | US8933552 Semiconductor package |
| 01/13/2015 | US8933551 3D-packages and methods for forming the same |
| 01/13/2015 | US8933550 Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors |
| 01/13/2015 | US8933549 Dual-leadframe multi-chip package |
| 01/13/2015 | US8933548 Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
| 01/13/2015 | US8933547 Lead frame with power bar for semiconductor device |
| 01/13/2015 | US8933546 Electronic assembly with improved thermal management |
| 01/13/2015 | US8933545 Double-side exposed semiconductor device |
| 01/13/2015 | US8933544 Integrated circuit stack with integrated electromagnetic interference shielding |
| 01/13/2015 | US8933543 Nitride semiconductor element having m-plane angled semiconductor region and electrode including Mg and Ag |