| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/12/2012 | CN102034779B Chip design with robust corner bumps |
| 12/12/2012 | CN102024820B Memory cell and manufacture method thereof and memory structure |
| 12/12/2012 | CN101989604B 存储器元件 Memory elements |
| 12/12/2012 | CN101989593B Packaging substrate as well as manufacturing method and packaging structure thereof |
| 12/12/2012 | CN101964333B Wirebond structures |
| 12/12/2012 | CN101925534B Siliceous powder, process for production of the same, and use thereof |
| 12/12/2012 | CN101924027B Metal gate transistor, integrated circuits, systems, and fabrication methods thereof |
| 12/12/2012 | CN101878528B Electronic circuit composed of sub-circuits and method for producing the same |
| 12/12/2012 | CN101872774B Solid-state imaging device and imaging apparatus |
| 12/12/2012 | CN101866919B 集成电路结构 Integrated circuit structure |
| 12/12/2012 | CN101826511B 静电保护电路 Electrostatic protection circuit |
| 12/12/2012 | CN101792113B Method and apparatus for protecting wiring and integrated circuit device |
| 12/12/2012 | CN101740473B Interlayer dielectric layer, interconnection structure and manufacturing method thereof |
| 12/12/2012 | CN101702400B Circuit substrate and technology thereof |
| 12/12/2012 | CN101699623B 半导体装置 Semiconductor device |
| 12/12/2012 | CN101677101B Integrated circuit with decoupling capacity |
| 12/12/2012 | CN101641786B Heat sink, and assembly or module unit comprising a heat sink |
| 12/12/2012 | CN101640974B Printed circuit board and method for manufacturing the same |
| 12/12/2012 | CN101626027B Electronic device package with electromagnetic compatibility (emc) coating thereon |
| 12/12/2012 | CN101604672B Constant current and voltage controller carrying out pin multiplexing and a three-pin package |
| 12/12/2012 | CN101601134B Chip on leads |
| 12/12/2012 | CN101548380B Twin chip-mounted diode |
| 12/12/2012 | CN101521218B 影像显示系统 Image display system |
| 12/12/2012 | CN101471626B Method and system supporting production of a semiconductor device using a plurality of fabrication processes |
| 12/12/2012 | CN101471345B Semiconductor device and photomask |
| 12/12/2012 | CN101465379B Semiconductor device and method for manufacturing the device |
| 12/12/2012 | CN101400245B Electronic component cooling apparatus |
| 12/12/2012 | CN101246894B Photoelectric conversion device and electronic device, and method for manufacturing photoelectric conversion device |
| 12/12/2012 | CN101245173B Epoxy resin electronic packaging material and electronic component packaged with the same |
| 12/12/2012 | CN101023525B Semiconductor integrated circuit including metal mesh structure |
| 12/11/2012 | US8331122 Semiconductor device and information processing system including the same |
| 12/11/2012 | US8331121 Multi-chip packages providing reduced signal skew and related methods of operation |
| 12/11/2012 | US8331102 Printed circuit board |
| 12/11/2012 | US8331094 Thermal and power bus stacked package architecture |
| 12/11/2012 | US8331092 Cooling apparatus for semiconductor element |
| 12/11/2012 | US8331062 Magneto-resistance effect element, magnetic head, magnetic recording/reproducing device and magnetic memory |
| 12/11/2012 | US8330281 Overlay marks, methods of overlay mark design and methods of overlay measurements |
| 12/11/2012 | US8330278 Semiconductor package including a plurality of stacked semiconductor devices |
| 12/11/2012 | US8330277 Semiconductor element built-in device |
| 12/11/2012 | US8330276 Semiconductor device and method for manufacturing the same |
| 12/11/2012 | US8330275 Interconnect structure for semiconductor devices |
| 12/11/2012 | US8330274 Semiconductor structure and method for making same |
| 12/11/2012 | US8330273 Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip |
| 12/11/2012 | US8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors |
| 12/11/2012 | US8330271 Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon |
| 12/11/2012 | US8330270 Integrated circuit package having a plurality of spaced apart pad portions |
| 12/11/2012 | US8330269 Semiconductor device and method |
| 12/11/2012 | US8330268 Semiconductor package and manufacturing method thereof |
| 12/11/2012 | US8330267 Semiconductor package |
| 12/11/2012 | US8330266 Semiconductor device |
| 12/11/2012 | US8330265 RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks |
| 12/11/2012 | US8330264 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers |
| 12/11/2012 | US8330262 Processes for enhanced 3D integration and structures generated using the same |
| 12/11/2012 | US8330261 Method to manufacture a silicon wafer electronic component protected against the attacks and such a component |
| 12/11/2012 | US8330260 Electronic component of VQFN design and method for producing the same |
| 12/11/2012 | US8330259 Antenna in package with reduced electromagnetic interaction with on chip elements |
| 12/11/2012 | US8330258 System and method for improving solder joint reliability in an integrated circuit package |
| 12/11/2012 | US8330255 Semiconductor chip |
| 12/11/2012 | US8330254 Semiconductor device |
| 12/11/2012 | US8330253 Semiconductor device |
| 12/11/2012 | US8330250 P-I-N diode crystallized adjacent to a silicide in series with a dielectric material |
| 12/11/2012 | US8330249 Semiconductor device with driver circuit and memory element |
| 12/11/2012 | US8330234 Semiconductor device and manufacturing process therefor |
| 12/11/2012 | US8330189 One-time programmable memory and method for making the same |
| 12/11/2012 | US8330188 Semiconductor device |
| 12/11/2012 | US8330160 Random number generating device |
| 12/11/2012 | US8330159 Mask design elements to aid circuit editing and mask redesign |
| 12/11/2012 | US8330158 Generating an integrated circuit identifier |
| 12/11/2012 | US8329581 Microelectronic packages and methods therefor |
| 12/11/2012 | US8329579 Through substrate VIAS |
| 12/11/2012 | US8329572 Semiconductor device and method for fabricating the same |
| 12/11/2012 | US8329502 Conformal coating of highly structured surfaces |
| 12/11/2012 | US8328601 Apparatus for grinding heated plane of cooler |
| 12/11/2012 | US8327922 Heat sink and method for manufacturing the same |
| 12/11/2012 | US8327540 Patterned structure for a thermal interface |
| 12/06/2012 | WO2012167027A2 Protective layer for protecting tsv tips during thermo-compressive bonding |
| 12/06/2012 | WO2012166911A2 Low void solder joint for multiple reflow applications |
| 12/06/2012 | WO2012166405A1 Low temperature co-fired ceramic structure for high frequency applications and process for making same |
| 12/06/2012 | WO2012165691A1 Stereoscopic image sensor package and method for manufacturing same |
| 12/06/2012 | WO2012165598A1 Laminated module and interposer used in same |
| 12/06/2012 | WO2012165594A1 Laminated module and interposer used in same |
| 12/06/2012 | WO2012165559A1 Mounting structure of laminated module using interposer |
| 12/06/2012 | WO2012165434A1 Element housing package, component for semiconductor device, and semiconductor device |
| 12/06/2012 | WO2012165413A1 Epoxy resin composition, cured product, and optical semiconductor encapsulation material |
| 12/06/2012 | WO2012165317A1 Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film |
| 12/06/2012 | WO2012165265A1 Substrate, method for producing same, heat-releasing substrate, and heat-releasing module |
| 12/06/2012 | WO2012165239A1 Liquid resin composition and semiconductor device using same |
| 12/06/2012 | WO2012165206A1 Resin composition for sealing electric/electronic component, method for manufacturing electric/electronic component, and electric/electronic component sealed body |
| 12/06/2012 | WO2012165111A1 Method for producing multi-layer substrate and multi-layer substrate |
| 12/06/2012 | WO2012165045A1 Semiconductor device and wiring substrate |
| 12/06/2012 | WO2012165012A1 Resin composition |
| 12/06/2012 | WO2012164865A1 Bonded structure |
| 12/06/2012 | WO2012164340A1 Integrated circuit device and method of enabling thermal regulation within an integrated circuit device |
| 12/06/2012 | WO2012164216A1 Method for manufacturing flexible functional substrates |
| 12/06/2012 | WO2012163599A1 Semiconductor component and corresponding production method |
| 12/06/2012 | WO2012163100A1 Semiconductor chip and storage device |
| 12/06/2012 | WO2012134710A8 Semiconductor chip with supportive terminal pad |
| 12/06/2012 | WO2012103992A3 Pulse-controlled inverter with a cooled shunt resistor, and electrical drive system having a pulse-controlled inverter with a cooled shunt resistor |
| 12/06/2012 | US20120309203 Plasma etching method and storage medium |
| 12/06/2012 | US20120308831 Epoxy resin composition |