Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/13/2012US20120313116 Liquid Crystal Display and Chip On Film Thereof
12/13/2012US20120313094 Semiconductor device and manufacturing method thereof
12/13/2012US20120312947 Adjustable mount for supporting solar panel and angle-adjusting method therefor
12/13/2012US20120312372 Glass compositions used in conductors for photovoltaic cells
12/13/2012DE102012209641A1 Wärmeabgabeeinrichtung Heat dissipation device
12/13/2012DE102011077188A1 Layer structure i.e. prefabricated component, for contacting e.g. motor with connection line in onboard network of motor car, has conductor contactable with layer contact region on surface of layer i.e. polyurethane film
12/13/2012DE102010033284B4 Verfahren zum Herstellen einer Bauelementanordnung sowie mittels des Verfahrens hergestellte Bauelementanordnung A method of manufacturing a component arrangement and produced by the method of component assembly
12/13/2012DE102010005771B4 Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit Modular metal band method for its manufacture and components with improved flatness
12/13/2012DE102008019407B4 Leistungshalbleitermodul The power semiconductor module
12/13/2012DE102008017553B4 Elektronisches System An electronic system
12/12/2012EP2533311A1 Substrate for mounting light-emitting element, and light-emitting device
12/12/2012EP2533291A2 Semiconductor device and method of manufacturing the same
12/12/2012EP2533285A1 Stack of electronic components held in a pressed stack
12/12/2012EP2533284A2 Power semiconductor package with double-sided cooling
12/12/2012EP2533282A2 Modular heat sink
12/12/2012EP2533281A1 Heat radiation device and electronic equipment using the same
12/12/2012EP2533280A2 Semiconductor device
12/12/2012EP2533277A2 Semiconductor device
12/12/2012EP2532693A1 Curable epoxy resin composition
12/12/2012EP2532453A1 Method for assembling a heat sink on a power electronic component and machine implementing the method
12/12/2012EP2532027A2 Semiconductor device with a variable integrated circuit chip bump pitch
12/12/2012EP2532026A1 Heat exchanger, notably for a power semiconductor
12/12/2012EP2532025A1 Moisture barrier potting compound
12/12/2012EP2532023A1 Surface preparation of die for improved bonding strength
12/12/2012EP2531885A1 Strengthened structural module and method of fabrication
12/12/2012CN202603124U Composite heat conducting structure in electronic machine shell
12/12/2012CN202603022U Fluorescent lamp ballast chip based on system-level packaging
12/12/2012CN202601613U Novel rectifier bridge for soybean milk makers
12/12/2012CN202601610U Semiconductor device
12/12/2012CN202601609U Superposed power module structure
12/12/2012CN202601608U Semiconductor packaging structure and module thereof
12/12/2012CN202601607U Heat radiator
12/12/2012CN202601606U Combined heat-conducting fin
12/12/2012CN202601605U Heat radiation system
12/12/2012CN202601604U Bolt type high-voltage thyristor
12/12/2012CN1923939B Semiconductor device, adhesive, and adhesive film
12/12/2012CN1919849B Method for producing a purified borazine compound, method for filling a container with a borazine compound and container for preserving a borazine compound
12/12/2012CN102822986A Solar cell assembly with solder lug
12/12/2012CN102822976A Self-aligned contacts for field effect transistor devices
12/12/2012CN102822966A Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
12/12/2012CN102822965A Thermal vias in an integrated circuit package with an embedded die
12/12/2012CN102822964A On-Gate contacts in a MOS device
12/12/2012CN102822963A Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
12/12/2012CN102822962A Interposer and electronic device using same
12/12/2012CN102822961A Circuit board, semiconductor device, manufacturing method for circuit board, and manufacturing method for semiconductor device
12/12/2012CN102822958A Semiconductor device and method for manufacturing same
12/12/2012CN102822953A Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit
12/12/2012CN102822945A Wiring structure, display device and semiconductor device
12/12/2012CN102822942A Backside dummy plugs for 3d integration
12/12/2012CN102822745A Photosensitive resin composition and light receiving device
12/12/2012CN102822271A Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
12/12/2012CN102821873A Method for the application of a conformal nanocoating by means of a low pressure plasma process
12/12/2012CN102821582A Cooling module and electronic device equipped with same
12/12/2012CN102821545A Multilayer wiring board, manufacturing method thereof, and semiconductor device
12/12/2012CN102820308A Dual-waveband linear infrared focal plane detector integrated structure
12/12/2012CN102820288A 功率模块及其制造方法 And a method of manufacturing a power module
12/12/2012CN102820286A Structure for improving performance of passive device of power integrated circuit
12/12/2012CN102820285A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/12/2012CN102820284A Semiconductor device and manufacturing method for semiconductor device
12/12/2012CN102820283A 半导体器件 Semiconductor devices
12/12/2012CN102820282A 3D integration microelectronic assembly for integrated circuit devices and method of making same
12/12/2012CN102820281A 3D integration microelectronic assembly for integrated circuit devices and method of making same
12/12/2012CN102820280A Non-hierarchical metal layers for integrated circuits
12/12/2012CN102820279A Vertically mutual crossing semiconductor capacitor
12/12/2012CN102820278A Multi-chip quad flat no lead (QFN) packing structure
12/12/2012CN102820277A Copper-covered ceramic substrate structure of IGBT (Insulated Gate Bipolar Translator) module
12/12/2012CN102820276A QFN package and manufacturing process thereof
12/12/2012CN102820275A Wafer-level package device
12/12/2012CN102820274A 3D Integrated Microelectronic Assembly With Stress Reducing Interconnects And Method Of Making Same
12/12/2012CN102820273A Refrigerating system for CCD (Charge Coupled Device) detector
12/12/2012CN102820272A Packaging structure embedded with electronic elements and method of fabricating the same
12/12/2012CN102820271A 半导体装置 Semiconductor device
12/12/2012CN102820270A Package substrate and fabrication method thereof
12/12/2012CN102820269A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/12/2012CN102820268A Bonding structure and preparation method thereof
12/12/2012CN102820267A Bolt type semiconductor packaging stacking structure
12/12/2012CN102820264A Chip package structure and manufacturing method thereof
12/12/2012CN102820259A Semiconductor device and method of forming a power MOSFET
12/12/2012CN102820258A Method for copper dual damascene structure having ultralow dielectric constant layer
12/12/2012CN102820257A Through silicon via structure and method
12/12/2012CN102820239A Detection method for predetermined lines of division
12/12/2012CN102820233A Surface-mounted power diode packaging technology
12/12/2012CN102819975A Braille display device based on temperature control
12/12/2012CN102819759A Stripe for non-contact big-chip smart card
12/12/2012CN102817055A Ultrathin palladium plating and gold plating process for lead wire frame
12/12/2012CN102817052A Electroplating mold for electroplating with characteristics of high precision and selectivity
12/12/2012CN102816552A Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof
12/12/2012CN102208384B A semiconductor structure and a forming method for a semiconductor device
12/12/2012CN102208370B Silicon wafer with glass layer formed on surface and manufacture method thereof
12/12/2012CN102148169B Silicon carbide power module and packaging method thereof
12/12/2012CN102142411B Chip packaging component of printed circuit board assembly (PCBA) and welding component
12/12/2012CN102130080B Heat radiation device
12/12/2012CN102110672B Chip-stacked package structure and method for manufacturing the same
12/12/2012CN102110666B Integrated circuit chip package and physical layer interface arrangement
12/12/2012CN102104028B Semiconductor plastic-sealed body and layered scanning method
12/12/2012CN102097324B Semiconductor component and manufacturing method thereof
12/12/2012CN102054809B Re-distribution mechanism
12/12/2012CN102054708B Method for forming window ball grid array encapsulated pre-substrate
12/12/2012CN102034830B Memorizer with disabling circuit and method for disabling memorizer
12/12/2012CN102034799B Chip package and fabrication method thereof
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