Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/19/2012CN101866891B 半导体电路 Semiconductor circuit
12/19/2012CN101847610B 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/19/2012CN101800209B Flip chip mounted semiconductor device package having a dimpled leadframe
12/19/2012CN101796634B Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
12/19/2012CN101740408B Manufacture method of windowing-type semiconductor packaging member
12/19/2012CN101673723B A semiconductor device package using discrete conductive layer to re-select bonding line path
12/19/2012CN101540289B Semiconductor integrated circuit package and method and mould for packaging semiconductor integrated circuit
12/19/2012CN101454895B 半导体输入控制装置 The semiconductor input control device
12/19/2012CN101364590B Fuse circuit
12/18/2012US8335083 Apparatus and method for thermal management using vapor chamber
12/18/2012US8334601 Package-on-package system with through vias and method of manufacture thereof
12/18/2012US8334600 Low-noise flip-chip packages and flip chips thereof
12/18/2012US8334599 Electronic device having a chip stack
12/18/2012US8334598 Power semiconductor device and manufacturing method therefor
12/18/2012US8334597 Semiconductor device having via connecting between interconnects
12/18/2012US8334596 Semiconductor device including coupling ball with layers of aluminum and copper alloys
12/18/2012US8334595 Silicon contactor including plate type powders for testing semiconductor device
12/18/2012US8334594 Chip having a metal pillar structure
12/18/2012US8334593 Semiconductor device package
12/18/2012US8334592 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
12/18/2012US8334591 Semiconductor device and method of manufacturing the same
12/18/2012US8334590 Semiconductor device having insulating and interconnection layers
12/18/2012US8334589 Power block and power semiconductor module using same
12/18/2012US8334588 Circuit component with conductive layer structure
12/18/2012US8334587 Semiconductor light emitting device with first and second leads
12/18/2012US8334586 Stacked semiconductor chips with separate encapsulations
12/18/2012US8334585 LED package and fabrication method thereof
12/18/2012US8334584 Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof
12/18/2012US8334583 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
12/18/2012US8334582 Protective seal ring for preventing die-saw induced stress
12/18/2012US8334580 Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
12/18/2012US8334578 Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element
12/18/2012US8334572 Resistive device for high-k metal gate technology
12/18/2012US8334571 Junction varactor for ESD protection of RF circuits
12/18/2012US8334548 Semiconductor light emitting device
12/18/2012US8334467 Lead frame design to improve reliability
12/18/2012US8334465 Wafer of circuit board and joining structure of wafer or circuit board
12/18/2012US8334202 Device fabricated using an electroplating process
12/18/2012US8334201 Semiconductor device and inspection method therefor
12/18/2012US8334170 Method for stacking devices
12/18/2012US8333820 Forming conductive features of electronic devices
12/18/2012US8333569 Method and apparatus for two-phase start-up operation
12/18/2012CA2770394C Thermal control system for a light-emitting diode fixture
12/18/2012CA2401619C Thermal management system
12/13/2012WO2012170639A1 Substrate and assembly thereof with dielectric removal for increased post height
12/13/2012WO2012170625A1 Low-stress tsv design using conductive particles
12/13/2012WO2012170339A2 Signal routing using through-substrate vias
12/13/2012WO2012169408A1 Circuit board and electronic device provided with same
12/13/2012WO2012169388A1 Tft substrate and method for manufacturing same
12/13/2012WO2012169162A1 Reinforcing member, semiconductor package, semiconductor device, and fabrication method for semiconductor package
12/13/2012WO2012169104A1 Electronic device, structure, and heat sink
12/13/2012WO2012169060A1 Method for producing semiconductor device
12/13/2012WO2012169044A1 Semiconductor device
12/13/2012WO2012169012A1 Cooler
12/13/2012WO2012167514A1 Liquid crystal display and chip on film thereof
12/13/2012WO2012167488A1 Cof, cof carrier tape, and drive circuit of liquid crystal tv set
12/13/2012US20120314371 Group iii nitride based flip-chip integrated circuit and method for fabricating
12/13/2012US20120313691 Electromagnetic shield and associated methods
12/13/2012US20120313265 Semiconductor package
12/13/2012US20120313264 Chip with sintered connections to package
12/13/2012US20120313263 Three-Dimensional Multichip Module
12/13/2012US20120313261 Chip package structure and manufacturing method thereof
12/13/2012US20120313260 Layered chip package and method of manufacturing same
12/13/2012US20120313259 Layered chip package and method of manufacturing same
12/13/2012US20120313258 Semiconductor device having through silicon vias and manufacturing method thereof
12/13/2012US20120313257 Semiconductor device and method for manufacturing the semiconductor device
12/13/2012US20120313256 Non-Hierarchical Metal Layers for Integrated Circuits
12/13/2012US20120313255 3D Integration Microelectronic Assembly For Integrated Circuit Devices And Method Of Making Same
12/13/2012US20120313254 Compact metal connect and/or disconnect structures
12/13/2012US20120313253 Fan-out wlp with package
12/13/2012US20120313252 Semiconductor device
12/13/2012US20120313251 Interconnect structure with improved alignment for semiconductor devices
12/13/2012US20120313250 Forming Features on a Substrate Having Varying Feature Densities
12/13/2012US20120313249 Semiconductor device structures and the separating methods thereof
12/13/2012US20120313248 Semiconductor device structures
12/13/2012US20120313247 Through Silicon Via Structure and Method
12/13/2012US20120313245 Semiconductor device
12/13/2012US20120313244 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
12/13/2012US20120313243 Chip-scale package
12/13/2012US20120313242 Substrate and assembly thereof with dielectric removal for increased post height
12/13/2012US20120313241 Methods for surface attachment of flipped active components
12/13/2012US20120313240 Semiconductor package and fabrication method thereof
12/13/2012US20120313239 Flip chip assembly and process with sintering material on metal bumps
12/13/2012US20120313238 Semiconductor chip package assembly and method for making same
12/13/2012US20120313237 Bonded semiconductor structures and methods of forming same
12/13/2012US20120313236 Semiconductor device and manufacturing method for semiconductor device
12/13/2012US20120313235 Semiconductor Devices With Moving Members and Methods for Making the Same
12/13/2012US20120313234 Qfn package and manufacturing process thereof
12/13/2012US20120313233 Semiconductor Package, Stacking Semiconductor Package, And Method Of Fabricating The Same
12/13/2012US20120313232 Power Package Including Multiple Semiconductor Devices
12/13/2012US20120313231 Method and apparatus for dicing die attach film on a semiconductor wafer
12/13/2012US20120313230 Solder alloys and arrangements
12/13/2012US20120313229 Package structure and manufacturing method thereof
12/13/2012US20120313228 Impedence controlled packages with metal sheet or 2-layer rdl
12/13/2012US20120313227 Semiconductor device and structure for heat removal
12/13/2012US20120313226 Wiring substrate, semiconductor device and manufacturing method thereof
12/13/2012US20120313223 Method of fabricating an integrated circuit without ground contact pad
12/13/2012US20120313219 Chip package structure and method of making the same
12/13/2012US20120313198 Conductive paste composition containing lithium, and articles made therefrom
12/13/2012US20120313151 Semiconductor device including contact structure, method of fabricating the same, and electronic system including the same
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