Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/20/2012DE102012208767A1 Elektronische Schaltungsanordnung mit Verlustwärme abgebenden Komponenten Electronic circuitry with loss heat-emitting components
12/20/2012DE102011104305A1 Herstellungsverfahren für ein Halbleiterbauelement mit einer Leiterschicht im Halbleiterkörper und Halbleiterbauelement Manufacturing method for a semiconductor device having a conductor layer in the semiconductor body and the semiconductor component
12/20/2012DE102011077741A1 Electronic module used in control device for vehicle, has core whose specific portion is exposed on narrow side of housing
12/20/2012DE102005013762C5 Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters An electronic device and method for determining the temperature of a power semiconductor
12/20/2012DE102004064118B4 Infrared receiver chip for e.g. television, has line parallel to outer edge related to ground or input point, and set of conductor paths that do not intersect each other and routed directly from contact area to function point
12/20/2012CA2838753A1 Connectors for making connections between analyte sensors and other devices
12/19/2012EP2535935A2 Semiconductor power amplifier
12/19/2012EP2535933A1 Integrated circuit chip comprising protecting means against attacks
12/19/2012EP2535932A1 Integrated circuit chip comprising protecting means against attacks
12/19/2012EP2535931A2 Integrated circuit inductors with intertwined conductors
12/19/2012EP2535930A1 Semiconductor device with contact pad stack
12/19/2012EP2535929A1 Wire bondable surface for microelectronic devices
12/19/2012EP2535928A2 Cooling box for components or circuits
12/19/2012EP2535927A2 Covering material for a microchip, microchip with covering material and method for producing such a microchip
12/19/2012EP2535926A2 Semiconductor package
12/19/2012EP2535925A1 Back-side contact formation
12/19/2012EP2535441A1 Copper filled opening with a cap layer
12/19/2012EP2535377A1 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
12/19/2012EP2534691A1 Solar cell assembly with solder lug
12/19/2012EP2534687A2 Systems and methods providing arrangements of vias
12/19/2012EP2534686A1 Semiconductor die package structure
12/19/2012EP2534685A1 Scalable construction for lateral semiconductor components having high current-carrying capacity
12/19/2012EP2534684A1 Methods of forming contact structures including alternating metal and silicon layers and related devices
12/19/2012EP2534683A2 Interconnect pattern for transceiver package
12/19/2012EP2534682A2 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
12/19/2012EP2534681A2 Bond pad with multiple layer over pad metallization and method of formation
12/19/2012EP2534678A1 Interconnection structure made of redirected carbon nanotubes
12/19/2012EP2534675A2 Interconnect pattern for high performance interfaces
12/19/2012EP2534657A1 Rule-based semiconductor die stacking and bonding within a multi-die package
12/19/2012EP2534092A2 Semiconductor component and corresponding production method
12/19/2012CN202616229U Liquid-cooling IGBT (Insulated Gate Bipolar Translator) converter device
12/19/2012CN202616228U Packaging substrate
12/19/2012CN202616227U 44-row lead frame
12/19/2012CN202616226U TO serial power diode lead wire framework structure
12/19/2012CN202616225U Transistor fixing device
12/19/2012CN202616224U Heat dissipation device for transistor
12/19/2012CN202616223U A heat dissipating sheet
12/19/2012CN202616222U Semiconductor packaging structure
12/19/2012CN202616221U Leadless plastic flat encapsulation with cavity
12/19/2012CN202616220U High-voltage isolation structure based on silicon on insulator
12/19/2012CN1734755B Solderable top metalization and passivation for source mounted package
12/19/2012CN102834941A Light-emitting apparatus and method of manufacturing thereof
12/19/2012CN102834917A Interleaf for leadframe identification
12/19/2012CN102834916A Package having spaced apart heat sink
12/19/2012CN102834915A Method for manufacturing semiconductor device, resin sealing device, and semiconductor device
12/19/2012CN102834914A Method for manufacturing laminated body, and laminated body
12/19/2012CN102834907A Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
12/19/2012CN102834906A Forming functionalized carrier structures with coreless packages
12/19/2012CN102834547A Etching liquid for a copper/titanium multilayer thin film
12/19/2012CN102834534A Magnesium-based composite member, heat dissipation member, and semiconductor device
12/19/2012CN102834465A Encapsulant for optical semiconductor device and optical semiconductor device using same
12/19/2012CN102833980A Radiating module
12/19/2012CN102833945A Packaging substrate structure
12/19/2012CN102832210A Multi-surface integrated device on low resistance substrate
12/19/2012CN102832207A Block bridge pile
12/19/2012CN102832206A Patch in-line small bridge rectifier
12/19/2012CN102832205A In-line small bridge rectifier
12/19/2012CN102832204A 半导体装置 Semiconductor device
12/19/2012CN102832203A Structure and method for testing trap density of gate oxide interface
12/19/2012CN102832202A Circuit unit structure for process monitoring
12/19/2012CN102832201A Test structure and test method
12/19/2012CN102832200A Semiconductor structure and methods of forming same
12/19/2012CN102832199A Mixed-media copper-diffusion-resistant blocking layer for copper interconnection and fabrication method of blocking layer
12/19/2012CN102832198A Copper interconnection structure adopting novel alloy seed crystal layer and preparation method of structure
12/19/2012CN102832197A Metal interconnection structure and forming method thereof
12/19/2012CN102832196A Method for enhancing fusing properties of electronic programmable fuse wire devices
12/19/2012CN102832195A Three-dimensional capacitor structure
12/19/2012CN102832194A 电容结构 Capacitance structure
12/19/2012CN102832193A Integrated circuit inductors with intertwined conductors
12/19/2012CN102832192A Back-side contact formation
12/19/2012CN102832191A Power module package and system module having the same
12/19/2012CN102832190A Semiconductor device with flip chip and manufacturing method of semiconductor device
12/19/2012CN102832189A Multi-chip packaging structure and multi-chip packaging method
12/19/2012CN102832188A Solder ball protection structure with thick polymer layer
12/19/2012CN102832187A Wafer level chip scale package with reduced stress on solder balls
12/19/2012CN102832186A Three-runner water-cooling and air-cooling hybrid device structure for computer CPU (central processing unit)
12/19/2012CN102832185A Boiling refrigerant type cooling system
12/19/2012CN102832184A Heat dissipation device and fastening structure thereof
12/19/2012CN102832183A Outer-pin-free flat semiconductor package structure adopting elastic device
12/19/2012CN102832182A Semiconductor package and manufacturing method of semiconductor package
12/19/2012CN102832181A Chip-scale package
12/19/2012CN102832180A Chip package and method for forming the same
12/19/2012CN102832179A Metal base plate used for welding power module
12/19/2012CN102832178A Sealing ring structure used for integrated circuit chip
12/19/2012CN102832177A Method for controlled removal of semiconductor device layer from base substrate
12/19/2012CN102832166A Integrated circuits including barrier polish stop layers and methods for the manufacture thereof
12/19/2012CN102832162A Air bridge three-dimensional circuit and manufacturing method thereof
12/19/2012CN102832146A IGBT (insulated gate bipolar translator) module packaging process and IGBT module with bidirectional heat radiation
12/19/2012CN102832142A Manufacturing method for packaging structure
12/19/2012CN102832139A Flat packaging body without pins around, and packaging method of flat packaging body
12/19/2012CN102832138A Method for forming packaging substrate with ultrathin seed layer
12/19/2012CN102832137A Manufacturing method for heat radiation device
12/19/2012CN102826057A Electronic control unit and method of manufacturing the same
12/19/2012CN102157523B Standard cell and semiconductor device including the same
12/19/2012CN102157470B Micro LHP radiating system for integrated electrofluid power pump
12/19/2012CN102044521B Semiconductor component with through guide hole, manufacturing method of semiconductor component and packaging structure of semiconductor component with through guide hole
12/19/2012CN102044501B 集成电路结构 Integrated circuit structure
12/19/2012CN102030471B Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof
12/19/2012CN102005407B Contact plug and forming method thereof
12/19/2012CN101877345B Semiconductor device and method for manufacturing metallic shielding plate
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