Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/25/2012US8338920 Package integrated soft magnetic film for improvement in on-chip inductor performance
12/25/2012US8338918 Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package
12/25/2012US8338917 Multiple seal ring structure
12/25/2012US8338890 Semiconductor device and method for manufacturing semiconductor device
12/25/2012US8338829 Semiconductor device
12/25/2012US8338828 Semiconductor package and method of testing same
12/25/2012US8338746 Method for processing a memory link with a set of at least two laser pulses
12/25/2012US8338722 Tag enclosing structure
12/25/2012US8338234 Hybrid integrated circuit device and manufacturing method thereof
12/25/2012US8338205 Method of fabricating and encapsulating MEMS devices
12/24/2012CA2780658A1 Cooling device for a power module, and a related method thereof
12/20/2012WO2012174538A1 Connectors for making connections between analyte sensors and other devices
12/20/2012WO2012174449A2 Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi¬ channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die package
12/20/2012WO2012174300A2 Hermetic electronics package with dual-sided electrical feedthrough configuration
12/20/2012WO2012173683A1 Stress-aware design for integrated circuits
12/20/2012WO2012173631A1 Semiconductor unit with submount for semiconductor device
12/20/2012WO2012173238A1 Semiconductor device manufacturing method and semiconductor device
12/20/2012WO2012173067A1 Semiconductor device manufacturing method, semiconductor device, semiconductor device manufacturing apparatus, and storage medium
12/20/2012WO2012172991A1 Semiconductor unit and semiconductor device using same
12/20/2012WO2012172890A1 Printed-wiring board, electronic-component mounting structure, and method for manufacturing electronic-component mounting structure
12/20/2012WO2012172875A1 Semiconductor device and method for manufacturing semiconductor device
12/20/2012WO2012172866A1 Electronic-part package and piezoelectric vibration device
12/20/2012WO2012172862A1 Power semiconductor module and method of manufacturing same
12/20/2012WO2012172650A1 Cooling structure for semiconductor element
12/20/2012WO2012171797A1 Electronic circuit arrangement having components emitting lost heat
12/20/2012WO2012171742A1 Method for producing a semiconductor component comprising a conductor layer in the semiconductor body and semiconductor component
12/20/2012WO2012171727A1 Wire bondable surface for microelectronic devices
12/20/2012WO2012171726A2 Copper filled opening with a cap layer
12/20/2012WO2012171551A1 A heat sink and a method of making a cooled device with a heat sink
12/20/2012WO2012171240A1 Cof, cof carrier tape and driver circuit for liquid crystal television
12/20/2012WO2012171237A1 Chip-on-flex structure for liquid crystal panel
12/20/2012WO2012093820A3 Silicone resin composition for encapsulating an optical element
12/20/2012WO2012067992A3 Conductive pads defined by embedded traces
12/20/2012WO2012000114A8 Electronic devices with yielding substrates
12/20/2012WO2011146579A8 Electrical connector between die pad and z-interconnect for stacked die assemblies
12/20/2012US20120320549 Conductor Structural Element and Method for Producing a Conductor Structural Element
12/20/2012US20120320477 Device for detecting an attack in an integrated circuit chip
12/20/2012US20120320003 Cof, cof carrier tape and drive circuit of liquid crystal television
12/20/2012US20120319728 Programmable structured arrays
12/20/2012US20120319307 Identification of dies on a semiconductor wafer
12/20/2012US20120319306 Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
12/20/2012US20120319305 Process for producing a sheet of a circuit substrate
12/20/2012US20120319303 Wafer level hermetic bond using metal alloy with keeper layer
12/20/2012US20120319302 Semiconductor Device and Method of Forming RF FEM and RF Transceiver in Semiconductor Package
12/20/2012US20120319301 Monolithic Darlington with Intermediate Base Contact
12/20/2012US20120319300 Integrated circuit packaging system with underfill and method of manufacture thereof
12/20/2012US20120319298 Method for fabricating a semiconductor and semiconductor package
12/20/2012US20120319297 Chip package and method for forming the same
12/20/2012US20120319296 Semiconductor chip and semiconductor device
12/20/2012US20120319295 Integrated circuit packaging system with pads and method of manufacture thereof
12/20/2012US20120319294 Integrated circuit packaging system with laser hole and method of manufacture thereof
12/20/2012US20120319293 Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi-channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die package
12/20/2012US20120319292 Structure of a wafer level substrate for carrying light emitting devices
12/20/2012US20120319291 Semiconductor structures and methods of forming the same
12/20/2012US20120319290 Electrical connection for multichip modules
12/20/2012US20120319289 Semiconductor package
12/20/2012US20120319288 Semiconductor Package
12/20/2012US20120319287 Semiconductor structure and method for fabricating semiconductor layout
12/20/2012US20120319286 Integrated circuit packaging system with support structure and method of manufacture thereof
12/20/2012US20120319285 Integrated circuits including barrier polish stop layers and methods for the manufacture thereof
12/20/2012US20120319284 Integrated circuit packaging system with package on package support and method of manufacture thereof
12/20/2012US20120319282 Reliable Packaging and Interconnect Structures
12/20/2012US20120319281 Semiconductor device having groove-shaped via-hole
12/20/2012US20120319280 Semiconductor device and bonding material for semiconductor device
12/20/2012US20120319279 Semiconductor device and method of producing the same
12/20/2012US20120319278 Gap filling method for dual damascene process
12/20/2012US20120319277 Thin film transistor panel and manufacturing method thereof
12/20/2012US20120319276 Flip chip assembly process for ultra thin substrate and package on package assembly
12/20/2012US20120319275 Semiconductor device with heat spreader
12/20/2012US20120319274 Method of manufacturing semiconductor device, and semiconductor device
12/20/2012US20120319273 Flip Chip Interconnect Solder Mask
12/20/2012US20120319272 Flip Chip Interconnect Solder Mask
12/20/2012US20120319271 Bump structure and process of manufacturing the same
12/20/2012US20120319270 Wafer Level Chip Scale Package with Reduced Stress on Solder Balls
12/20/2012US20120319269 Enhanced Bump Pitch Scaling
12/20/2012US20120319268 Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device
12/20/2012US20120319267 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof
12/20/2012US20120319266 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
12/20/2012US20120319265 Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
12/20/2012US20120319264 Semiconductor device with heat spreader
12/20/2012US20120319262 Integrated circuit packaging system with support structure and method of manufacture thereof
12/20/2012US20120319261 Hermetically sealed wafer packages
12/20/2012US20120319260 Power module package and system module having the same
12/20/2012US20120319259 Power module package and method for fabricating the same
12/20/2012US20120319258 Stack frame for electrical connections and the method to fabricate thereof
12/20/2012US20120319257 Semiconductor storage device and manufacturing method thereof
12/20/2012US20120319256 Semiconductor package for mems device and method of manufacturing same
12/20/2012US20120319255 Thermal Enhanced High Density Flip Chip Package
12/20/2012US20120319254 Wiring board with built-in semiconductor element
12/20/2012US20120319253 Semiconductor module manufacturing method, semiconductor module, and manufacturing device
12/20/2012US20120319251 Solder Ball Protection Structure with Thick Polymer Layer
12/20/2012US20120319250 Back-side contact formation
12/20/2012US20120319247 Semiconductor device structures including a mask material
12/20/2012US20120319237 Corner-rounded structures and methods of manufacture
12/20/2012US20120319235 Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same
12/20/2012US20120319234 E-fuse structures and methods of operating and manufacturing the same
12/20/2012US20120319228 Semiconductor device
12/20/2012US20120319204 Triggerable Bidirectional Semiconductor Device
12/20/2012US20120319109 Electronic device and manufacturing thereof
12/20/2012DE112010005303T5 Wärmehärtende Kunstharzzusammensetzung, B-Stufen Wärmeleitfähigkeitsschicht und Leistungsmodul The thermosetting resin composition B-stage thermal conductivity layer and power module
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