Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/26/2012CN102842546A Semiconductor package and fabrication method thereof
12/26/2012CN102842545A A heat-dissipating module and an assembled structure of the heat-dissipating module and an integrated circuit chipset
12/26/2012CN102842544A Heat radiator buckling device
12/26/2012CN102842543A 电子控制单元 The electronic control unit
12/26/2012CN102842542A Plastic package chip and manufacturing method thereof
12/26/2012CN102842541A Laminated film and use thereof
12/26/2012CN102842540A Sip package and manufacturing method
12/26/2012CN102842539A Semiconductor device bonding wire
12/26/2012CN102842538A Method for fabricating a semiconductor structure with temporary bonding
12/26/2012CN102842537A Bump structure with barrier layer on post-passivation interconnect
12/26/2012CN102842531A Semiconductor device and method of forming interconnect structure over seed layer
12/26/2012CN102842511A Chip packaging method and wafer manufactured through chip packaging method
12/26/2012CN102842510A Semiconductor device with encapsulated electrical connection elements and fabrication process thereof
12/26/2012CN102842428A Thin-film capacitor, multilayer wiring board and semiconductor device
12/26/2012CN102841665A Double current channel water cooling device structure of computer central processing unit (CPU)
12/26/2012CN102840724A Temperature control system for CCD (charge-coupled device) detector refrigerating devices
12/26/2012CN102838947A Modifier used for adhesive, production method thereof, adhesive, and circuit connection structure body
12/26/2012CN102290385B Water-cooling radiator for gate turn-off thyristor
12/26/2012CN102237355B TFT array substrate and LCD panel
12/26/2012CN102184910B Non-fully-convex dioctahedral transformer Balun
12/26/2012CN102142430B Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof
12/26/2012CN102136327B Heat-conduction insulation spacer
12/26/2012CN102117782B Composite buried element structure and manufacturing method thereof
12/26/2012CN102074533B Heat transfer unit for heat dissipation of electronic chip
12/26/2012CN102069172B Composite casting method of aluminum cooling plate
12/26/2012CN102034805B Package integrating thermoelectric component with chip
12/26/2012CN101997063B Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof
12/26/2012CN101981691B Package on package using a bump-less build up layer (bbul) package
12/26/2012CN101969053B 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/26/2012CN101924091B Circuit apparatus
12/26/2012CN101911288B All optical fast distributed arbitration in a computer system device
12/26/2012CN101897020B Cooling body of at least one electrical component
12/26/2012CN101894762B Metal heat-conducting substrate and manufacturing method thereof
12/26/2012CN101889341B Interposer substrate and semiconductor device
12/26/2012CN101864147B Underfill with low viscosity and low linear expansion coefficient
12/26/2012CN101853828B Chip with convex block and packaging structure of chip with convex block
12/26/2012CN101822132B Substrate with semiconductor element mounted thereon
12/26/2012CN101769524B Light emitting diode lamp and light engine thereof
12/26/2012CN101765351B Heat-dissipation device
12/26/2012CN101749980B Radiating fin, radiator and electronic device
12/26/2012CN101710581B Encapsulating structure of semiconductor chip and manufacturing technology thereof
12/26/2012CN101689804B Electric vehicle, and method for cooling vehicular dc/dc-converter
12/26/2012CN101627400B Method for connecting antenna to responder chip and related insert inlay
12/26/2012CN101593709B Module including a sintered joint
12/26/2012CN101432862B Substrate for a microelectronic package and method of fabricating thereof
12/26/2012CN101431058B Semiconductor device and a method of manufacturing the same
12/26/2012CN101427360B Wafer scale die handling
12/26/2012CN101315944B 有机电致发光器件 Organic electroluminescent devices
12/26/2012CN101309569B Fastener and combination of cooling device
12/26/2012CN101075584B Method of manufacturing LCD apparatus by using halftone exposure method
12/25/2012US8339844 Programmable vias for structured ASICs
12/25/2012US8339605 Multilayer alignment and overlay target and measurement method
12/25/2012US8339204 Semiconductor device
12/25/2012US8338970 Integrated circuit with adjusting elements and method for its manufacture
12/25/2012US8338969 Serial advanced technology attachment interface storage device
12/25/2012US8338968 Semiconductor device and a method of manufacturing the same
12/25/2012US8338967 Stress buffering package for a semiconductor component
12/25/2012US8338966 Joint structure, joining material, and method for producing joining material containing bismuth
12/25/2012US8338965 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
12/25/2012US8338964 Stacked-chip device
12/25/2012US8338963 Multiple die face-down stacking for two or more die
12/25/2012US8338962 Semiconductor package substrate and semiconductor package having the same
12/25/2012US8338961 Semiconductor chip with reinforcing through-silicon-vias
12/25/2012US8338960 Method of manufacturing photomask and method of repairing optical proximity correction
12/25/2012US8338959 Simplified pitch doubling process flow
12/25/2012US8338957 Low resistance through-wafer via
12/25/2012US8338956 Semiconductor device and method for manufacturing same
12/25/2012US8338955 Single-sided, flat, no lead, integrated circuit package
12/25/2012US8338953 Method of manufacturing a semiconductor device and semiconductor device
12/25/2012US8338952 Interconnect structures with ternary patterned features generated from two lithographic processes
12/25/2012US8338951 Metal line of semiconductor device having a diffusion barrier with an amorphous TaBN layer and method for forming the same
12/25/2012US8338950 Electronic component
12/25/2012US8338949 System to improve coreless package connections
12/25/2012US8338948 Ball grid array with improved single-ended and differential signal performance
12/25/2012US8338947 Solder interconnect pads with current spreading layers
12/25/2012US8338946 Semiconductor module, method of manufacturing semiconductor module, and mobile device
12/25/2012US8338945 Molded chip interposer structure and methods
12/25/2012US8338944 Semiconductor device, semiconductor module, radiating fin and fitting portions
12/25/2012US8338943 Semiconductor package with thermal heat spreader
12/25/2012US8338942 Power semiconductor module with connection elements electrically insulated from one another
12/25/2012US8338941 Semiconductor packages and methods of fabricating the same
12/25/2012US8338940 Semiconductor device
12/25/2012US8338939 TSV formation processes using TSV-last approach
12/25/2012US8338938 Chip package device and manufacturing method thereof
12/25/2012US8338937 Flange package for a semiconductor device
12/25/2012US8338936 Semiconductor device and manufacturing method
12/25/2012US8338935 Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
12/25/2012US8338934 Embedded die with protective interposer
12/25/2012US8338933 Three-dimensional package structure
12/25/2012US8338932 Power semiconductor module with interconnected package portions
12/25/2012US8338931 Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers
12/25/2012US8338930 Integrated circuit with electromagnetic intrachip communication and methods for use therewith
12/25/2012US8338929 Stacked-type chip package structure and fabrication method thereof
12/25/2012US8338928 Three-dimensional package structure
12/25/2012US8338926 Lead frame for optical semiconductor devices, method of producing the same, and optical semiconductor device
12/25/2012US8338925 Microelectronic assemblies having compliant layers
12/25/2012US8338924 Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof
12/25/2012US8338923 Package structure of multi-layer array type LED device
12/25/2012US8338922 Molded leadframe substrate semiconductor package
12/25/2012US8338921 Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same
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