Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2012
12/27/2012US20120326190 Anode containing metal oxide and organic light emitting device having the same
12/27/2012US20120326147 Semiconductor chip, method of manufacturing the same, and semiconductor package
12/27/2012US20120326146 Sacrificial Wafer Probe Pads Through Seal Ring for Electrical Connection to Circuit Inside an Integrated Circuit
12/27/2012US20120325297 Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component
12/27/2012US20120325091 Getter structure including a gaz-permeable material
12/27/2012US20120325009 Strain measurement test module
12/27/2012DE112011100650T5 Trägerplatine und struktur von dieser Backplane and structure of this
12/27/2012DE112008000533B4 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device
12/27/2012DE112004001102B4 Verfahren zur Steuerung der Planheit und der Elektronenbeweglichkeit von mit Diamant beschichtetem Silizium und dadurch gebildeten Strukturen Method for controlling the flatness and the electron mobility of silicon coated with diamond and structures formed thereby
12/27/2012DE102012208295A1 Method for manufacturing thermoelectric module for manufacture of thermoelectric generator utilized in vehicle, involves sintering or pressing joining material to form joining seam region between thermoelectric and housing elements
12/27/2012DE102012105599A1 Verfahren zum Anbringen einer Metallfläche an einem Träger, Verfahren zum Anbringen eines Chips an einem Chipträger, Chip-Einhäusungsmodul und Einhäusungsmodul A method of attaching a metal surface on a carrier, method of attaching a chip to a chip carrier and chip Einhäusungsmodul Einhäusungsmodul
12/27/2012DE102011105374A1 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterbauelementen im Verbund, derart hergestelltes Halbleiterbauelement und dessen Verwendung A method for fabricating a plurality of optoelectronic semiconductor components in the composite, thus produced semiconductor device and its use
12/27/2012DE102011105346A1 Elektronische Baugruppe und Verfahren zu deren Herstellung An electronic assembly and methods for their preparation
12/27/2012DE102011051315A1 Electronic switch e.g. n-channel MOSFET, for controlling e.g. windscreen wiper in automobile industry, has suppresser diode switchable parallel to switch to protect against over-voltage, where suppresser diode is integrated into housing
12/27/2012DE102008031231B4 Herstellungsverfahren für planare elektronsche Leistungselektronik-Module für Hochtemperatur-Anwendungen und entsprechendes Leistungselektronik-Modul Production process for planar elektronsche power electronics modules for high temperature applications and corresponding power electronics module
12/27/2012DE10058446B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components
12/26/2012EP2538761A1 Intelligent Power Module and related assembling method
12/26/2012EP2538445A2 Manufacturing method of a III-nitride device and associated III-nitride device
12/26/2012EP2538441A2 Apparatus and method for frequency generation
12/26/2012EP2538440A2 Cooling device for a power module, and a related method thereof
12/26/2012EP2538439A1 Substrate for mounting element, and method for manufacturing the substrate
12/26/2012EP2538436A2 Hermetically Sealed Wafer Packages
12/26/2012EP2537963A1 Metal laminate structure and production method for same
12/26/2012EP2537960A1 Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein
12/26/2012EP2537400A1 Method for manufacturing an electronic package
12/26/2012EP2537182A1 Microelectronic package with terminals on dielectric mass
12/26/2012EP2537181A1 Device including electrical, electronic, electromechanical or electro-optical components having reduced sensitivity at a low dose rate
12/26/2012EP2256793B1 Ball-arranging substrate for placement of bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls
12/26/2012CN202633309U Insulated gate bipolar transistor (IGBT) power module applied to electric vehicle
12/26/2012CN202633307U Low-cost surface mounting and encapsulating structure for semiconductor optical device
12/26/2012CN202633305U Assembly of laminated apparatus possessing semiconductor components
12/26/2012CN202633291U Chip-on-chip packaging structure
12/26/2012CN202633290U High-density semiconductor encapsulation structure
12/26/2012CN202633289U Packaging structure
12/26/2012CN202633288U Novel fractal PGS (Program Generation System) structure
12/26/2012CN202633287U Novel fractal pattern grounding shielding structure
12/26/2012CN202633286U Novel fractal patterned float shield (PFS) structure
12/26/2012CN202633285U Lower packaging body structure of package on package
12/26/2012CN202633284U Novel lead wire framework
12/26/2012CN202633283U Lead wire framework with high connectivity
12/26/2012CN202633282U Novel lead wire framework
12/26/2012CN202633281U Novel lead wire framework
12/26/2012CN202633280U Novel lead wire framework
12/26/2012CN202633279U Novel lead wire framework
12/26/2012CN202633278U Novel lead wire framework
12/26/2012CN202633277U Novel lead wire framework
12/26/2012CN202633276U Chip zone lead wire framework with grooves
12/26/2012CN202633275U Novel lead wire framework
12/26/2012CN202633274U Novel lead wire framework
12/26/2012CN202633273U Diode connecting device of photovoltaic junction box
12/26/2012CN202633272U Diode chip jumper wire
12/26/2012CN202633271U Low-cost surface mounting and encapsulating structure for semiconductor optical device
12/26/2012CN202633270U Novel high-reliability power module
12/26/2012CN202633269U Heat radiating structure for IGBT module of induction cooker
12/26/2012CN202633268U Radiator and electronic equipment
12/26/2012CN202633267U Vibration-resistant thyristor
12/26/2012CN202633266U Ultrathin bridge rectifier
12/26/2012CN202633265U High-dielectric voltage-withstanding power semiconductor module
12/26/2012CN202633264U Power device packageless structure of radio frequency power amplifier module
12/26/2012CN202632328U Frangible anti-fake RFID etching electronic label
12/26/2012CN202631105U Brightness and proximity multi-chip integrated transducer
12/26/2012CN1474455B Semiconductor storage element and its operation method and semiconductor memory array
12/26/2012CN102845139A Membrane wiring board
12/26/2012CN102844861A Tce compensation for ic package substrates for reduced die warpage assembly
12/26/2012CN102844860A Ball-grid array device having chip assembled on half-etched metal leadframe
12/26/2012CN102844859A Dual carrier for joining ic die or wafers to tsv wafers
12/26/2012CN102844858A Glass substrate for forming semiconductor device via
12/26/2012CN102844857A Glass substrate for semiconductor device via
12/26/2012CN102844850A Method for fabricating through-substrate microchannels
12/26/2012CN102844607A Array of scalable ceramic diode carriers having leds
12/26/2012CN102844383A Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
12/26/2012CN102843862A Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module
12/26/2012CN102843858A Line base plate for fixedly providing semiconductor chip and manufacturing method thereof
12/26/2012CN102842574A Semiconductor packaging structure for stacking
12/26/2012CN102842572A Small double-row bridge rectifier
12/26/2012CN102842571A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on substrate and tin layer and packaging method thereof
12/26/2012CN102842570A Multiple chip packaging piece based on nickel-palladium alloy or nickel-palladium tin layer and packaging method thereof
12/26/2012CN102842569A Etching barrier layer used for copper interconnection and manufacturing method thereof
12/26/2012CN102842568A Interconnection structure based on carbon nanotube and manufacturing method of interconnection structure
12/26/2012CN102842567A Lead frame fixing device and packaging method
12/26/2012CN102842566A Intelligent card carrying strap with coil
12/26/2012CN102842565A Intelligent card module with coil as well as realization method thereof
12/26/2012CN102842564A Flip-chip package device for integrated switching power supply and flip-chip packaging method
12/26/2012CN102842563A Wafer level chip scale package (WLCSP) single chip packaging piece and plastic packaging method thereof
12/26/2012CN102842562A WLCSP (Wafer Level Chip Size Packaging) single-chip package on basis of substrate and packaging method thereof
12/26/2012CN102842561A WLCSP (Wafer Level Chip Size Packaging) single-chip package and packaging method thereof
12/26/2012CN102842560A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece and packaging method thereof
12/26/2012CN102842559A Multi-chip package based on nickel palladium gold (NiPdAu) and packaging method thereof
12/26/2012CN102842558A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on solder paste layers and packaging method thereof
12/26/2012CN102842557A Stack frame and method to fabricate thereof
12/26/2012CN102842556A Semiconductor component with dual surfaces exposed and manufacturing method of semiconductor component
12/26/2012CN102842555A Semiconductor device and method of manufacturing the same
12/26/2012CN102842554A WLCSP (Wafer Level Chip Size Packaging) single-chip package on basis of NiPdAu or NiPd and tin layers and packaging method thereof
12/26/2012CN102842553A WLCSP (Wafer Level Chip Size Packaging) single-chip package on basis of NiPdAu or NiPd and packaging method thereof
12/26/2012CN102842552A WLCSP (Wafer Level Chip Size Packaging) single-chip package on basis of paste masks and packaging method thereof
12/26/2012CN102842551A Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on substrate and solder paste layer and packaging method thereof
12/26/2012CN102842550A Dual flat package (DFN) structure of power metal-oxide-semiconductor field effect transistor (MOSFE) chip
12/26/2012CN102842549A Power metal-oxide-semiconductor field effect transistor (MOSFE) packaging body of square and flat shape and without pin
12/26/2012CN102842548A Square flat-type power metal oxide semi-conductor (MOS) chip packaging structure
12/26/2012CN102842547A Bond pad design for improved routing and reduced package stress
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