Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2013
01/01/2013US8344456 Electrostatic discharge protection circuit and integrated circuit device including electrostatic discharge protection circuit
01/01/2013US8344438 Electrode of an integrated circuit
01/01/2013US8344429 Compact memory arrays
01/01/2013US8344428 Nanopillar E-fuse structure and process
01/01/2013US8344383 Active matrix substrate, display device, and television apparatus
01/01/2013US8344376 Apparatus and method for predetermined component placement to a target platform
01/01/2013US8344269 Semiconductor device capable of switching operation modes
01/01/2013US8343868 Device and methodology for reducing effective dielectric constant in semiconductor devices
01/01/2013US8343809 Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
01/01/2013US8343807 Process for making microelectronic element chips
01/01/2013US8343386 Electrostatic dissipative adhesive
01/01/2013US8343307 Showerhead assembly
12/2012
12/27/2012WO2012177450A1 Semiconductor chip with dual polymer film interconnect structures
12/27/2012WO2012176905A1 Method for forming conductive film, conductive film, insulation method, and insulation film
12/27/2012WO2012176581A1 Heat-dissipating unit
12/27/2012WO2012176503A1 Semiconductor device and method for manufacturing semiconductor device
12/27/2012WO2012176402A1 Circuit module
12/27/2012WO2012176399A1 Nitride semiconductor device
12/27/2012WO2012176392A1 Semiconductor device and method for manufacturing same
12/27/2012WO2012176363A1 Polymer structure
12/27/2012WO2012176198A2 Energetic unit based on semiconductor bridge
12/27/2012WO2012176083A2 Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
12/27/2012WO2012175627A2 Thermal management system with variable-volume material
12/27/2012WO2012175112A1 Power semiconductor housing with contact mechanism
12/27/2012WO2012174833A1 Plastic packaged chip and manufacturing method thereof
12/27/2012WO2012174781A1 Method, apparatus and terminal for adjusting terminal temperature
12/27/2012WO2012174686A1 Manufacturing method for disposing heat transfer layer and heat dissipation layer on surface of radiator and heat dissipation layer structure
12/27/2012WO2012143784A8 Semiconductor device and manufacturing method thereof
12/27/2012WO2012135832A3 Voltage switchable dielectric for die-level electrostatic discharge (esd) protection
12/27/2012WO2012129426A3 Integrated circuit with electromagnetic communication
12/27/2012WO2012129153A3 Solder in cavity interconnection structures
12/27/2012US20120329251 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
12/27/2012US20120329244 Capping Coating for 3D Integration Applications
12/27/2012US20120329211 Fabrication method of semiconductor integrated circuit device
12/27/2012US20120328885 Deposition of polymer films by electrospinning
12/27/2012US20120328303 Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating
12/27/2012US20120327658 Wire-clasping light-emitting diode lights
12/27/2012US20120327614 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
12/27/2012US20120326756 Electronic circuit and method for testing and keeping a mos transistor switched-off
12/27/2012US20120326339 Semiconductor device, and method and apparatus for manufacturing the same
12/27/2012US20120326338 Semiconductor device
12/27/2012US20120326337 Semiconductor Device and Method of Forming EWLB Package With Standoff Conductive Layer Over Encapsulant Bumps
12/27/2012US20120326336 Bond pad design for improved routing and reduced package stress
12/27/2012US20120326335 Low-noise flip-chip packages and flip chips thereof
12/27/2012US20120326334 Interposer, its manufacturing method, and semiconductor device
12/27/2012US20120326332 Semiconductor device with encapsulated electrical connection elements and fabrication process thereof
12/27/2012US20120326331 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
12/27/2012US20120326330 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
12/27/2012US20120326329 Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure
12/27/2012US20120326328 Semiconductor device and manufacturing method therefor
12/27/2012US20120326327 Via structure for integrated circuits
12/27/2012US20120326326 Systems and Methods for Producing Flat Surfaces in Interconnect Structures
12/27/2012US20120326325 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
12/27/2012US20120326324 Integrated circuit packaging system with package stacking and method of manufacture thereof
12/27/2012US20120326323 High voltage high package pressure semiconductor package
12/27/2012US20120326322 Chip package with reinforced positive alignment features
12/27/2012US20120326321 Techniques for Modular Chip Fabrication
12/27/2012US20120326320 Semiconductor device and manufacturing method thereof
12/27/2012US20120326319 Method and structure for through-silicon via (tsv) with diffused isolation well
12/27/2012US20120326318 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof
12/27/2012US20120326317 Semiconductor device and manufacturing method therefor
12/27/2012US20120326316 Metal contacts for molecular device junctions and surface-diffusion-mediated deposition
12/27/2012US20120326315 Method of manufacturing a semiconductor device and semiconductor device
12/27/2012US20120326314 Large-grain, low-resistivity tungsten on a conductive compound
12/27/2012US20120326313 Single exposure in multi-damascene process
12/27/2012US20120326312 In-Situ Formation of Silicon and Tantalum Containing Barrier
12/27/2012US20120326311 Enhanced diffusion barrier for interconnect structures
12/27/2012US20120326310 Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements
12/27/2012US20120326309 Optimized annular copper tsv
12/27/2012US20120326308 Enhanced wlp for superior temp cycling, drop test and high current applications
12/27/2012US20120326307 Stacked semiconductor device
12/27/2012US20120326306 Pop package and manufacturing method thereof
12/27/2012US20120326305 Semiconductor package and fabrication method thereof
12/27/2012US20120326303 Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die
12/27/2012US20120326302 Semiconductor Device and Method of Forming PIP with Inner Known Good Die Interconnected with Conductive Bumps
12/27/2012US20120326301 Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device
12/27/2012US20120326300 Low profile package and method
12/27/2012US20120326299 Semiconductor chip with dual polymer film interconnect structures
12/27/2012US20120326298 Bump structure with barrier layer on post-passivation interconnect
12/27/2012US20120326297 Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation
12/27/2012US20120326296 Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
12/27/2012US20120326295 Semiconductor module
12/27/2012US20120326294 Multichip electronic packages and methods of manufacture
12/27/2012US20120326293 Semiconductor package having electrode on side surface, and semiconductor device
12/27/2012US20120326292 Electronic control unit
12/27/2012US20120326291 Integrated circuit packaging system with underfill and method of manufacture thereof
12/27/2012US20120326290 Silicon carrier optoelectronic packaging
12/27/2012US20120326289 Semiconductor device and method of manufacturing the same
12/27/2012US20120326288 Method of assembling semiconductor device
12/27/2012US20120326287 Dc/dc convertor power module package incorporating a stacked controller and construction methodology
12/27/2012US20120326286 Integrated circuit packaging system with wafer level reconfigured multichip packaging system and method of manufacture thereof
12/27/2012US20120326285 Integrated circuit packaging system with a lead and method of manufacture thereof
12/27/2012US20120326284 Integrated circuit packaging system with thermal emission and method of manufacture thereof
12/27/2012US20120326281 Integrated circuit packaging system with interconnects and method of manufacture thereof
12/27/2012US20120326280 Laminated film and use thereof
12/27/2012US20120326278 Method to solve potential yield loss due to metal migration to wire routing nets from fiduciary marks on product during chemical-mechanical-polishing (cmp) planarization processing steps
12/27/2012US20120326269 E-fuse structures and methods of manufacture
12/27/2012US20120326267 Composite isolation layer structures for semiconductor devices and methods of manufacturing the same
12/27/2012US20120326241 Metal semiconductor alloy structure for low contact resistance
12/27/2012US20120326235 Semiconductor device
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