| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/02/2013 | CN102201388B QFN semiconductor package and fabrication method thereof |
| 01/02/2013 | CN102201283B Capacitor, integrated device, radio frequency switching device and electronic apparatus |
| 01/02/2013 | CN102148205B 集成电路结构 Integrated circuit structure |
| 01/02/2013 | CN102142421B Metal-column chip connecting structure and method without solders |
| 01/02/2013 | CN102142383B Method for detecting positions of wells |
| 01/02/2013 | CN102130096B Test structure and test method for coupling capacitance of metal redundant fillers in integrated circuit |
| 01/02/2013 | CN102120295B Radiation component and manufacturing method thereof |
| 01/02/2013 | CN102110671B Electrostatic discharge (ESD) protection device |
| 01/02/2013 | CN102097332B Conduction hole structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102097330B Conduction structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102097329B Embedded conduction structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102082181B Thin film transistor structure of pixel circuit for organic light emitting device |
| 01/02/2013 | CN102074517B Ball grid array (BGA) package structure |
| 01/02/2013 | CN102066493B Curable organopolysiloxane composition and semiconductor device |
| 01/02/2013 | CN102064162B Stacked package structure, package structure thereof and manufacture method of the package structure |
| 01/02/2013 | CN102054806B Thermal conductive substrate and manufacturing method thereof |
| 01/02/2013 | CN102044447B Packaging technology and packaging structure |
| 01/02/2013 | CN102034823B Layout and bonding pad floor planning for power transistor with favorable SPU (Short-to-Plus Unpowered) and STOG (Short-to-Open circuit Grounded) performance |
| 01/02/2013 | CN102024769B 集成电路元件 IC components |
| 01/02/2013 | CN102005956B Power converter |
| 01/02/2013 | CN101996955B Chip package and fabrication method thereof |
| 01/02/2013 | CN101969057B Circuit substrate |
| 01/02/2013 | CN101958311B Semiconductor structure and forming method |
| 01/02/2013 | CN101958307B Power semiconductor module and method of manufacturing the same |
| 01/02/2013 | CN101937881B Semiconductor packaging structure and packaging method thereof |
| 01/02/2013 | CN101930980B Semiconductor device having saddle fin-shaped channel and method for manufacturing the same |
| 01/02/2013 | CN101916740B In-situ dry clean chamber for front end of line fabrication |
| 01/02/2013 | CN101916732B Circuit substrate and making process thereof |
| 01/02/2013 | CN101904004B Wafer level chip scale package and process of manufacture |
| 01/02/2013 | CN101899195B Dam composition and method for fabrication of multilayer semiconductor device |
| 01/02/2013 | CN101896529B Solid power formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 01/02/2013 | CN101872756B Semiconductor device and manufacturing method of semiconductor device |
| 01/02/2013 | CN101866903B Window type ball gird array packaging structure |
| 01/02/2013 | CN101847639B Array substrate and manufacturing method thereof |
| 01/02/2013 | CN101752409B Gate structure of semiconductor device and methods of forming word line structure and memory |
| 01/02/2013 | CN101728334B Esd induced artifact reduction design for a thin film transistor image sensor array |
| 01/02/2013 | CN101681874B Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium |
| 01/02/2013 | CN101673999B Reduction of semiconductor stresses |
| 01/02/2013 | CN101673758B Display device and manufacturing method thereof |
| 01/02/2013 | CN101658083B Use of an adhesive composition for die-attaching high power semiconductors |
| 01/02/2013 | CN101652209B Method for producing heterogeneous composites |
| 01/02/2013 | CN101630674B Circuit protection device including resistor and fuse element |
| 01/02/2013 | CN101577283B Thin film transistor array arrangement, organic light emitting display device having the same, and manufacturing method thereof |
| 01/02/2013 | CN101567347B Circuit board and method for jointing circuit board |
| 01/02/2013 | CN101567345B Through-electrode, circuit board, semiconductor package and stacked semiconductor package |
| 01/02/2013 | CN101536623B Led with integral thermal via |
| 01/02/2013 | CN101515582B 半导体装置 Semiconductor device |
| 01/02/2013 | CN101465367B Display device and method for manufacturing the same |
| 01/02/2013 | CN101459170B 半导体器件 Semiconductor devices |
| 01/02/2013 | CN101315912B Composite refrigeration method and device for high-power electric semiconductor device |
| 01/02/2013 | CN101281924B Method, apparatus, and system for phase change memory packaging |
| 01/02/2013 | CN101238570B Semiconductor device and making method thereof |
| 01/02/2013 | CN101142675B An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device |
| 01/01/2013 | US8346336 Analyte monitoring device and methods of use |
| 01/01/2013 | US8345458 Semiconductor device |
| 01/01/2013 | US8345445 Heat sink assembly for a pluggable module |
| 01/01/2013 | US8345435 Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof |
| 01/01/2013 | US8345243 Overlay metrology target |
| 01/01/2013 | US8345092 Imaging apparatus and endoscope |
| 01/01/2013 | US8344745 Test structures for evaluating a fabrication of a die or a wafer |
| 01/01/2013 | US8344620 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same |
| 01/01/2013 | US8344522 Solder structure, method for forming the solder structure, and semiconductor module including the solder structure |
| 01/01/2013 | US8344521 Semiconductor device, semiconductor package and wiring structure |
| 01/01/2013 | US8344519 Stacked-die package for battery power management |
| 01/01/2013 | US8344518 Apparatus for stacking integrated circuits |
| 01/01/2013 | US8344516 Integrated chip carrier with compliant interconnects |
| 01/01/2013 | US8344515 Semiconductor device |
| 01/01/2013 | US8344513 Barrier for through-silicon via |
| 01/01/2013 | US8344512 Three-dimensional silicon interposer for low voltage low power systems |
| 01/01/2013 | US8344511 Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy |
| 01/01/2013 | US8344510 Semiconductor device with void detection monitor |
| 01/01/2013 | US8344509 Method for fabricating semiconductor device and semiconductor device |
| 01/01/2013 | US8344508 Semiconductor device and fabrication method thereof |
| 01/01/2013 | US8344506 Interface structure for copper-copper peeling integrity |
| 01/01/2013 | US8344505 Wafer level packaging of semiconductor chips |
| 01/01/2013 | US8344504 Semiconductor structure comprising pillar and moisture barrier |
| 01/01/2013 | US8344503 3-D circuits with integrated passive devices |
| 01/01/2013 | US8344502 Semiconductor module and a method for producing an electronic circuit |
| 01/01/2013 | US8344501 Multilayer wiring substrate having a castellation structure |
| 01/01/2013 | US8344500 Integrated circuit package module and method of the same |
| 01/01/2013 | US8344498 Semiconductor device |
| 01/01/2013 | US8344497 Semiconductor package and electronic device having the same |
| 01/01/2013 | US8344496 Distributing power with through-silicon-vias |
| 01/01/2013 | US8344495 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 01/01/2013 | US8344494 Layered chip package and method of manufacturing same |
| 01/01/2013 | US8344493 Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips |
| 01/01/2013 | US8344492 Semiconductor device and method of manufacturing the same, and electronic apparatus |
| 01/01/2013 | US8344491 Multi-die building block for stacked-die package |
| 01/01/2013 | US8344490 Semiconductor device having a high frequency electrode positioned with a via hole |
| 01/01/2013 | US8344489 Semiconductor device and manufacturing method thereof |
| 01/01/2013 | US8344487 Stress mitigation in packaged microchips |
| 01/01/2013 | US8344486 Semiconductor device and display apparatus |
| 01/01/2013 | US8344485 Anticounterfeiting system and method for integrated circuits |
| 01/01/2013 | US8344479 Integrated circuit inductor with integrated vias |
| 01/01/2013 | US8344477 Semiconductor chip, semiconductor wafer, method of manufacturing semiconductor chip |
| 01/01/2013 | US8344476 Fuse structure for high integrated semiconductor device |
| 01/01/2013 | US8344464 Multi-transistor exposed conductive clip for high power semiconductor packages |
| 01/01/2013 | US8344462 Mounting device for a semiconductor package |
| 01/01/2013 | US8344458 Semiconductor device |
| 01/01/2013 | US8344457 Insulated-gate semiconductor device with protection diode |