| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/02/2013 | CN202651114U Power supply chip |
| 01/02/2013 | CN202651112U Semiconductor device and lamination |
| 01/02/2013 | CN202651111U Protection ring of deep-groove super-junction structure |
| 01/02/2013 | CN202651110U Integrated circuit and protection circuit thereof |
| 01/02/2013 | CN202651109U A carrier tape used for an ultrathin non-contact module |
| 01/02/2013 | CN202651108U Thermoelectric separation lead rack structure |
| 01/02/2013 | CN202651107U Package substrate having interposer, and package structure thereof |
| 01/02/2013 | CN202651106U Surface-mount-type lead frame |
| 01/02/2013 | CN202651105U Surface-mount-type bridge-type lead frame |
| 01/02/2013 | CN202651104U 48 row lead wire framework |
| 01/02/2013 | CN202651103U Lead frame structure with pressure welding area having projection or groove |
| 01/02/2013 | CN202651102U Lead frame of bridge rectifier |
| 01/02/2013 | CN202651101U Single-base-island embedded single-circle multi-chip forward passive component electrostatic discharging ring packaging structure |
| 01/02/2013 | CN202651100U 半导体封装结构 The semiconductor package structure |
| 01/02/2013 | CN202651099U Novel solar energy diode lead wire |
| 01/02/2013 | CN202651098U Semiconductor packaging component |
| 01/02/2013 | CN202651097U Fine pitch projection structure |
| 01/02/2013 | CN202651096U Fine pitch projection structure |
| 01/02/2013 | CN202651095U Fixed heat dissipation device of MOS tube |
| 01/02/2013 | CN202651094U A MOS chip installing and fixing structure |
| 01/02/2013 | CN202651093U Chip-invertedly-mounted basic island passive device packaging structure for three dimensional line |
| 01/02/2013 | CN202651092U Chip-invertedly-mounted base-free-island passive device packaging structure for three dimensional line |
| 01/02/2013 | CN202651091U Chip-positively-mounted basic island passive device packaging structure for three dimensional line |
| 01/02/2013 | CN202651090U Multi-base-island embedded single-circle multi-chip forward passive component packaging structure |
| 01/02/2013 | CN202651089U Flexible packaging substrate |
| 01/02/2013 | CN202651072U Chip-positively-mounted base-free-island passive device packaging structure for three dimensional line |
| 01/02/2013 | CN202649911U Water-cooled radiating device special for display card |
| 01/02/2013 | CN202647666U Large-power LED compound aluminum substrate |
| 01/02/2013 | CN102859688A Semiconductor package for mems device and method of manufacturing the same |
| 01/02/2013 | CN102859687A Semiconductor device and method for manufacturing same |
| 01/02/2013 | CN102859686A Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint |
| 01/02/2013 | CN102859685A Interconnect pattern for transceiver package |
| 01/02/2013 | CN102859684A Heat dissipation device and semiconductor device |
| 01/02/2013 | CN102859683A Cooling assembly for cooling heat generating component |
| 01/02/2013 | CN102859682A Power module and method for manufacturing power module |
| 01/02/2013 | CN102859681A Methods and structures for forming integrated semiconductor structures |
| 01/02/2013 | CN102859671A Semiconductor device, and process for manufacture of semiconductor device |
| 01/02/2013 | CN102859662A Self-aligned barrier and capping layers for interconnects |
| 01/02/2013 | CN102858132A Radiator |
| 01/02/2013 | CN102856409A Connecting box for solar photovoltaic module |
| 01/02/2013 | CN102856393A Chip-diode structure |
| 01/02/2013 | CN102856314A 6500V high-voltage diode module |
| 01/02/2013 | CN102856309A Semiconductor device |
| 01/02/2013 | CN102856308A Power semiconductor module |
| 01/02/2013 | CN102856307A Small-sized jumper dual bridge rectifier |
| 01/02/2013 | CN102856306A Semiconductor device system-level packaging structure and packaging module |
| 01/02/2013 | CN102856304A Semiconductor chip packaging structure |
| 01/02/2013 | CN102856303A Semiconductor chip |
| 01/02/2013 | CN102856302A Three-dimensional packaging device for photonic integrated chip matching circuit |
| 01/02/2013 | CN102856301A Semiconductor device and production method therefor |
| 01/02/2013 | CN102856300A Device and method for placing predetermined element to target platform |
| 01/02/2013 | CN102856299A Interconnect barrier structure and method |
| 01/02/2013 | CN102856298A Transmission line structure |
| 01/02/2013 | CN102856297A Semiconductor apparatus and stacked semiconductor apparatus |
| 01/02/2013 | CN102856296A Stacked semiconductor package element |
| 01/02/2013 | CN102856295A Organic light-emitting display device and method of manufacturing the same |
| 01/02/2013 | CN102856294A Single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856293A First etched and then packaged packaging structure with single chip normally installed and without base islands as well as preparation method thereof |
| 01/02/2013 | CN102856292A Single-chip flip, packaging-after-etching and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856291A First etched and then packaged packaging structure with multiple chips normally installed and without base islands as well as preparation method thereof |
| 01/02/2013 | CN102856290A First etched and then packaged packaging structure with single chip reversedly installed and base islands buried as well as preparation method thereof |
| 01/02/2013 | CN102856289A First etched and then packaged packaging structure with single chip reversedly installed and base islands exposed and preparation method of structure |
| 01/02/2013 | CN102856288A First etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as preparation method thereof |
| 01/02/2013 | CN102856287A Multi-chip horizontal packaging, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856286A First packaged and then etched packaging structure with single chip normally installed and without base islands and preparation method of structure |
| 01/02/2013 | CN102856285A Single-chip flip, etching-after-packaging and pad embedded packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856284A Multi-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856283A First packaged and then etched packaging structure with single chip normally installed and base islands buried and preparation method of structure |
| 01/02/2013 | CN102856282A Laminated high melting point soldering layer and fabrication method for the same, and semiconductor device |
| 01/02/2013 | CN102856281A Semiconductor package and manufacturing method thereof |
| 01/02/2013 | CN102856280A Pad and chip |
| 01/02/2013 | CN102856279A Interconnect structure for wafer level package |
| 01/02/2013 | CN102856278A Adapter plate structure and manufacturing method thereof |
| 01/02/2013 | CN102856277A Graphene conductive plug and formation method thereof |
| 01/02/2013 | CN102856276A Semiconductor device and manufacture method thereof |
| 01/02/2013 | CN102856275A Cooling system |
| 01/02/2013 | CN102856274A Radiator buckle |
| 01/02/2013 | CN102856273A Semiconductor assembly structure with radiating fin and assembling method thereof |
| 01/02/2013 | CN102856272A Insulating and radiating electronic subassembly |
| 01/02/2013 | CN102856271A Multi-chip flip, packaging-after-etching and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856270A Single-chip flip, etching-after-packaging and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856269A Single-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856268A First packaged and then etched packaging structure with multiple chips normally installed and without base islands and preparation method of structure |
| 01/02/2013 | CN102856267A First packaged and then etched packaging structure with multiple chips reversedly installed and base islands buried and preparation method of structure |
| 01/02/2013 | CN102856266A Integrated insulating ceramic substrate |
| 01/02/2013 | CN102856265A Bottom plate with arc-shaped bosses for IGBT (Insulated Gate Bipolar Transistor) module |
| 01/02/2013 | CN102856264A Semiconductor package and semiconductor package manufacturing method |
| 01/02/2013 | CN102856263A Method for separating first substrate from second substrate |
| 01/02/2013 | CN102856262A Bump-on-trace structures with increased current entrance areas |
| 01/02/2013 | CN102856250A Integrated circuit with fin-based fuse, and related fabrication method |
| 01/02/2013 | CN102856246A Method for manufacturing semiconductor device and semiconductor device |
| 01/02/2013 | CN102856218A Method for attaching a metal surface to a carrier |
| 01/02/2013 | CN102856217A Machine and method for molding semiconductor device |
| 01/02/2013 | CN102856212A Flip etching-after-packaging manufacture method and packaging structure for chips with two sides and three-dimensional lines |
| 01/02/2013 | CN102856164A Method for improving clearness of alignment marks |
| 01/02/2013 | CN102854229A Integrated electronic sensor |
| 01/02/2013 | CN102853701A Evaporator for loop heat pipe and application of evaporator |
| 01/02/2013 | CN102850724A Green and environment-friendly epoxy resin composition for high-power device packaging |
| 01/02/2013 | CN102850721A Liquid resin composition for electronic components and electronic component device |
| 01/02/2013 | CN102382422B Epoxy resin composition with hydrated alumina |