| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/15/2015 | US20150016081 Electronic device with integrated circuit chip provided with an external electrical connection network |
| 01/15/2015 | US20150016064 Semiconductor device and manufacturing method therefor |
| 01/15/2015 | US20150016043 Integrated circuit package with a conductive grid formed in a packaging substrate |
| 01/15/2015 | US20150014868 Thin film transistor array substrate, method of manufacturing the same, and display device |
| 01/15/2015 | US20150014867 Resin composition and semiconductor device |
| 01/15/2015 | US20150014866 Semiconductor Device And Method For Producing A Glass-Like Layer |
| 01/15/2015 | US20150014865 Connection arrangement of an electric and/or electronic component |
| 01/15/2015 | US20150014864 Semiconductor package and method of fabricating the same |
| 01/15/2015 | US20150014862 Semiconductor packages including a metal layer between first and second semiconductor chips |
| 01/15/2015 | US20150014861 Embedded structures for package-on-package architecture |
| 01/15/2015 | US20150014860 Semiconductor chip connecting semiconductor package |
| 01/15/2015 | US20150014859 On-chip interconnects with reduced capacitance and method of fabrication thereof |
| 01/15/2015 | US20150014858 Semiconductor die and package with source down and sensing configuration |
| 01/15/2015 | US20150014857 Low-Resistance Electrode Design |
| 01/15/2015 | US20150014856 Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
| 01/15/2015 | US20150014855 Microelectronic packages and methods for the fabrication thereof |
| 01/15/2015 | US20150014854 Wafer level package solder barrier used as vacuum getter |
| 01/15/2015 | US20150014853 Semiconductor devices comprising edge doped graphene and methods of making the same |
| 01/15/2015 | US20150014852 Package assembly configurations for multiple dies and associated techniques |
| 01/15/2015 | US20150014851 Interconnect structure and method of fabricating same |
| 01/15/2015 | US20150014850 Interconnect structure |
| 01/15/2015 | US20150014849 Coreless package structure and method for manufacturing same |
| 01/15/2015 | US20150014848 Semiconductor device and fabrication method thereof |
| 01/15/2015 | US20150014847 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
| 01/15/2015 | US20150014846 Self-alignment Structure for Wafer Level Chip Scale Package |
| 01/15/2015 | US20150014845 Semiconductor module with interlocked connection |
| 01/15/2015 | US20150014844 Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same |
| 01/15/2015 | US20150014843 Semiconductor device with improved metal pillar configuration |
| 01/15/2015 | US20150014842 Semiconductor device and production method therefor |
| 01/15/2015 | US20150014841 Heat-transfer structure |
| 01/15/2015 | US20150014840 Semiconductor device and method of manufacturing the same |
| 01/15/2015 | US20150014839 Electronic Element Packaging Structure and Carrier Substrate Thereof |
| 01/15/2015 | US20150014838 Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof |
| 01/15/2015 | US20150014837 Image forming apparatus, chip, and chip package |
| 01/15/2015 | US20150014836 Electronic Module Assembly With Patterned Adhesive Array |
| 01/15/2015 | US20150014835 Solder flow impeding feature on a lead frame |
| 01/15/2015 | US20150014834 Hybrid lead frame and ball grid array package |
| 01/15/2015 | US20150014833 Quad flat semiconductor device with additional contacts |
| 01/15/2015 | US20150014832 Semiconductor Device Having Three Terminal Miniature Package |
| 01/15/2015 | US20150014831 Semiconductor device with corner tie bars |
| 01/15/2015 | US20150014830 Semiconductor device utilzing redistribution layers to couple stacked die |
| 01/15/2015 | US20150014829 Copper Leadframe Finish for Copper Wire Bonding |
| 01/15/2015 | US20150014828 Semiconductor Device Having Shielding Structure |
| 01/15/2015 | US20150014827 Uv protection for lightly doped regions |
| 01/15/2015 | US20150014811 Antifuses and methods of forming antifuses and antifuse structures |
| 01/15/2015 | US20150014781 Semiconductor device |
| 01/15/2015 | US20150014778 Multiple via structure and method |
| 01/15/2015 | US20150014775 Semiconductor device and method of fabricating the same |
| 01/15/2015 | US20150014759 Semiconductor device with air gap and method for fabricating the same |
| 01/15/2015 | US20150014743 IGBT with Emitter Electrode Electrically Connected with an Impurity Zone |
| 01/15/2015 | US20150014712 Source driver integrated circuit and display device comprising source driver integrated circuit |
| 01/15/2015 | US20150014688 Thin Wafer Handling and Known Good Die Test Method |
| 01/15/2015 | US20150014683 Semiconductor device |
| 01/15/2015 | US20150014554 Packaging for high power integrated circuits and infrared emitter arrays |
| 01/15/2015 | US20150014399 Conductive paste for die bonding, and die bonding method with the conductive paste |
| 01/15/2015 | US20150014031 Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof |
| 01/15/2015 | US20150013897 Resin sheet attaching method |
| 01/15/2015 | DE102014212957A1 Hochintegrierte leistungselektronische Modulbaugruppe Highly integrated power electronic module assembly |
| 01/15/2015 | DE102014212359A1 Halbleiterbauelement Semiconductor device |
| 01/15/2015 | DE102014211905A1 Halbleitervorrichtung Semiconductor device |
| 01/15/2015 | DE102014109771A1 Mehrchipvorrichtung Multi-chip device |
| 01/15/2015 | DE102014109748A1 Halbleitermodul mit formschlüssiger verbindung Semiconductor module with positive connection |
| 01/15/2015 | DE102014109665A1 Halbleitervorrichtung mit vergrabener Gateelektrode und Gatekontakten A semiconductor device with a buried gate electrode and gate contacts |
| 01/15/2015 | DE102014109662A1 Halbleiterchip und Gehäuse mit Source-Down- und Sensorkonfiguration Semiconductor chip and package with source-down and sensor configuration |
| 01/15/2015 | DE102014109609A1 Stromsensorvorrichtung Current sensor means |
| 01/15/2015 | DE102014109520A1 Paketbaugruppen-konfigurationen für mehrfach-dies und dazugehörige techniken Packet assembly configurations for multiple-this and related techniques |
| 01/15/2015 | DE102013213448A1 Elektronikbaugruppe mit Leistungshalbleiter Electronics module with power semiconductor |
| 01/15/2015 | DE102013212524A1 Thermoelektrische Temperiereinheit Thermoelectric temperature control |
| 01/15/2015 | DE102011012186B4 Chipmodul und Verfahren zur Bereitstellung eines Chipmoduls Chip module and method of providing a chip module |
| 01/15/2015 | DE102007019809B4 Gehäuste Schaltung mit einem wärmeableitenden Leitungsrahmen und Verfahren zum Häusen einer integrierten Schaltung Packaged circuit with a heat-dissipating management framework and procedures for housing an integrated circuit |
| 01/14/2015 | EP2824705A2 Semiconductor devices |
| 01/14/2015 | EP2824704A1 Electronic module and method for manufacturing same |
| 01/14/2015 | EP2824703A1 Semiconductor device |
| 01/14/2015 | EP2824702A1 Heat radiation plate and submarine apparatus |
| 01/14/2015 | EP2824701A1 High-power semiconductor module |
| 01/14/2015 | CN204103744U 一种mcm封装的电源模块 One kind mcm encapsulated power supply module |
| 01/14/2015 | CN204102895U 半导体封装结构 Semiconductor package structure |
| 01/14/2015 | CN204102893U 一种半导体测试结构 A semiconductor test structure |
| 01/14/2015 | CN204102892U Smt部品的焊盘结构和线路板 Smt parts of the pad structure and board |
| 01/14/2015 | CN204102891U 单芯片正装有基岛静电释放圈复合式平脚金属框架结构 Are equipped with a single-chip electrostatic discharge ring base island composite flat foot metal frame structure |
| 01/14/2015 | CN204102890U 单芯片正装有基岛复合式平脚金属框架结构 Are equipped with a single-chip hybrid flat foot Island-based metal frame structure |
| 01/14/2015 | CN204102889U 单芯片倒装有基岛散热块复合式平脚金属框架结构 There are single-chip-based flip-cooling block island composite flat foot metal frame structure |
| 01/14/2015 | CN204102888U 单芯片倒装无基岛复合式平脚金属框架结构 No single flip-chip-based island composite flat foot metal frame structure |
| 01/14/2015 | CN204102887U 多芯片堆叠倒正装器件有基岛复合式平脚金属框架结构 Multi-chip stack is loaded down devices have base island composite flat foot metal frame structure |
| 01/14/2015 | CN204102886U 单芯片正装无基岛复合式平脚金属框架结构 No single chip being installed base island composite flat foot metal frame structure |
| 01/14/2015 | CN204102885U 多芯片平铺倒装有基岛复合式平脚金属框架结构 There are tile-based flip-chip multi-island composite flat foot metal frame structure |
| 01/14/2015 | CN204102884U 多芯片堆叠倒装无源器件有基岛复合式平脚金属框架结构 Multi-chip stacked flip passives have flat feet base island composite metal frame structure |
| 01/14/2015 | CN204102883U 多芯片堆叠正装有基岛复合式平脚金属框架结构 Multi-chip stacking are equipped base island composite flat foot metal frame structure |
| 01/14/2015 | CN204102882U 高密度陶瓷封装用弹性引脚 High-density elastic pin ceramic package |
| 01/14/2015 | CN204102881U 一种芯片倒装系统化封装结构 A chip package structure flip systematic |
| 01/14/2015 | CN204102880U 一种换流阀组件冷却系统 One kind of commutation valve assembly cooling system |
| 01/14/2015 | CN204102879U 半导体封装结构 Semiconductor package structure |
| 01/14/2015 | CN204102878U 电力模块 Power Modules |
| 01/14/2015 | CN204102862U 一种基于腔体技术多芯片叠加封装装置 A cavity technique based on multi-chip package device superimposed |
| 01/14/2015 | CN104285372A 表面安装型压电振荡器 Surface mount type piezoelectric oscillator |
| 01/14/2015 | CN104285294A 半导体装置及该半导体装置的制造方法 Semiconductor device and method of manufacturing the semiconductor device |
| 01/14/2015 | CN104285293A 冷却构造体和电力转换装置 Cooling structure and the power conversion means |
| 01/14/2015 | CN104285292A 复合模块 Composite Modules |
| 01/14/2015 | CN104285287A 镀铝铜条带 Aluminum copper strips |
| 01/14/2015 | CN104284559A 电源装置和电源装置的制造方法 The method of manufacturing a power supply device and power supply device |