| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/03/2013 | WO2013001905A1 Lead frame and power module |
| 01/03/2013 | WO2013001735A1 Cooling system and electronic appliance equipped therewith, and electric automobile |
| 01/03/2013 | WO2013001705A1 Printed circuit board transmission system |
| 01/03/2013 | WO2013001692A1 Electronic device and noise suppression method |
| 01/03/2013 | WO2013001625A1 Electronic device |
| 01/03/2013 | WO2013001225A1 Connecting component equipped with hollow inserts |
| 01/03/2013 | WO2013001131A1 Method and system for testing integrated radio-frequency circuits at the wafer level and the use thereof |
| 01/03/2013 | WO2013000652A1 Electronic circuit arrangement for drawing heat from components which emit heat loss |
| 01/03/2013 | WO2013000484A1 Heat sink for cooling of power semiconductor modules |
| 01/03/2013 | WO2012134801A3 Stacked via structure for metal fuse applications |
| 01/03/2013 | US20130005087 Method and apparatus for molding semiconductor device |
| 01/03/2013 | US20130003303 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 01/03/2013 | US20130002915 Solid-state imaging device and electronic apparatus |
| 01/03/2013 | US20130002277 Semiconductor module, test system and method employing the same |
| 01/03/2013 | US20130002276 Semiconductor apparatus and testing method thereof |
| 01/03/2013 | US20130001810 Method of Manufacturing a Part of a MEMS System |
| 01/03/2013 | US20130001808 Encapsulation device having improved sealing |
| 01/03/2013 | US20130001807 Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method |
| 01/03/2013 | US20130001806 Fabrication process and device of multi-chip package having spliced substrates |
| 01/03/2013 | US20130001805 Power semiconductor module |
| 01/03/2013 | US20130001804 Semiconductor device and manufacturing method thereof |
| 01/03/2013 | US20130001803 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module |
| 01/03/2013 | US20130001802 Semiconductor device including insulating resin film provided in a space between semiconductor chips |
| 01/03/2013 | US20130001801 Methods to form self-aligned permanent on-chip interconnect structures |
| 01/03/2013 | US20130001800 Method of forming package-on-package and device related thereto |
| 01/03/2013 | US20130001799 Multi-Layer Interconnect Structure for Stacked Dies |
| 01/03/2013 | US20130001798 Semiconductor package |
| 01/03/2013 | US20130001797 Package on package using through substrate vias |
| 01/03/2013 | US20130001796 Semiconductor device |
| 01/03/2013 | US20130001795 Wafer Level Package and a Method of Forming the Same |
| 01/03/2013 | US20130001794 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 01/03/2013 | US20130001793 Package interconnects |
| 01/03/2013 | US20130001792 Semiconductor device |
| 01/03/2013 | US20130001791 Method and Apparatuses for Integrated Circuit Substrate Manufacture |
| 01/03/2013 | US20130001790 System on a chip with interleaved sets of pads |
| 01/03/2013 | US20130001789 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same |
| 01/03/2013 | US20130001788 Semiconductor Constructions |
| 01/03/2013 | US20130001787 Semiconductor device and production method therefor |
| 01/03/2013 | US20130001786 Overlapping contacts for semiconductor device |
| 01/03/2013 | US20130001785 Semiconductor device and method for manufacturing same |
| 01/03/2013 | US20130001784 Method and structure of forming silicide and diffusion barrier layer with direct deposited film on si |
| 01/03/2013 | US20130001783 Interconnect Barrier Structure and Method |
| 01/03/2013 | US20130001782 Laminated high melting point soldering layer and fabrication method for the same, and semiconductor device |
| 01/03/2013 | US20130001781 STRUCTURES AND METHODS FOR PHOTO-PATTERNABLE LOW-k (PPLK) INTEGRATION |
| 01/03/2013 | US20130001780 Multi-component integrated circuit contacts |
| 01/03/2013 | US20130001779 Stack package having flexible conductors |
| 01/03/2013 | US20130001778 Bump-on-trace (bot) structures |
| 01/03/2013 | US20130001777 Copper wire receiving pad |
| 01/03/2013 | US20130001776 Interconnect Structure for Wafer Level Package |
| 01/03/2013 | US20130001775 Conductive connecting member and manufacturing method of same |
| 01/03/2013 | US20130001774 Electrically conductive paste, and electrically conductive connection member produced using the paste |
| 01/03/2013 | US20130001773 Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump |
| 01/03/2013 | US20130001772 Semiconductor device and a method of manufacturing the same |
| 01/03/2013 | US20130001771 Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die |
| 01/03/2013 | US20130001770 Wafer level embedded and stacked die power system-in-package packages |
| 01/03/2013 | US20130001769 Bump-on-Trace Structures with Increased Current Entrance Areas |
| 01/03/2013 | US20130001768 Method of manufacturing an electronic system |
| 01/03/2013 | US20130001767 Package and method for manufacturing package |
| 01/03/2013 | US20130001766 Processing method and processing device of semiconductor wafer, and semiconductor wafer |
| 01/03/2013 | US20130001765 Integrated heater on mems cap for wafer scale packaged mems sensors |
| 01/03/2013 | US20130001764 Power device having reduced thickness |
| 01/03/2013 | US20130001763 Power device having high switching speed |
| 01/03/2013 | US20130001762 Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die |
| 01/03/2013 | US20130001761 Lead carrier with thermally fused package components |
| 01/03/2013 | US20130001760 Package substrate having die pad with outer raised portion and interior recessed portion |
| 01/03/2013 | US20130001759 Semiconductor package and method of manufacturing the semiconductor package |
| 01/03/2013 | US20130001758 Power Semiconductor Package |
| 01/03/2013 | US20130001757 Flip-chip qfn structure using etched lead frame |
| 01/03/2013 | US20130001756 Three-dimensional package structure |
| 01/03/2013 | US20130001755 Stacked semiconductor device and fabrication method for same |
| 01/03/2013 | US20130001741 Integrated circuit with a fin-based fuse, and related fabrication method |
| 01/03/2013 | US20130001736 High-voltage integrated circuit device |
| 01/03/2013 | US20130001697 Semiconductor device |
| 01/03/2013 | US20130001694 Low capacitance transient voltage suppressor (tvs) with reduced clamping voltage |
| 01/03/2013 | US20130001686 Electro-static discharge protection device |
| 01/03/2013 | US20130001655 Heat Dissipation Structure of SOI Field Effect Transistor |
| 01/03/2013 | US20130001552 Test pad structure for reuse of interconnect level masks |
| 01/03/2013 | US20130001551 Probe resistance measurement method and semiconductor device with pads for probe resistance measurement |
| 01/03/2013 | US20130001548 Semiconductor apparatus and stacked semiconductor apparatus |
| 01/03/2013 | US20130001547 Method for verifying the alignment between integrated electronic devices |
| 01/03/2013 | DE112010003252T5 Rippen-Antisicherung mit verringerter Programmierspannung Rib antifuse with reduced programming voltage |
| 01/03/2013 | DE102012208361A1 Integrierte drucksensordichtung Integrated pressure sensor seal |
| 01/03/2013 | DE102012207116A1 Mehrschichtverbindungsstrukturen und Verfahren für integrierte Schaltungen Multilayer interconnection structures and methods for integrated circuits |
| 01/03/2013 | DE102012206596A1 Halbleitervorrichtung Semiconductor device |
| 01/03/2013 | DE102012105840A1 Verfahren zum Befestigen einer Metallfläche auf einen Träger, Verfahren zum Befestigen eines Chips auf einen Chipträger, Chip-Packungs-Modul und Packungs-Modul A method of securing a metal surface on a substrate, method for mounting a chip on a chip carrier, the chip-package module and package-module |
| 01/03/2013 | DE102012012620A1 Sintered alumina-zirconia substrate for semiconductor device, has compact obtained by heating composition comprising aluminum oxide, zirconium oxide and/or yttrium oxide powder, and has preset thermal conductivity and flexural strength |
| 01/03/2013 | DE102011078460A1 Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten Electronic circuit arrangement for cooling loss of heat-emitting components |
| 01/03/2013 | DE102007044046B4 Verfahren zur internen Kontaktierung eines Leistungshalbleitermoduls Process for the internal contacting of a power semiconductor module |
| 01/02/2013 | EP2541605A1 CMOS compatible method for manufacturing a HEMT device and the HEMT device thereof |
| 01/02/2013 | EP2541595A2 Decoupling capacitor circuitry and method of forming the same |
| 01/02/2013 | EP2541594A1 Semiconductor module manufacturing method, semiconductor module, and manufacturing device |
| 01/02/2013 | EP2541593A2 Laminated high melting point soldering layer and fabrication method for the same, and semiconductor device |
| 01/02/2013 | EP2540776A2 Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| 01/02/2013 | EP2540775A2 Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| 01/02/2013 | EP2539933A1 Method and assembly for producing a semiconductor module |
| 01/02/2013 | EP2539932A1 Temperature-controlling system |
| 01/02/2013 | CN202652793U Shaft barrel structure and heat radiating module thereof |
| 01/02/2013 | CN202651123U Rectifier diode with controllable solder layer thickness |
| 01/02/2013 | CN202651122U Solar energy diode |
| 01/02/2013 | CN202651120U MOSFET field effect tube for suppressing gate source short circuit failure |