| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/09/2013 | CN102867758A Lug manufacturing process and structure thereof |
| 01/09/2013 | CN102867757A UBM etching methods for eliminating undercut |
| 01/09/2013 | CN102867476A 显示装置 The display device |
| 01/09/2013 | CN102865763A Capillary forming method and capillary forming structure for uniform temperature plate |
| 01/09/2013 | CN102863800A Organic silicon gel material for isolated gate bipolar transistor packaging |
| 01/09/2013 | CN102863743A Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | CN102349152B Ebullient cooling device |
| 01/09/2013 | CN102299153B Power semiconductor assembly with low grid input resistance and manufacturing method thereof |
| 01/09/2013 | CN102201449B Low-heat-resistance packaging structure of power MOS (Metal Oxide Semiconductor) device |
| 01/09/2013 | CN102157501B 三维系统级封装结构 Three-dimensional system-level package structure |
| 01/09/2013 | CN102130163B ESD (electrostatic discharge) high-voltage DMOS (diffused metal oxide semiconductor) device and manufacturing method thereof |
| 01/09/2013 | CN102074540B Matrix dual in-line package (DIP) lead frame, integrated circuit (IC) packages based on frame and production method of IC packages |
| 01/09/2013 | CN102067304B Cooling system for electronic structural units |
| 01/09/2013 | CN102054826B Novel baseplate-free power module |
| 01/09/2013 | CN102005417B Self-aligned protection layer for copper post structure |
| 01/09/2013 | CN101937900B Micro and millimeter wave circuit |
| 01/09/2013 | CN101877583B Buffer device and static discharge protection circuit |
| 01/09/2013 | CN101877339B Leadframe |
| 01/09/2013 | CN101853802B Method of measurement in semiconductor fabrication |
| 01/09/2013 | CN101852976B Projection apparatus |
| 01/09/2013 | CN101848326B Imaging apparatus |
| 01/09/2013 | CN101842871B Semiconductor device manufacturing method and semiconductor device |
| 01/09/2013 | CN101777579B Electrostatic protection element of isolated silicon-controlled rectifier |
| 01/09/2013 | CN101683011B Method for producing multilayer ceramic substrate and composite sheet |
| 01/09/2013 | CN101573784B Electrode structure and method for forming bump |
| 01/09/2013 | CN101562964B Heat-conducting medium protecting cover and heating abstractor with the protecting cover |
| 01/09/2013 | CN101562162B Pad structure of panel display device |
| 01/09/2013 | CN101540503B Esd protection circuit and method thereof |
| 01/09/2013 | CN101522792B Epoxy resin molding material for sealing and electronic component device |
| 01/09/2013 | CN101465345B Light source device Light source die set and method for manufacturing the light source device |
| 01/09/2013 | CN101310384B A method of substrate manufacture that decreases the package resistance |
| 01/09/2013 | CN101236955B 半导体器件 Semiconductor devices |
| 01/09/2013 | CN101131986B Method for manufacturing lead frame structure, semiconductor device and flip device |
| 01/08/2013 | USRE43912 Semiconductor integrated circuit |
| 01/08/2013 | USRE43909 Semiconductor device with a multilevel interconnection connected to a guard ring |
| 01/08/2013 | US8351794 Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling |
| 01/08/2013 | US8351634 Side-ported MEMS microphone assembly |
| 01/08/2013 | US8351217 Wiring board |
| 01/08/2013 | US8351214 Electronics module comprising an embedded microcircuit |
| 01/08/2013 | US8351210 Electronic apparatus |
| 01/08/2013 | US8350630 Method and system for LOGEN based on harmonics using microstrip techniques |
| 01/08/2013 | US8350586 Method and apparatus of deembedding |
| 01/08/2013 | US8350393 Apparatus and method for predetermined component placement to a target platform |
| 01/08/2013 | US8350392 Semiconductor device having recess with varying width and method of manufacturing the same |
| 01/08/2013 | US8350390 Wiring substrate and semiconductor device |
| 01/08/2013 | US8350389 Semiconductor device and information processing system including the same |
| 01/08/2013 | US8350388 Component built-in wiring board and manufacturing method of component built-in wiring board |
| 01/08/2013 | US8350387 Semiconductor device and semiconductor storage device |
| 01/08/2013 | US8350386 Top layers of metal for high performance IC's |
| 01/08/2013 | US8350385 Reduced bottom roughness of stress buffering element of a semiconductor component |
| 01/08/2013 | US8350384 Semiconductor device and method of forming electrical interconnect with stress relief void |
| 01/08/2013 | US8350383 IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods |
| 01/08/2013 | US8350382 Semiconductor device including electronic component coupled to a backside of a chip |
| 01/08/2013 | US8350381 Device and method for manufacturing a device |
| 01/08/2013 | US8350379 Package with power and ground through via |
| 01/08/2013 | US8350378 Press-fit power diode |
| 01/08/2013 | US8350377 Semiconductor device package structure and method for the same |
| 01/08/2013 | US8350376 Bondwireless power module with three-dimensional current routing |
| 01/08/2013 | US8350375 Flipchip bump patterns for efficient I-mesh power distribution schemes |
| 01/08/2013 | US8350374 Multi-chip package including chip address circuit |
| 01/08/2013 | US8350373 Chip stacked structure and method of fabricating the same |
| 01/08/2013 | US8350372 Semiconductor device including a DC-DC converter |
| 01/08/2013 | US8350371 Semiconductor device and method of manufacturing semiconductor device |
| 01/08/2013 | US8350370 Wide angle oval light emitting diode package |
| 01/08/2013 | US8350369 High power semiconductor package |
| 01/08/2013 | US8350368 Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure |
| 01/08/2013 | US8350367 Semiconductor device packages with electromagnetic interference shielding |
| 01/08/2013 | US8350364 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly |
| 01/08/2013 | US8350357 Semiconductor device including an inductor that is inductively coupled to another inductor |
| 01/08/2013 | US8350353 Method of manufacturing silicon carbide semiconductor device |
| 01/08/2013 | US8350345 Three-dimensional input control device |
| 01/08/2013 | US8350344 Semiconductor device and method of fabricating the same |
| 01/08/2013 | US8350338 Semiconductor device including high field regions and related method |
| 01/08/2013 | US8350329 Low trigger voltage electrostatic discharge NFET in triple well CMOS technology |
| 01/08/2013 | US8350317 Power semiconductor devices and methods of manufacture |
| 01/08/2013 | US8350276 Alternating current light emitting device |
| 01/08/2013 | US8350263 Semiconductor package, method of evaluating same, and method of manufacturing same |
| 01/08/2013 | US8349730 Transitional interface between metal and dielectric in interconnect structures |
| 01/08/2013 | US8349722 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
| 01/08/2013 | US8349721 Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding |
| 01/08/2013 | US8349710 Shielding techniques for an integrated circuit |
| 01/08/2013 | US8349707 Process for making contact with and housing integrated circuits |
| 01/08/2013 | US8349695 Work function adjustment in high-k gate stacks including gate dielectrics of different thickness |
| 01/08/2013 | US8349658 Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe |
| 01/08/2013 | US8349654 Method of fabricating stacked packages with bridging traces |
| 01/08/2013 | US8349649 Semiconductor device and manufacturing method thereof |
| 01/08/2013 | DE202012104718U1 Flüssigkeitskühlelement Liquid cooling element |
| 01/08/2013 | CA2630824C Semiconductor device |
| 01/08/2013 | CA2481616C Device package and methods for the fabrication and testing thereof |
| 01/03/2013 | WO2013002875A1 Compact thermal module |
| 01/03/2013 | WO2013002844A1 Integrated circuit design using through silicon vias |
| 01/03/2013 | WO2013002460A1 High heat-radiant optical device substrate and manufacturing method thereof |
| 01/03/2013 | WO2013002424A1 Heat exchange units |
| 01/03/2013 | WO2013002407A1 Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module |
| 01/03/2013 | WO2013002348A1 Light-emitting element substrate and light-emitting device |
| 01/03/2013 | WO2013002338A1 Semiconductor device and method for manufacturing semiconductor device |
| 01/03/2013 | WO2013002249A1 Semiconductor module |
| 01/03/2013 | WO2013002052A1 Curable resin composition for reflection of light, and optical semiconductor device |
| 01/03/2013 | WO2013001999A1 Circuit board for peripheral circuit in high-capacity module and high-capacity module including peripheral circuit using circuit board |
| 01/03/2013 | WO2013001971A1 Glass composition, glass for covering light emitting element, composite material for covering light emitting element, phosphor composite material, light emitting element-covering composite member, and phosphor composite member |