| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/10/2013 | US20130009278 Stacked semiconductor device including esd protection circuits and method of fabricating the stacked semiconductor device |
| 01/10/2013 | US20130009270 Backside illumination sensor having a bonding pad structure and method of making the same |
| 01/10/2013 | US20130009230 Optimization of critical dimensions and pitch of patterned features in and above a substrate |
| 01/10/2013 | US20130009200 Curable composition |
| 01/10/2013 | US20130009150 Semiconductor device, electronic device, wiring substrate, manufacturing method of semiconductor device, and manufacturing method of wiring substrate |
| 01/10/2013 | US20130009108 New compound semiconductors and their application |
| 01/10/2013 | US20130009107 New compound semiconductors and their application |
| 01/10/2013 | US20130009106 Compound semiconductors and their application |
| 01/10/2013 | US20130008701 Multilayer printed wiring board |
| 01/10/2013 | DE102012211547A1 Halbleitervorrichtung Semiconductor device |
| 01/10/2013 | DE102012210440A1 Halbleitermodul Semiconductor module |
| 01/10/2013 | DE102012105929A1 Halbleiter-Bauelement mit einem Kontaktclip mit Vorsprüngen und Herstellung davon Semiconductor device with a contact clip with projections and preparation thereof |
| 01/10/2013 | DE102012105848A1 Rissdetektionslinien-Einrichtung und Verfahren Crack detection line means and methods |
| 01/10/2013 | DE102011078806A1 Leistungselektronisches System mit einer Kühleinrichtung Power electronic system with a cooling device |
| 01/10/2013 | DE102011078674A1 Kühlbauteil Cooling component |
| 01/10/2013 | DE102011078619A1 LED light source has electrically conductive connections which are provided with respect to conductor tracks, mounting portions and reserve area for bridging the defective LED chip |
| 01/10/2013 | DE102011078584A1 Kühlbauteil Cooling component |
| 01/10/2013 | DE102011078582A1 Verfahren zum Herstellen von strukturierten Sinterschichten und Halbleiterbauelement mit strukturierter Sinterschicht A process for producing structured sinter layers and semiconductor device with structured sintered layer |
| 01/10/2013 | DE102011056564B3 Shielded housing for high frequency circuit used in distribution amplifier for cable TV, has receiving device which receives circuit board positioned in housing region lying between bottom portion and shield plate |
| 01/10/2013 | DE102011056178A1 Rückseitenbelichtungssensor mit einer Bonding-Flächenstruktur und Herstellungsverfahren für denselben Back-illuminated sensor with a bonding surface structure and manufacturing method thereof |
| 01/10/2013 | DE102011003234A1 Nicht-direkt verbundene Halbleitervorrichtung mit isoliertem Kupfer und lateraler weiter Bandlücke Non-directly connected semiconductor device with insulated copper and lateral band gap further |
| 01/10/2013 | DE102010008485B4 Leistungshalbleitergerät Power semiconductor device |
| 01/10/2013 | DE102006057041B4 Halbleitervorrichtungen mit Struktur zum Erfassen von elektrischem Strom Semiconductor devices with structures for detecting electric current |
| 01/09/2013 | EP2544234A1 Method for manufacturing a light emitting device |
| 01/09/2013 | EP2544231A2 High performance electronics system with a cooling device |
| 01/09/2013 | EP2544229A1 Power semiconductor arrangement |
| 01/09/2013 | EP2544228A2 High performance electronics system with a cooling device |
| 01/09/2013 | EP2544227A1 Non-volatile memory cell structure and method for programming and reading the same |
| 01/09/2013 | EP2543750A1 Heat sink material |
| 01/09/2013 | EP2543705A2 Epoxy resin composition for electronic component encapsulation and electronic component device using the same |
| 01/09/2013 | EP2543466A1 Method of forming microstructures, laser irradiation device, and substrate |
| 01/09/2013 | EP2543066A2 Thermal vias in an integrated circuit package with an embedded die |
| 01/09/2013 | EP2543065A1 Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same |
| 01/09/2013 | EP2543064A1 Multi-chip integrated circuit |
| 01/09/2013 | EP2542627A1 Method of making a coated article, coating including an alloyed carbon nanotube thin film |
| 01/09/2013 | EP2542351A2 Dispenser for highly viscous fluid |
| 01/09/2013 | CN202663688U Packaging module for underground power element |
| 01/09/2013 | CN202662615U 轴向二极管 Axial Diodes |
| 01/09/2013 | CN202662596U Coreless adapter plate packaging structure adopting two-dimensional arrangement mode |
| 01/09/2013 | CN202662595U Quad-flat no-lead integrated circuit (IC) chip package piece arranged in multiple rings |
| 01/09/2013 | CN202662594U Infrared remote control receiving amplifier |
| 01/09/2013 | CN202662593U 半导体器件 Semiconductor devices |
| 01/09/2013 | CN202662592U Wireless transceiver chip |
| 01/09/2013 | CN202662591U Pouring rectifier bridge convenient for positioning and installation |
| 01/09/2013 | CN202662590U Radiator convenient for installation |
| 01/09/2013 | CN202662589U Switching device with fly-wheel diode |
| 01/09/2013 | CN202662588U Novel power semiconductor device |
| 01/09/2013 | CN202662587U 半导体模块 Semiconductor Modules |
| 01/09/2013 | CN202662586U Airtight high-end aluminum and silicon packaging casing structure |
| 01/09/2013 | CN102870326A Surface acoustic wave device and manufacturing method of same |
| 01/09/2013 | CN102870221A Thin film transistor substrate, liquid crystal display device provided with same, and thin film transistor substrate production method |
| 01/09/2013 | CN102870213A Epoxy coating on substrate for die attach |
| 01/09/2013 | CN102870212A Structure and method for manufacturing interconnect structures having self-aligned dielectric caps |
| 01/09/2013 | CN102870211A A flow distributor |
| 01/09/2013 | CN102870210A Substrate on which element is to be mounted, and process for production thereof |
| 01/09/2013 | CN102870209A Method for manufacturing circuit device |
| 01/09/2013 | CN102870208A Electronic component and method for producing same |
| 01/09/2013 | CN102870207A 半导体装置 Semiconductor device |
| 01/09/2013 | CN102870203A Protruding TSV tips for enhanced heat dissipation for IC devices |
| 01/09/2013 | CN102870192A Three dimensional inductor and transformer design methodology of glass technology |
| 01/09/2013 | CN102869943A Ebullient cooling device |
| 01/09/2013 | CN102869697A Curable resin composition and cured article thereof |
| 01/09/2013 | CN102869236A Cooling device for a power module, and a related method thereof |
| 01/09/2013 | CN102868166A Thyristor valve module for horizontal water-cooling static var compensator |
| 01/09/2013 | CN102867847A Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
| 01/09/2013 | CN102867829A Anti-fuse memory ultilizing a coupling channel and operating method thereof |
| 01/09/2013 | CN102867823A Array substrate and manufacturing method and display device thereof |
| 01/09/2013 | CN102867817A Power electronic system with cooling device |
| 01/09/2013 | CN102867816A Power electronics system with cooling device |
| 01/09/2013 | CN102867815A Power module package and method for manufacturing the same |
| 01/09/2013 | CN102867814A Chip packaging body |
| 01/09/2013 | CN102867813A 电子装置 Electronic devices |
| 01/09/2013 | CN102867812A Crack detection line device and method |
| 01/09/2013 | CN102867811A Semiconductor structure and manufacturing method thereof as well as method for manufacturing layouts of semiconductor |
| 01/09/2013 | CN102867810A Dual damascene structure with porous structure |
| 01/09/2013 | CN102867809A 集成电路变压器 IC transformer |
| 01/09/2013 | CN102867808A Package structure and method for fabricating the same |
| 01/09/2013 | CN102867807A Coreless packaging substrate and method of fabricating the same |
| 01/09/2013 | CN102867806A Packaging substrate and fabrication method thereof |
| 01/09/2013 | CN102867805A Semiconductor packager and manufacturing method therefor |
| 01/09/2013 | CN102867804A Semiconductor device including a contact clip having protrusions and manufacturing thereof |
| 01/09/2013 | CN102867803A Bond line thickness control for die attachment |
| 01/09/2013 | CN102867802A Multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867801A Semiconductor carrier, package and fabrication method thereof |
| 01/09/2013 | CN102867800A Connecting function chips to a package to form package-on-package |
| 01/09/2013 | CN102867799A Packaging substrate and method of fabricating the same |
| 01/09/2013 | CN102867798A Coreless package substrate and fabrication method thereof |
| 01/09/2013 | CN102867797A Solder ball structure by electronic packaging |
| 01/09/2013 | CN102867796A 3D (three-dimensional) integrated circuit structure and method for detecting alignment of chip structures |
| 01/09/2013 | CN102867795A Semiconductor device and method of manufacturing the same |
| 01/09/2013 | CN102867794A 半导体模块 Semiconductor Modules |
| 01/09/2013 | CN102867793A Thermal interface material and semiconductor packaging structure |
| 01/09/2013 | CN102867792A Semiconductor device and method of manufacturing the same |
| 01/09/2013 | CN102867791A Multi-chip reversely-arranged etched-encapsulated base island-buried encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867790A Multi-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867789A Single-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof |
| 01/09/2013 | CN102867788A Power module based on novel metal-coated ceramic substrate |
| 01/09/2013 | CN102867787A Flat plate type IGBT (insulated gate bipolar transistor) module packaging structure |
| 01/09/2013 | CN102867786A Chip-stacked semiconductor package |
| 01/09/2013 | CN102867776A Forming wafer-level chip scale package structures with reduced number of seed layers |