| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/2013 | CN101944524B Semiconductor device |
| 01/16/2013 | CN101932219B Water-cooling device and manufacturing method thereof |
| 01/16/2013 | CN101872742B Semiconductor device and manufacturing method |
| 01/16/2013 | CN101819965B Semiconductor device |
| 01/16/2013 | CN101803018B Security chip |
| 01/16/2013 | CN101779285B Unit and production of a unit |
| 01/16/2013 | CN101764145B Organic light emitting diode display |
| 01/16/2013 | CN101715284B Fixed structure |
| 01/16/2013 | CN101587831B Semiconductor component structure and method for manufacturing semiconductor component |
| 01/16/2013 | CN101533819B Semiconductor packaging structure, lead frame and conductive part which are applied to semiconductor packaging structure |
| 01/16/2013 | CN101533818B Encapsulation structure of integrated circuit element and method for manufacturing same |
| 01/16/2013 | CN101533807B Frit sealing system and method of manufacturing organic light emitting display device |
| 01/16/2013 | CN101510542B Encapsulation structure and manufacturing method for high power light-emitting diode chip |
| 01/16/2013 | CN101379601B Nitrogen based implants for defect reduction in strained silicon |
| 01/16/2013 | CN101374402B Rack system and method for circuit board heat exchanger |
| 01/16/2013 | CN101374401B Controllable heat transmission medium system used with a circuit and method thereof |
| 01/16/2013 | CN101055856B Connecting device for electronic component |
| 01/15/2013 | US8356268 Integrated circuit device including dynamic array section with gate level having linear conductive features on at least three side-by-side lines and uniform line end spacings |
| 01/15/2013 | US8356262 Cell architecture and method |
| 01/15/2013 | US8354754 Layered chip for use in soldering |
| 01/15/2013 | US8354752 Semiconductor devices |
| 01/15/2013 | US8354751 Interconnect structure for electromigration enhancement |
| 01/15/2013 | US8354750 Stress buffer structures in a mounting structure of a semiconductor device |
| 01/15/2013 | US8354749 Method for efficiently producing removable peripheral cards |
| 01/15/2013 | US8354748 In-package microelectronic apparatus, and methods of using same |
| 01/15/2013 | US8354747 Conductive polymer lid for a sensor package and method therefor |
| 01/15/2013 | US8354745 Electronic assembly |
| 01/15/2013 | US8354744 Stacked semiconductor package having reduced height |
| 01/15/2013 | US8354743 Multi-tiered integrated circuit package |
| 01/15/2013 | US8354742 Method and apparatus for a package having multiple stacked die |
| 01/15/2013 | US8354741 Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package |
| 01/15/2013 | US8354740 Top-side cooled semiconductor package with stacked interconnection plates and method |
| 01/15/2013 | US8354739 Thin semiconductor package and method for manufacturing same |
| 01/15/2013 | US8354735 Semiconductor chips having guard rings and methods of fabricating the same |
| 01/15/2013 | US8354734 Semiconductor device with crack prevention ring |
| 01/15/2013 | US8354724 Semiconductor device and electronic device |
| 01/15/2013 | US8354671 Integrated circuit with adaptive VGG setting |
| 01/15/2013 | US8354343 Semiconductor structure and manufacturing method of the same |
| 01/15/2013 | US8354342 Semiconductor device with side-junction and method for fabricating the same |
| 01/15/2013 | US8354340 Electronic device and method of manufacturing the same |
| 01/15/2013 | US8354338 Carrier board structure with embedded semiconductor chip and fabrication method thereof |
| 01/15/2013 | US8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits |
| 01/15/2013 | US8353829 Analyte monitoring device and methods of use |
| 01/15/2013 | US8353459 Semiconductor device and method for manufacturing the same |
| 01/15/2013 | CA2507431C Single package multi-chip rf power amplifier |
| 01/10/2013 | WO2013006337A1 Half-through vias for suppression of substrate modes |
| 01/10/2013 | WO2013005858A1 Curable silicon composition, cured product thereof, and optical semiconductor device |
| 01/10/2013 | WO2013005622A1 Cooling device and method for manufacturing same |
| 01/10/2013 | WO2013005471A1 Resin composition |
| 01/10/2013 | WO2013004543A1 Method for producing structured sintering connection layers and semiconductor component comprising a structured sintering connection layer |
| 01/10/2013 | WO2013004532A1 Cooling component |
| 01/10/2013 | WO2013004528A1 Cooling component |
| 01/10/2013 | WO2013004297A1 Short-circuit failure mode with multiple device breakdown |
| 01/10/2013 | WO2013004083A1 Shielding structure of flexible substrate package and fabricating process thereof |
| 01/10/2013 | WO2012155115A9 Stacked dram device and method of manufacture |
| 01/10/2013 | WO2012148869A3 Contact metal for hybridization and related methods |
| 01/10/2013 | US20130010199 Semiconductor device, dc-to-dc converter, and receiver |
| 01/10/2013 | US20130009328 Alignment mark, semiconductor having the alignment mark, and fabricating method of the alignment mark |
| 01/10/2013 | US20130009327 Resin composition for semiconductor encapsulation, and semiconductor device using same |
| 01/10/2013 | US20130009326 Manufacturing method of chip package with coplanarity controlling feature |
| 01/10/2013 | US20130009325 Semiconductor element-embedded substrate, and method of manufacturing the substrate |
| 01/10/2013 | US20130009324 Universal inter-layer interconnect for multi-layer semiconductor stacks |
| 01/10/2013 | US20130009323 Interconnect structure and method of fabricating |
| 01/10/2013 | US20130009322 Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor |
| 01/10/2013 | US20130009321 Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
| 01/10/2013 | US20130009320 Semiconductor package and method of manufacturing the same |
| 01/10/2013 | US20130009319 Apparatus and Methods for Forming Through Vias |
| 01/10/2013 | US20130009318 Stacked memory layers having multiple orientations and through-layer interconnects |
| 01/10/2013 | US20130009317 Forming grounded through-silicon vias in a semiconductor substrate |
| 01/10/2013 | US20130009316 Apparatus and Methods for Dicing Interposer Assembly |
| 01/10/2013 | US20130009315 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 01/10/2013 | US20130009314 Test circuit, integrated circuit, and test circuit layout method |
| 01/10/2013 | US20130009313 Semiconductor device packages with solder joint enhancement element and related methods |
| 01/10/2013 | US20130009312 Interconnect structure fabricated without dry plasma etch processing |
| 01/10/2013 | US20130009311 Semiconductor carrier, package and fabrication method thereof |
| 01/10/2013 | US20130009310 Semiconductor device structures and compositions for forming same |
| 01/10/2013 | US20130009309 Conductive chip disposed on lead semiconductor package and methods of making the same |
| 01/10/2013 | US20130009308 Semiconductor stack package apparatus |
| 01/10/2013 | US20130009307 Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers |
| 01/10/2013 | US20130009306 Packaging substrate and fabrication method thereof |
| 01/10/2013 | US20130009305 Semiconductor device and method of manufacturing the same |
| 01/10/2013 | US20130009304 Chip-stacked semiconductor package |
| 01/10/2013 | US20130009303 Connecting Function Chips To A Package To Form Package-On-Package |
| 01/10/2013 | US20130009302 Semiconductor device and manufacturing method therefor |
| 01/10/2013 | US20130009301 Magnesium-based composite member, heat radiation member, and semiconductor device |
| 01/10/2013 | US20130009300 Semiconductor device and method for manufacturing same |
| 01/10/2013 | US20130009299 Semiconductor device and method of manufacturing the same |
| 01/10/2013 | US20130009298 Semiconductor module |
| 01/10/2013 | US20130009297 Semiconductor device package having configurable lead frame fingers |
| 01/10/2013 | US20130009296 Semiconductor device package having features formed by stamping |
| 01/10/2013 | US20130009295 Semiconductor Device Including a Contact Clip Having Protrusions and Manufacturing Thereof |
| 01/10/2013 | US20130009294 Multi-chip package having leaderframe-type contact fingers |
| 01/10/2013 | US20130009293 Packaging substrate and method of fabricating the same |
| 01/10/2013 | US20130009292 Semiconductor device |
| 01/10/2013 | US20130009291 Power module package and method for manufacturing the same |
| 01/10/2013 | US20130009289 Semiconductor device |
| 01/10/2013 | US20130009288 Semiconductor device and method for fabricating the same |
| 01/10/2013 | US20130009286 Semiconductor chip and flip-chip package comprising the same |
| 01/10/2013 | US20130009285 Semiconductor chip and semiconductor wafer |
| 01/10/2013 | US20130009284 Substrate dividing method |