| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/17/2013 | US20130015569 Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die |
| 01/17/2013 | US20130015568 Getter structure with optimized pumping capacity |
| 01/17/2013 | US20130015567 Semiconductor device and production method for same |
| 01/17/2013 | US20130015566 Apparatus and methods for quad flat no lead packaging |
| 01/17/2013 | US20130015565 Substrate structure, semiconductor device array and semiconductor device having the same |
| 01/17/2013 | US20130015564 Semiconductor device and method of manufacturing same |
| 01/17/2013 | US20130015563 Semiconductor package |
| 01/17/2013 | US20130015553 High Voltage Isolation Trench, Its Fabrication Method and MOS Device |
| 01/17/2013 | US20130015504 Tsv structure and method for forming the same |
| 01/17/2013 | US20130015497 Source/drain region, contact hole and method for forming the same |
| 01/17/2013 | US20130015467 System and Method for Wafer Level Packaging |
| 01/17/2013 | US20130015440 Integrated circuit (ic) test probe |
| 01/17/2013 | DE112010005038T5 Eingelassenes und eingebettetes kernloses Chipgehäuse Taken and embedded coreless chip package |
| 01/17/2013 | DE10300594B4 Bauelement und Verfahren Device and method |
| 01/17/2013 | DE102012212152A1 Chip, der eine integrierte schaltung aufweist, herstellungsverfahren und verfahren zum lokalen leitfähigmachen einer kohlenstoffhaltigen schicht Chip having an integrated circuit manufacturing process and methods for local leitfähigmachen a carbon-containing layer |
| 01/17/2013 | DE102012212119A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 01/17/2013 | DE102012211424A1 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation |
| 01/17/2013 | DE102009061071B3 Method for producing semiconductor component used for laser-fired contact solar cell module, involves producing electrically conductive contact between contact layer made of easily solderable metal, and semiconductor substrate |
| 01/16/2013 | EP2547000A1 Signal transmitting apparatus |
| 01/16/2013 | EP2546872A1 Heat insulation/heat dissipation sheet and intra-device structure |
| 01/16/2013 | EP2546871A1 Heat dissipating structure and production method therefor |
| 01/16/2013 | EP2546870A2 Metal-bonded ceramic substrate |
| 01/16/2013 | EP2546869A1 Semiconductor device, and process for manufacture of semiconductor device |
| 01/16/2013 | EP2546868A1 Process for production of semiconductor device, and semiconductor device |
| 01/16/2013 | EP2546306A1 Curable composition, hardened material, and method for using curable composition |
| 01/16/2013 | EP2545754A2 Attachment of a device to a substrate for operation under variable conditions |
| 01/16/2013 | EP2545585A2 Porous and non-porous nanostructures |
| 01/16/2013 | EP2545584A2 Package having spaced apart heat sink |
| 01/16/2013 | EP2545503A1 Electronic device having a chip and method for manufacturing by coils |
| 01/16/2013 | EP2544598A1 Waterproof stretchable optoelectronics |
| 01/16/2013 | DE202012004681U1 Kühlkörper Heat Sink |
| 01/16/2013 | CN202679262U Three phase bridge apparatus |
| 01/16/2013 | CN202679259U 三相桥式整流模块 Three-phase bridge rectifier modules |
| 01/16/2013 | CN202678318U High junction temperature high power diode |
| 01/16/2013 | CN202678316U Axial diode electrode leading wire with diversion trenches |
| 01/16/2013 | CN202678313U A semiconductor device used for protecting components from electro-static discharge damage and an integrated circuit |
| 01/16/2013 | CN202678312U Thick film circuit based on self-assembly molecular film protection |
| 01/16/2013 | CN202678305U Germanium microelectronic product |
| 01/16/2013 | CN202678304U AAQFN product-based packaging member receiving secondary plastic packaging |
| 01/16/2013 | CN202678303U Lead frame |
| 01/16/2013 | CN202678302U Fanout-type wafer level chip packaging structure |
| 01/16/2013 | CN202678301U Wafer level chip scale package and integrated circuit package for small, high capacity bare die |
| 01/16/2013 | CN102884877A Cooling device with a plurality of fin pitches |
| 01/16/2013 | CN102884872A Multilayer wiring board and method for manufacturing multilayer wiring board |
| 01/16/2013 | CN102884623A Microelectronic package with terminals on dielectric mass |
| 01/16/2013 | CN102884622A Resonance optimized bonding wire with a sigmoid shaped loop |
| 01/16/2013 | CN102884621A Methods of forming contact structures including alternating metal and silicon layers and related devices |
| 01/16/2013 | CN102884620A Temperature controlling device, cooling device, and method for manufacturing temperature controlling device |
| 01/16/2013 | CN102884619A Component for accommodating electronic component, electronic module, and electronic device |
| 01/16/2013 | CN102884618A Element housing package, and electronic device using the same |
| 01/16/2013 | CN102884617A 半导体装置 Semiconductor device |
| 01/16/2013 | CN102884135A Resin composition for printed circuit board |
| 01/16/2013 | CN102883582A Heat dissipation device |
| 01/16/2013 | CN102883580A 散热器组合 Radiator combination |
| 01/16/2013 | CN102882403A Inverter circuit and structure thereof |
| 01/16/2013 | CN102881986A Semiconductor package |
| 01/16/2013 | CN102881683A Double-chip glass-sealed diode |
| 01/16/2013 | CN102881682A Power semiconductor device |
| 01/16/2013 | CN102881680A Semiconductor device and method of manufacturing same |
| 01/16/2013 | CN102881679A IGBT (insulated gate bipolar transistor) chip integrating temperature and current sensing function |
| 01/16/2013 | CN102881678A Mechanisms for marking the orientation of a sawed die |
| 01/16/2013 | CN102881677A Alloy copper diffusion barrier layer for copper interconnection and manufacturing method thereof |
| 01/16/2013 | CN102881676A Laminating wiring film used in electronic part |
| 01/16/2013 | CN102881675A Structure and method for high performance interconnect |
| 01/16/2013 | CN102881674A Metal-insulator-metal (MIM) capacitor and manufacturing method thereof |
| 01/16/2013 | CN102881673A Copper damascene structure and manufacturing method thereof |
| 01/16/2013 | CN102881672A Electronic device and pin thereof |
| 01/16/2013 | CN102881671A Single-chip front-mounted etching-first package-followed island-exposed package structure and manufacturing method thereof |
| 01/16/2013 | CN102881670A Multi-chip positive packaging structure for embedding basic island by first packaging and second etching, and manufacturing method for multi-chip positive packaging structure |
| 01/16/2013 | CN102881669A Integrated circuit with temperature increasing element and electronic system having the same |
| 01/16/2013 | CN102881668A IGBT (Insulated Gate Bipolar Translator) module radiating structure |
| 01/16/2013 | CN102881667A 半导体封装构造 Semiconductor package |
| 01/16/2013 | CN102881666A Wafer level packaging device |
| 01/16/2013 | CN102881665A System and method for wafer level packaging |
| 01/16/2013 | CN102881664A Multi-chip inversely-mounted package-first etching-followed island-free package structure and manufacturing method thereof |
| 01/16/2013 | CN102881663A Metal-coated ceramic substrate with radiating function |
| 01/16/2013 | CN102881662A Method for machining optical device wafer |
| 01/16/2013 | CN102881661A Semiconductor chip with rpobe pad above angle of stress relieving area |
| 01/16/2013 | CN102881660A Semiconductor device and test method |
| 01/16/2013 | CN102881659A Semiconductor device and method of manufacturing the same |
| 01/16/2013 | CN102881644A Method for packaging wafer level chip |
| 01/16/2013 | CN102881602A Integrating method of working temperature controllable multi-chip component |
| 01/16/2013 | CN102881589A Crimping IGBT (insulated gate bipolar transistor) module and method for manufacturing same |
| 01/16/2013 | CN102881580A Method for manufacturing a semiconductor device |
| 01/16/2013 | CN102879961A Display panel and display device |
| 01/16/2013 | CN102876277A Adhesive composition, circuit connecting material using same, method for connecting circuit members, and circuit connection structure |
| 01/16/2013 | CN102876245A Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductor |
| 01/16/2013 | CN102875974A Epoxy resin composition for semiconductor sealing and semiconductor device |
| 01/16/2013 | CN102280427B Silicon controlled packaging structure capable of packaging metal and plastic in mixed mode and method thereof |
| 01/16/2013 | CN102244056B Bonding structure for bonding semiconductor wafer |
| 01/16/2013 | CN102165587B Method for fabricating a through interconnect on a semiconductor substrate |
| 01/16/2013 | CN102159913B Cooling member, and method and device for manufacturing same |
| 01/16/2013 | CN102157468B High-power loop heat pipe radiator and manufacturing method thereof |
| 01/16/2013 | CN102130088B Semiconductor packaging structure and making method thereof |
| 01/16/2013 | CN102130084B Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 01/16/2013 | CN102054710B Manufacturing method of coreless layer capsulation substrate |
| 01/16/2013 | CN102046690B Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 01/16/2013 | CN101998763B Connection structure of bare chip and printed circuit board, printed circuit board and communication equipment |
| 01/16/2013 | CN101996962B Electronic component module and radio communications equipment |
| 01/16/2013 | CN101965637B Integrated circuit with mosfet fuse element |