| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/23/2013 | CN102067296B Jig for aligning leadframe |
| 01/23/2013 | CN102024778B 导线架及芯片封装体 Leadframe and chip package |
| 01/23/2013 | CN102007609B Light-emitting diode package |
| 01/23/2013 | CN101986428B Power semiconductor component, power semiconductor assembly including the same and a method for operating the power semiconductor assembly |
| 01/23/2013 | CN101978491B Semiconductor chip package assembly method and apparatus for countering leadfinger deformation |
| 01/23/2013 | CN101937919B Three-dimensional nonvolatile memory device and method for fabricating the same |
| 01/23/2013 | CN101937888B Circuit, system and method for controlling radiating of multiple units on circuit board |
| 01/23/2013 | CN101926004B Electrostatic discharge protection |
| 01/23/2013 | CN101908514B Semiconductor device |
| 01/23/2013 | CN101874295B Method for manufacturing flexible semiconductor device and multilayer film used therein |
| 01/23/2013 | CN101853823B Heat sink and manufacturing method thereof |
| 01/23/2013 | CN101849286B Semiconductor chip having power supply line with minimized voltage drop |
| 01/23/2013 | CN101849284B Structure for reducing warp of substrate |
| 01/23/2013 | CN101819971B Thin film transistor for liquid crystal display |
| 01/23/2013 | CN101806440B Light emitting diode lamp |
| 01/23/2013 | CN101800227B Thin film transistor array substrate and manufacturing method thereof |
| 01/23/2013 | CN101728421B Organic el display and method of manufacturing the same |
| 01/23/2013 | CN101728413B Light emitting display and method of manufacturing the same |
| 01/23/2013 | CN101728358B Wiring structure and method for fabricating the same |
| 01/23/2013 | CN101728318B Semiconductor device and method for manufacturing the same |
| 01/23/2013 | CN101605442B 散热装置 Cooling devices |
| 01/23/2013 | CN101583259B Fastener and radiation device assembly using same |
| 01/23/2013 | CN101577258B Electronic component and resin packaging method for electronic component |
| 01/23/2013 | CN101552248B A semiconductor device and a manufacturing method thereof |
| 01/23/2013 | CN101459176B 半导体器件 Semiconductor devices |
| 01/23/2013 | CN101447477B Light emitting diode package, method for fabricating the same and backlight assembly including the same |
| 01/23/2013 | CN101365293B Electromagnetic bandgap structure and printed circuit board |
| 01/22/2013 | US8358514 Electronic control device |
| 01/22/2013 | US8358018 Resin sealing structure for electronic component and resin sealing method for electronic component |
| 01/22/2013 | US8358017 Semiconductor package featuring flip-chip die sandwiched between metal layers |
| 01/22/2013 | US8358016 Semiconductor package having an internal cooling system |
| 01/22/2013 | US8358015 Layered chip package and method of manufacturing same |
| 01/22/2013 | US8358014 Structure and method for power field effect transistor |
| 01/22/2013 | US8358013 Leadless multi-chip module structure |
| 01/22/2013 | US8358011 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 01/22/2013 | US8358010 Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method |
| 01/22/2013 | US8358009 Semiconductor device |
| 01/22/2013 | US8358008 Semiconductor device |
| 01/22/2013 | US8358007 Integrated circuit system employing low-k dielectrics and method of manufacture thereof |
| 01/22/2013 | US8358006 Semiconductor device |
| 01/22/2013 | US8358005 Packaged gallium nitride material transistors and methods associated with the same |
| 01/22/2013 | US8358004 Surface mount silicon condenser microphone package |
| 01/22/2013 | US8358003 Surface mount electronic device packaging assembly |
| 01/22/2013 | US8358002 Window ball grid array (BGA) semiconductor packages |
| 01/22/2013 | US8358001 Semiconductor device packages, redistribution structures, and manufacturing methods thereof |
| 01/22/2013 | US8358000 Double side cooled power module with power overlay |
| 01/22/2013 | US8357999 Assembly having stacked die mounted on substrate |
| 01/22/2013 | US8357998 Wirebonded semiconductor package |
| 01/22/2013 | US8357997 Organic EL device and manufacturing method thereof |
| 01/22/2013 | US8357996 Devices with crack stops |
| 01/22/2013 | US8357993 Structure in a high voltage path of an ultra-high voltage device for providing ESD protection |
| 01/22/2013 | US8357992 Non-volatile memory device and method of manufacturing the same |
| 01/22/2013 | US8357991 Semiconductor device having interconnect structure for MIM capacitor and fuse elements |
| 01/22/2013 | US8357987 Chip package and fabrication method thereof |
| 01/22/2013 | US8357935 Electronic component having an authentication pattern |
| 01/22/2013 | US8357934 Semiconductor-based sub-mounts for optoelectronic devices with conductive paths |
| 01/22/2013 | US8357932 Test pad structure for reuse of interconnect level masks |
| 01/22/2013 | US8357931 Flip chip semiconductor die internal signal access system and method |
| 01/22/2013 | US8357091 Analyte monitoring device and methods of use |
| 01/22/2013 | CA2520992C Method for manufacturing an electronic module and an electronic module |
| 01/17/2013 | WO2013010118A1 Growth of bulk group-iii nitride crystals |
| 01/17/2013 | WO2013010038A2 Heat transfer system with integrated evaporator and condenser |
| 01/17/2013 | WO2013009853A2 Electronic assembly including die on substrate with heat spreader having an open window on the die |
| 01/17/2013 | WO2013009738A1 Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package |
| 01/17/2013 | WO2013008920A1 Ceramic circuit board |
| 01/17/2013 | WO2013008824A1 Plasma etching method |
| 01/17/2013 | WO2013008667A1 Curable resin composition and process for producing cured products using same |
| 01/17/2013 | WO2013008651A1 Circuit board and electronic device |
| 01/17/2013 | WO2013008552A1 Wiring board incorporating electronic component, and method for manufacturing wiring board incorporating electronic component |
| 01/17/2013 | WO2013008466A1 Current sensor substrate and current sensor |
| 01/17/2013 | WO2013008462A1 Current sensor substrate and current sensor |
| 01/17/2013 | WO2013008437A1 Polyimide resin composition and laminate including same |
| 01/17/2013 | WO2013008415A1 Wiring board and method for manufacturing three-dimensional wiring board |
| 01/17/2013 | WO2013008382A1 Nitride semiconductor device |
| 01/17/2013 | WO2013007593A1 Method for generating power within an integrated three-dimensional structure, and corresponding connection device |
| 01/17/2013 | WO2012142601A3 Lead frame strip for reduced mold sticking during degating |
| 01/17/2013 | WO2012118896A3 Apparatus and methods related to wire bond pads and reducing impact of high rf loss plating |
| 01/17/2013 | US20130017649 Packaging for clip-assembled electronic components |
| 01/17/2013 | US20130016477 Electronic Assembly Including Die on Substrate With Heat Spreader Having an Open Window on the Die |
| 01/17/2013 | US20130015592 Bond pad configurations for semiconductor dies |
| 01/17/2013 | US20130015591 Memory module in a package |
| 01/17/2013 | US20130015590 Memory module in a package |
| 01/17/2013 | US20130015588 Semiconductor device having through electrode and method of fabricating the same |
| 01/17/2013 | US20130015587 Semiconductor device and test method |
| 01/17/2013 | US20130015586 De-skewed multi-die packages |
| 01/17/2013 | US20130015585 Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers |
| 01/17/2013 | US20130015584 Optoelectronic semiconductor device |
| 01/17/2013 | US20130015583 Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive |
| 01/17/2013 | US20130015582 Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor device |
| 01/17/2013 | US20130015581 Structure and method for high performance interconnect |
| 01/17/2013 | US20130015579 Solder ball contact susceptible to lower stress |
| 01/17/2013 | US20130015578 Interconnection and assembly of three-dimensional chip packages |
| 01/17/2013 | US20130015577 Semiconductor Device and Method of Forming Base Substrate with Cavities Formed through Etch-Resistant Conductive Layer for Bump Locking |
| 01/17/2013 | US20130015576 Solder Bump with Inner Core Pillar in Semiconductor Package |
| 01/17/2013 | US20130015575 Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads |
| 01/17/2013 | US20130015574 Bump i/o contact for semiconductor device |
| 01/17/2013 | US20130015573 Ball grid array with improved single-ended and differential signal performance |
| 01/17/2013 | US20130015572 Electronic assembly including an embedded electronic component |
| 01/17/2013 | US20130015571 Semiconductor Package And Method Of Manufacturing The Same |
| 01/17/2013 | US20130015570 Stacked semiconductor package and manufacturing method thereof |