| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/24/2013 | DE112010002705T5 Multi-Chip-Baugruppe und Verfahren zur Bereitstellung von Chip-Chip-Zwischenverbindungen in demselben Gebiet der Erfindung Multi-chip module and method of providing chip-chip interconnections in the same Field of the Invention |
| 01/24/2013 | DE102012106431A1 Elektronisches Bauteil Electronic component |
| 01/24/2013 | DE102012103759A1 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 01/24/2013 | DE102011107958A1 Flashover-resistant arrangement for semiconductor component for electromotor of circulating pump, has contact surfaces formed at housing, where electrically non-conductive adhesive is applied between contact surfaces to prevent flashover |
| 01/24/2013 | DE102011079660A1 Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente Layer composite of a layer arrangement and an electrical or electronic component |
| 01/24/2013 | DE102011079635A1 Kühlplatte und Verfahren zu deren Herstellung sowie Verwendung der Kühlplatte Cooling plate and method for production thereof and use of the cooling plate |
| 01/24/2013 | DE102011079634A1 Vorrichtung zum Kühlen und Verfahren zu deren Herstellung sowie Verwendung der Vorrichtung Device for cooling and process for their preparation and use of the apparatus |
| 01/24/2013 | DE102011079569A1 Aktive Transistor-Klemmschaltung Active transistor clamp circuit |
| 01/24/2013 | DE102007063229B4 Verfahren und Teststruktur zur Überwachung von Prozesseigenschaften für die Herstellung eingebetteter Halbleiterlegierungen in Drain/Source-Gebieten Method and test structure for monitoring process suitable for the manufacture of embedded semiconductor alloys in drain / source regions |
| 01/23/2013 | EP2549532A2 Method of electroplating pads on a semiconductor wafer |
| 01/23/2013 | EP2549531A1 Lead frame for semiconductor device |
| 01/23/2013 | EP2549530A1 Method for enhancingchip spot weld reliability, printed circuit board and electron device |
| 01/23/2013 | EP2549529A1 Semiconductor housing and method for manufacturing same |
| 01/23/2013 | EP2549488A1 Electrically conductive paste, and electrically conductive connection member produced using the paste |
| 01/23/2013 | EP2548933A1 Heat-resistant adhesive |
| 01/23/2013 | EP2548923A1 Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device |
| 01/23/2013 | EP2548225A2 System-in-package using embedded-die coreless substrates, and processes of forming same |
| 01/23/2013 | EP2548224A1 Cooling assembly for cooling heat generating component |
| 01/23/2013 | EP2548223A2 Microfabricated pillar fins for thermal management |
| 01/23/2013 | EP2548222A2 Optoelectronic component and method for the production thereof |
| 01/23/2013 | EP2548221A2 Optoelectronic component and method for the production thereof |
| 01/23/2013 | EP2548158A1 Laminate structure for a chip card and method for the production thereof |
| 01/23/2013 | EP2547258A1 Implantable biomedical devices on bioresorbable substrates |
| 01/23/2013 | CN202697145U Circuit board fastening heat dissipation component |
| 01/23/2013 | CN202696450U Conductive heat-radiation framework of rectification module |
| 01/23/2013 | CN202695448U Controllable silicon crystal brake tube module |
| 01/23/2013 | CN202695447U 绝缘栅双极型晶体管 Insulated gate bipolar transistors |
| 01/23/2013 | CN202695437U 晶闸管模块 Thyristor module |
| 01/23/2013 | CN202695435U 独立可控晶闸管模块 Independently controllable thyristor module |
| 01/23/2013 | CN202695434U Series module of thyristors |
| 01/23/2013 | CN202695433U One-phase rectifier bridge device |
| 01/23/2013 | CN202695432U 整流晶闸管模块 Thyristor rectifier module |
| 01/23/2013 | CN202695431U Thyristor rectifier diode module |
| 01/23/2013 | CN202695430U 封装晶闸管模块 Package thyristor module |
| 01/23/2013 | CN202695429U Ultra fast recovery epitaxial diode |
| 01/23/2013 | CN202695427U Multi-chip wafer-level packaging structure |
| 01/23/2013 | CN202695426U High-temperature-resistant tinned electronic element |
| 01/23/2013 | CN202695425U Single-phase bridge-type rectification module |
| 01/23/2013 | CN202695424U Package substrate with medium layer |
| 01/23/2013 | CN202695423U Unilateral radiator for high-power thyristor |
| 01/23/2013 | CN202695422U Large-power electronic component heat radiation device |
| 01/23/2013 | CN202695421U Aluminum alloy clamping device of high-power thyristor |
| 01/23/2013 | CN202695420U 半导体封装结构 The semiconductor package structure |
| 01/23/2013 | CN202695419U Frequency sheet protection glass |
| 01/23/2013 | CN202695418U Electronic element device capable of being secondarily used |
| 01/23/2013 | CN202695392U Roundabout plating device for integrated chip lead frame |
| 01/23/2013 | CN102893711A Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board |
| 01/23/2013 | CN102893709A A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device |
| 01/23/2013 | CN102893516A 振荡器 Oscillators |
| 01/23/2013 | CN102893397A Three-dimensional integrated circuit, processor, semiconductor chip, and method for manufacturing three-dimensional integrated circuit |
| 01/23/2013 | CN102893396A Semiconductor device and method for manufacturing same |
| 01/23/2013 | CN102893393A Electrically broken, but mechanically continuous die seal for integrated circuits |
| 01/23/2013 | CN102893392A High density gallium nitride devices using island topology |
| 01/23/2013 | CN102893391A Thermal interface materials with good reliability |
| 01/23/2013 | CN102893390A Method and device for thermally coupling a heat sink to a component |
| 01/23/2013 | CN102893389A 半导体装置 Semiconductor device |
| 01/23/2013 | CN102893388A Electronic component and method for producing same |
| 01/23/2013 | CN102892812A Novel organic silicon compound, thermal cure resin composition containing organic silicon compound, cured resin and package material for optical semiconductor |
| 01/23/2013 | CN102892805A Uv-curable polymer thick film dielectric compositions with excellent adhesion to ito |
| 01/23/2013 | CN102891152A Semiconductor package |
| 01/23/2013 | CN102891139A Double-sided flip chip package |
| 01/23/2013 | CN102891138A Multi-die building block for stacked-die package and method of manufacturing the same |
| 01/23/2013 | CN102891136A Semiconductor packages and methods of forming the same |
| 01/23/2013 | CN102891135A Semiconductor device and formation method thereof |
| 01/23/2013 | CN102891134A Plasma damage test structure based on metal oxide semiconductor (MOS) capacitor |
| 01/23/2013 | CN102891133A Chip package body and forming method thereof |
| 01/23/2013 | CN102891132A Electronic equipment |
| 01/23/2013 | CN102891131A Semiconductor substrate, package and device and manufacturing methods thereof |
| 01/23/2013 | CN102891130A Semiconductor package and method of fabricating the same |
| 01/23/2013 | CN102891129A Pre-plastic-package lead frame and package process thereof |
| 01/23/2013 | CN102891128A 半导体存储装置 The semiconductor memory device |
| 01/23/2013 | CN102891127A 电子部件 Electronic components |
| 01/23/2013 | CN102891126A Nitride semiconductor device |
| 01/23/2013 | CN102891125A 芯片封装结构及其制作方法 Chip package structure and production methods |
| 01/23/2013 | CN102891124A Packaging structure and manufacturing method thereof |
| 01/23/2013 | CN102891123A Stackable type pipe core semiconductor package |
| 01/23/2013 | CN102891122A Electrode for power semiconductor device |
| 01/23/2013 | CN102891121A Pillar design for conductive bump |
| 01/23/2013 | CN102891120A Chip package body and forming method thereof |
| 01/23/2013 | CN102891119A Radiating device |
| 01/23/2013 | CN102891118A Lower package body structure in stacked package and manufacturing method thereof |
| 01/23/2013 | CN102891117A Chip package and fabrication method thereof |
| 01/23/2013 | CN102891116A Embedded element packaging structure and manufacturing method thereof |
| 01/23/2013 | CN102891115A Substrate and preparation method thereof |
| 01/23/2013 | CN102891090A Semiconductor device and packaging method thereof |
| 01/23/2013 | CN102890348A COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module |
| 01/23/2013 | CN102888033A Thermal conductive forming body |
| 01/23/2013 | CN102437136B Bonding alloy wire and production technology thereof |
| 01/23/2013 | CN102332455B Active component array substrate and display panel |
| 01/23/2013 | CN102306631B Method for improving Sn-Ag solder performance based on galvanization technology |
| 01/23/2013 | CN102297612B 热交换器 Heat exchanger |
| 01/23/2013 | CN102231382B Ceramic package for image sensor and package method |
| 01/23/2013 | CN102201382B Semiconductor packaging piece and manufacturing method thereof |
| 01/23/2013 | CN102201381B Modular semiconductor device for strengthening heat dissipation |
| 01/23/2013 | CN102117799B Buried multi-chip semiconductor package structure and manufacturing method thereof |
| 01/23/2013 | CN102104071B Power metal-oxide-semiconductor field effect transistor (MOSFET) and manufacturing method thereof |
| 01/23/2013 | CN102084480B Packaging device and base member for package |
| 01/23/2013 | CN102083881B Modified epoxy resin, epoxy resin compositions and cured articles |
| 01/23/2013 | CN102082133B Temperature-controlled radiator |
| 01/23/2013 | CN102074552B Semiconductor device packages and manufacturing methods thereof |