| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/30/2013 | CN202712168U Metal terminal surface structure for component chip welding |
| 01/30/2013 | CN202712167U Wafer pad electroless nickel bump structure |
| 01/30/2013 | CN202712166U Electrode structure for ultrafast soft recovery diode module |
| 01/30/2013 | CN202712165U Double-flow channel water-cooling structure of computer CPU |
| 01/30/2013 | CN202712164U Double-flow channel water-cooling structure of computer CPU |
| 01/30/2013 | CN202712163U Multi-flow channel water-cooling structure of computer CPU |
| 01/30/2013 | CN202712162U Multi-flow channel water-cooling structure of computer CPU |
| 01/30/2013 | CN202712161U Double-flow channel water-cooling and air-cooling hybrid device structure of computer CPU |
| 01/30/2013 | CN202712160U Heat radiation fin module and heat radiation fin thereof |
| 01/30/2013 | CN202712159U Semiconductor device and heat pipe valve group |
| 01/30/2013 | CN202712158U Heat pipe valve group of semiconductor devices |
| 01/30/2013 | CN202712157U Digital equipment heat dissipation mechanism |
| 01/30/2013 | CN202712156U Heat radiator and heat radiation system |
| 01/30/2013 | CN202712155U Packaging structure |
| 01/30/2013 | CN202711162U Double-channel water cooling device for CPU (central processing unit) of computer |
| 01/30/2013 | CN202711153U Chip-type cavity structure |
| 01/30/2013 | CN102907191A Thermal interface material assemblies, and related methods |
| 01/30/2013 | CN102906873A High Q vertical ribbon inductor on semiconducting substrate |
| 01/30/2013 | CN102906872A Enhanced modularity in heterogeneous 3D stacks |
| 01/30/2013 | CN102906871A Planar cavity mems and related structures, methods of manufacture and design structures |
| 01/30/2013 | CN102906870A Heat dissipation structure for electronic device |
| 01/30/2013 | CN102906869A Electronic device, display device, and television receiver |
| 01/30/2013 | CN102906866A Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) |
| 01/30/2013 | CN102906865A Inter-low-permittivity layer insulating film, and method for forming inter-low-permittivity layer insulating film |
| 01/30/2013 | CN102906309A Silver anti-tarnishing agent, silver anti-tarnishing resin composition, silver anti-tarnishing method, and light-emitting diode using same |
| 01/30/2013 | CN102906198A Curable composition, hardened material, and method for using curable composition |
| 01/30/2013 | CN102905843A Amorphous alloy seal and bonding |
| 01/30/2013 | CN102905465A 双面电路板结构 Double-sided circuit board structure |
| 01/30/2013 | CN102905462A Circuit board module, stacking of circuit board, and manufacturing method for circuit board module and circuit board module stack |
| 01/30/2013 | CN102903763A Chip package and method for forming the same |
| 01/30/2013 | CN102903727A Electronic device with electrostatic discharge protection |
| 01/30/2013 | CN102903714A Layout structure of integrated circuit and version control circuit |
| 01/30/2013 | CN102903712A Input and output type photoelectric device |
| 01/30/2013 | CN102903703A Chip packaging stacking structure |
| 01/30/2013 | CN102903702A 碳化硅半导体装置 The silicon carbide semiconductor device |
| 01/30/2013 | CN102903701A Semiconductor device and method for manufacturing a semiconductor |
| 01/30/2013 | CN102903700A Radio-frequency test pattern structure in scribing trench |
| 01/30/2013 | CN102903699A Copper interconnecting structure and preparation method thereof |
| 01/30/2013 | CN102903698A 半导体器件及集成电路 Semiconductor devices and integrated circuits |
| 01/30/2013 | CN102903697A 半导体模块 Semiconductor Modules |
| 01/30/2013 | CN102903696A Self-aligning conductive bump structure and method of making the same |
| 01/30/2013 | CN102903695A SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| 01/30/2013 | CN102903694A Power semiconductor chip having two metal layers on one face |
| 01/30/2013 | CN102903693A Power device package module and manufacturing method thereof |
| 01/30/2013 | CN102903692A Stacked power semiconductor device with double-layer lead frame and production method thereof |
| 01/30/2013 | CN102903691A Semiconductor devices, packaging methods and structures |
| 01/30/2013 | CN102903690A Bump structures in semiconductor device and packaging assembly |
| 01/30/2013 | CN102903689A Novel bump structure |
| 01/30/2013 | CN102903688A Multilayer metallization with stress-reducing interlayer |
| 01/30/2013 | CN102903687A Die seal ring structure |
| 01/30/2013 | CN102903686A TSV (through silicon via) three-dimensional integration interconnection structure based on SOI (silicon on insulator) |
| 01/30/2013 | CN102903685A Heat conducting pad |
| 01/30/2013 | CN102903684A Semiconductor chip, chip, semiconductor package with chip and manufacturing method thereof |
| 01/30/2013 | CN102903683A Structure of package substrate and manufacturing method of package substrate |
| 01/30/2013 | CN102903682A Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereof |
| 01/30/2013 | CN102903681A Flexible connection of substrate in power semiconductor module |
| 01/30/2013 | CN102903680A Semiconductor package and method of fabricating the same |
| 01/30/2013 | CN102903668A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 01/30/2013 | CN102903645A Plane type semiconductor element and method for manufacturing same |
| 01/30/2013 | CN102902329A Cooling system for computer system |
| 01/30/2013 | CN102902084A Structure of fan-out signal wire area and display panel |
| 01/30/2013 | CN102898966A Glue sheet and use thereof |
| 01/30/2013 | CN102898781A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 01/30/2013 | CN102898620A Epoxy resin composition and semiconductor device |
| 01/30/2013 | CN102897706A Method and apparatus for protecting wiring and integrated circuit device |
| 01/30/2013 | CN102349150B Semiconductor-based submount with electrically conductive feed-throughs |
| 01/30/2013 | CN102315177B Processing method of high pressure resistant passivation protection diode chip |
| 01/30/2013 | CN102270645B Display device and manufacturing method thereof |
| 01/30/2013 | CN102231013B Semiconductor device and display device |
| 01/30/2013 | CN102194795B Test structure of dielectric layer under metal layer |
| 01/30/2013 | CN102103921B Stacked structure of spiral inductor |
| 01/30/2013 | CN102024788B Semiconductor device for interconnection process and manufacturing method thereof |
| 01/30/2013 | CN102024786B Semiconductor device for interconnection process and manufacturing method thereof |
| 01/30/2013 | CN102013403B Wafer level chip size packaging structure and manufacturing method thereof |
| 01/30/2013 | CN102002346B Organic silicon heat conduction composition and organic silicon heat conduction patch |
| 01/30/2013 | CN101996963B Heat sink with periodically patterned baseplate structure and method thereof |
| 01/30/2013 | CN101989607B Image sensor package structure |
| 01/30/2013 | CN101952961B Micromodules including integrated thin film inductors and methods of making the same |
| 01/30/2013 | CN101894868B Gallium nitride semiconductor device with improved forward conduction |
| 01/30/2013 | CN101872753B Restoration of electrical and mechanical connectability to an electrical device with a face equipped with contact studs |
| 01/30/2013 | CN101847590B Method for packaging multi-laminated multi-chip on flexible circuit board and packaging chipset |
| 01/30/2013 | CN101651128B Electrical fuse and semiconductor device |
| 01/30/2013 | CN101355042B Thin plastic leadless package with exposed metal die paddle |
| 01/29/2013 | USRE43945 Wiring layout of semiconductor device and design method of the same |
| 01/29/2013 | US8363407 Electronic device |
| 01/29/2013 | US8363406 Rotatable latch for compressing thermal interface material between a heat generating electrical component and a cooling electrical component |
| 01/29/2013 | US8363404 Implementing loading and heat removal for hub module assembly |
| 01/29/2013 | US8363403 Semiconductor device accommodating semiconductor module with heat radiation structure |
| 01/29/2013 | US8363219 Lateral shift measurement using an optical technique |
| 01/29/2013 | US8362785 Semiconductor device and semiconductor device measuring system |
| 01/29/2013 | US8362627 Reducing underfill keep out zone on substrate used in electronic device processing |
| 01/29/2013 | US8362626 Semiconductor device with non-overlapped circuits |
| 01/29/2013 | US8362625 Contact structure in a memory device |
| 01/29/2013 | US8362624 Multi-chip package and method of manufacturing thereof |
| 01/29/2013 | US8362623 Semiconductor device and method for manufacturing the same |
| 01/29/2013 | US8362622 Method and apparatus for placing transistors in proximity to through-silicon vias |
| 01/29/2013 | US8362621 Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same |
| 01/29/2013 | US8362620 Electronic devices with extended metallization layer on a passivation layer |
| 01/29/2013 | US8362619 Nonvolatile memory device and method of manufacturing the same |
| 01/29/2013 | US8362618 Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis |