| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/21/2015 | CN104299941A 接触插塞及其制造方法 Contact plug and a manufacturing method |
| 01/21/2015 | CN104299920A 形成封装结构的机制 Mechanism of forming a package structure |
| 01/21/2015 | CN104299919A 无芯层封装结构及其制造方法 No core package structure and its manufacturing method |
| 01/21/2015 | CN104299918A 封装集成电路的方法和具有非功能性占位块的模压衬底 Methods and packaged integrated circuit substrate having a non-functional molded blocks occupying |
| 01/21/2015 | CN104299916A 配线基板及制造方法,部件嵌入式玻璃基板及制造方法 Wiring board and manufacturing method, a glass substrate and embedded member manufacturing method |
| 01/21/2015 | CN103555247B 一种低温固化高强度塑封胶及其制备方法 Low-temperature curing high-strength plastic rubber and its preparation method |
| 01/21/2015 | CN103165522B 半导体结构及半导体结构的形成方法 The method of forming a semiconductor structure and semiconductor structure |
| 01/21/2015 | CN103107125B 半导体器件及其形成方法 Semiconductor device and method for forming |
| 01/21/2015 | CN102790032B 一种互连结构及其形成方法 An interconnect structure and method of forming |
| 01/21/2015 | CN102709272B 硅通孔的容错单元与方法 TSV fault-tolerant unit and Methods |
| 01/21/2015 | CN102695731B 活性能量射线固化性组合物及其用途 The active energy ray-curable composition and use thereof |
| 01/21/2015 | CN102667597B 有源矩阵基板和显示装置 Active matrix substrate and a display device |
| 01/21/2015 | CN102651362B 串联型集成光电模块及其制造方法 Tandem type and method of manufacturing integrated photovoltaic modules |
| 01/21/2015 | CN102629603B 半导体装置 Semiconductor device |
| 01/21/2015 | CN102543958B 传输线、用于去嵌入晶片上装置的测试结构及晶片 Transmission line, for de-embedding test structures on the wafer and the wafer apparatus |
| 01/21/2015 | CN102543829B 浅沟槽隔离和穿透基板通孔于集成电路设计之内的整合 Shallow trench isolation and penetrate the substrate through holes in the integrated circuit design of the integration of |
| 01/21/2015 | CN102479774B 半导体封装 The semiconductor package |
| 01/21/2015 | CN102439717B 滑动式芯片装置和方法 Sliding chip device and method |
| 01/21/2015 | CN102290405B 一种用于模块化多电平电压源换流器的晶闸管压装结构 SCR press-fit structure of a modular multi-level voltage source inverter for the |
| 01/21/2015 | CN102280420B 半导体模块以及半导体装置 The semiconductor module and semiconductor device |
| 01/21/2015 | CN102208378B 冷却装置 Cooling device |
| 01/21/2015 | CN102160177B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 01/21/2015 | CN102118954B 微型液体冷却装置 Miniature liquid cooling system |
| 01/21/2015 | CN101834190B 薄膜半导体装置、电光装置和电子设备 A thin film semiconductor device, an electro-optical device and electronic equipment |
| 01/20/2015 | US8937810 Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
| 01/20/2015 | US8937727 Portable handheld device with multi-core image processor |
| 01/20/2015 | US8937394 Compound barrier layer, method for forming the same and package structure using the same |
| 01/20/2015 | US8937393 Integrated circuit package system with device cavity |
| 01/20/2015 | US8937392 Semiconductor device |
| 01/20/2015 | US8937390 Semiconductor device having a liquid cooling module |
| 01/20/2015 | US8937389 Semiconductor devices comprising GSG interconnect structures |
| 01/20/2015 | US8937388 Methods and apparatus of packaging semiconductor devices |
| 01/20/2015 | US8937387 Semiconductor device with conductive vias |
| 01/20/2015 | US8937386 Chip package structure with ENIG plating |
| 01/20/2015 | US8937385 Electronic component and fabrication process of this electronic component |
| 01/20/2015 | US8937384 Thermal management of integrated circuits using phase change material and heat spreaders |
| 01/20/2015 | US8937383 Direct semiconductor contact ebullient cooling package |
| 01/20/2015 | US8937382 Secondary device integration into coreless microelectronic device packages |
| 01/20/2015 | US8937381 Thin stackable package and method |
| 01/20/2015 | US8937380 Die edge protection for pressure sensor packages |
| 01/20/2015 | US8937379 Integrated circuit packaging system with trenched leadframe and method of manufacture thereof |
| 01/20/2015 | US8937378 Lead frame and semiconductor package including the same |
| 01/20/2015 | US8937376 Semiconductor packages with heat dissipation structures and related methods |
| 01/20/2015 | US8937375 Substrate structure, semiconductor device array and semiconductor device having the same |
| 01/20/2015 | US8937374 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package |
| 01/20/2015 | US8937373 Highly luminescent II-V semiconductor nanocrystals |
| 01/20/2015 | US8937372 Integrated circuit package system with molded strip protrusion |
| 01/20/2015 | US8937371 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
| 01/20/2015 | US8937370 Memory device and fabricating method thereof |
| 01/20/2015 | US8937369 Transistor with non-uniform stress layer with stress concentrated regions |
| 01/20/2015 | US8937368 Semiconductor device |
| 01/20/2015 | US8937365 Semiconductor integrated circuit device |
| 01/20/2015 | US8937362 Semiconductor device having a reinforcing member for filling a gap between a semiconductor chip and a cover member and manufacturing method for semiconductor device |
| 01/20/2015 | US8937356 Electrostatic discharge (ESD) protection applying high voltage lightly doped drain (LDD) CMOS technologies |
| 01/20/2015 | US8937355 Striped on-chip inductor |
| 01/20/2015 | US8937351 Power MOS transistor with improved metal contact |
| 01/20/2015 | US8937345 Integrated circuits comprising an active transistor electrically connected to a trench capacitor by an overlying contact |
| 01/20/2015 | US8937340 Silicon on insulator and thin film transistor bandgap engineered split gate memory |
| 01/20/2015 | US8937317 Method and system for co-packaging gallium nitride electronics |
| 01/20/2015 | US8937310 Detection method for semiconductor integrated circuit device, and semiconductor integrated circuit device |
| 01/20/2015 | US8937309 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication |
| 01/20/2015 | US8937293 Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements |
| 01/20/2015 | US8937256 Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component |
| 01/20/2015 | US8937136 Curable composition |
| 01/20/2015 | US8937131 Curable composition |
| 01/20/2015 | US8937128 Curable reaction resin system |
| 01/20/2015 | US8937023 Method of manufacturing porous insulating film |
| 01/20/2015 | US8937015 Method for forming vias in a substrate |
| 01/20/2015 | US8937010 Information encoding using wirebonds |
| 01/20/2015 | US8937009 Far back end of the line metallization method and structures |
| 01/20/2015 | US8937008 Apparatus and method for placing solder balls |
| 01/20/2015 | US8937007 Semiconductor device |
| 01/20/2015 | US8936998 Manufcaturing method for room-temperature substrate bonding |
| 01/20/2015 | US8936985 Methods related to power semiconductor devices with thick bottom oxide layers |
| 01/20/2015 | US8936971 Integrated circuit packaging system with die paddles and method of manufacture thereof |
| 01/20/2015 | US8936968 Flip chip package manufacturing method |
| 01/20/2015 | US8936967 Solder in cavity interconnection structures |
| 01/20/2015 | US8936954 Integrated reflector and thermal spreader and thermal spray fabrication method |
| 01/20/2015 | US8936705 Electrochemical deposition apparatus |
| 01/20/2015 | US8936405 Multi-channel optical receiver module |
| 01/20/2015 | US8936072 Thermal distribution systems and methods |
| 01/20/2015 | US8935850 Method of manufacturing printed wiring board |
| 01/15/2015 | WO2015006655A1 Semiconductor device having three terminal miniature package |
| 01/15/2015 | WO2015006000A1 Micro light emitting diode device with post |
| 01/15/2015 | WO2015005989A1 Electronic module assembly with patterned adhesive array |
| 01/15/2015 | WO2015005977A1 Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology |
| 01/15/2015 | WO2015005571A1 Method for forming pad of wafer |
| 01/15/2015 | WO2015005366A1 Thermally conductive sheet |
| 01/15/2015 | WO2015005221A1 Silicone composition for optical semiconductor sealing and optical semiconductor device |
| 01/15/2015 | WO2015005181A1 Power conversion member |
| 01/15/2015 | WO2015005138A1 Method for transporting sealing resin composition and packaging |
| 01/15/2015 | WO2015004952A1 Circuit board |
| 01/15/2015 | WO2015004867A1 Semiconductor device for detecting radiation |
| 01/15/2015 | WO2015004027A1 Electronic module and method for manufacturing same |
| 01/15/2015 | WO2015003501A1 Thermal interface sheet, preparation method therefor and cooling system therefor |
| 01/15/2015 | US20150017782 Bonding device and bonding method |
| 01/15/2015 | US20150017765 Method for package-on-package assembly with wire bonds to encapsulation surface |
| 01/15/2015 | US20150017764 Method of forming a semiconductor package |
| 01/15/2015 | US20150017763 Microelectronic Assembly With Thermally and Electrically Conductive Underfill |
| 01/15/2015 | US20150017450 Resin composition and semiconductor mounting substrate obtained by molding same |