| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/06/2013 | CN102915930A Method for changing mutual inductance between radio-frequency spiral inductors and radio-frequency circuit |
| 02/06/2013 | CN102915921A Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer |
| 02/06/2013 | CN102911616A Die-bonding film, dicing / die-bonding film and semiconductor device |
| 02/06/2013 | CN102911501A Resin composition and substrate using same |
| 02/06/2013 | CN102262427B Radiating module |
| 02/06/2013 | CN102214699B Method for manufacturing display device |
| 02/06/2013 | CN102157489B Semiconductor device and manufacturing method of semiconductor device |
| 02/06/2013 | CN102088019B Three-dimensional laminated element with an interconnect structure and manufacturing method thereof |
| 02/06/2013 | CN102024744B Semiconductor device and manufacture method thereof |
| 02/06/2013 | CN101996957B Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same |
| 02/06/2013 | CN101840917B Integrate circuit and subassembly |
| 02/06/2013 | CN101800183B Combined semiconductor apparatus with thin semiconductor films |
| 02/06/2013 | CN101795051B Valve module of thyristor current change valve used for high-voltage DC transmission |
| 02/06/2013 | CN101794942B Elastic contact and method of manufacturing the same, and contact substrate and method of manufacturing the same |
| 02/06/2013 | CN101765912B Method for producing an electronic component and electronic component |
| 02/06/2013 | CN101681853B Mobile binding in an electronic connection |
| 02/06/2013 | CN101626229B Circuit with calibration circuit portion |
| 02/06/2013 | CN101593749B Photoelectric converter |
| 02/06/2013 | CN101587872B Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device |
| 02/06/2013 | CN101581550B Evaporator for a cooling circuit |
| 02/06/2013 | CN101320723B 半导体装置 Semiconductor device |
| 02/06/2013 | CN101213659B 热交换增强 Heat exchange enhancement |
| 02/05/2013 | US8368735 Light emitting array for printing or copying |
| 02/05/2013 | US8368235 Resin sealing method of semiconductor device |
| 02/05/2013 | US8368234 Semiconductor device, production method for the same, and substrate |
| 02/05/2013 | US8368233 Semiconductor device with improved resin configuration |
| 02/05/2013 | US8368232 Sacrificial material to facilitate thin die attach |
| 02/05/2013 | US8368231 Chipstack package and manufacturing method thereof |
| 02/05/2013 | US8368228 Area efficient through-hole connections |
| 02/05/2013 | US8368226 Die power structure |
| 02/05/2013 | US8368225 Semiconductor integrated circuit device having improved interconnect accuracy near cell boundaries |
| 02/05/2013 | US8368224 Under land routing |
| 02/05/2013 | US8368223 Paste for forming an interconnect and interconnect formed from the paste |
| 02/05/2013 | US8368222 Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device |
| 02/05/2013 | US8368220 Anchored damascene structures |
| 02/05/2013 | US8368219 Buried silicide local interconnect with sidewall spacers and method for making the same |
| 02/05/2013 | US8368218 Adhesive flexible barrier film, method of forming same, and organic electronic device including same |
| 02/05/2013 | US8368217 Integrated circuit package with segregated Tx and Rx data channels |
| 02/05/2013 | US8368216 Semiconductor package |
| 02/05/2013 | US8368215 Semiconductor device and method of manufacturing the same |
| 02/05/2013 | US8368214 Alpha shielding techniques and configurations |
| 02/05/2013 | US8368213 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/05/2013 | US8368212 Semiconductor package with under bump metallization routing |
| 02/05/2013 | US8368210 Wafer scale package for high power devices |
| 02/05/2013 | US8368209 Semiconductor device |
| 02/05/2013 | US8368208 Semiconductor cooling apparatus |
| 02/05/2013 | US8368207 Pressure-contact power semiconductor module and method for producing the same |
| 02/05/2013 | US8368205 Metallic thermal joint for high power density chips |
| 02/05/2013 | US8368204 Chip structure and process for forming the same |
| 02/05/2013 | US8368203 Heat radiation member for a semiconductor package with a power element and a control circuit |
| 02/05/2013 | US8368202 Semiconductor device and semiconductor package having the same |
| 02/05/2013 | US8368201 Method for embedding a component in a base |
| 02/05/2013 | US8368200 Shielded stacked integrated circuit packaging system and method of manufacture thereof |
| 02/05/2013 | US8368199 Integrated circuit package system for stackable devices and method for manufacturing thereof |
| 02/05/2013 | US8368198 Stacked package of semiconductor device |
| 02/05/2013 | US8368197 Semiconductor package and method of manufacturing the semiconductor package |
| 02/05/2013 | US8368196 Micro device having a movable structure |
| 02/05/2013 | US8368195 Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips |
| 02/05/2013 | US8368194 Exposed die overmolded flip chip package |
| 02/05/2013 | US8368193 Chip package |
| 02/05/2013 | US8368192 Multi-chip memory package with a small substrate |
| 02/05/2013 | US8368191 Semiconductor device and manufacturing method of the same |
| 02/05/2013 | US8368190 LED package having an array of light emitting cells coupled in series |
| 02/05/2013 | US8368189 Auxiliary leadframe member for stabilizing the bond wire process |
| 02/05/2013 | US8368188 Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof |
| 02/05/2013 | US8368187 Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die |
| 02/05/2013 | US8368186 Device and methods for electrostatic discharge protection |
| 02/05/2013 | US8368185 Semiconductor device packages with electromagnetic interference shielding |
| 02/05/2013 | US8368184 Silicon device structure, and sputtering target used for forming the same |
| 02/05/2013 | US8368180 Scribe line metal structure |
| 02/05/2013 | US8368178 Phase change memory apparatus and fabrication method thereof |
| 02/05/2013 | US8368172 Fused buss for plating features on a semiconductor die |
| 02/05/2013 | US8368171 Methods of forming electromigration and thermal gradient based fuse structures |
| 02/05/2013 | US8368155 Systems and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same |
| 02/05/2013 | US8368150 High performance IC chip having discrete decoupling capacitors attached to its IC surface |
| 02/05/2013 | US8368081 Metal thin film connection structure, manufacturing method thereof and array substrate |
| 02/05/2013 | US8368076 Contact structure and semiconductor device |
| 02/05/2013 | US8368064 Glass for scattering layer of organic LED device and organic LED device |
| 02/05/2013 | US8367945 Apparatus, system and method for use in mounting electronic elements |
| 02/05/2013 | US8367543 Structure and method to improve current-carrying capabilities of C4 joints |
| 02/05/2013 | US8367514 Integrated circuit with capacitor and method for the production thereof |
| 02/05/2013 | US8367479 Semiconductor device and manufacturing method thereof |
| 02/05/2013 | US8367478 Method and system for internal layer-layer thermal enhancement |
| 02/05/2013 | US8367477 Electronic device package and method for forming the same |
| 02/05/2013 | US8367468 Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same |
| 02/05/2013 | US8366614 Analyte monitoring device and methods of use |
| 02/05/2013 | CA2651842C A base plate for a dual base plate heatsink |
| 01/31/2013 | WO2013016353A1 Stiffness enhancement of electronic substrates using circuit components |
| 01/31/2013 | WO2013016335A2 Lead frameless hermetic circuit package |
| 01/31/2013 | WO2013016264A2 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication |
| 01/31/2013 | WO2013015591A2 Curable composition |
| 01/31/2013 | WO2013015355A1 Method of manufacturing oxide ceramic circuit board, and oxide ceramic circuit board |
| 01/31/2013 | WO2013015344A1 Epoxy resin mixture, epoxy resin composition, prepreg, and curing product of each |
| 01/31/2013 | WO2013015327A1 Wiring substrate, electronic device, and electronic module |
| 01/31/2013 | WO2013015216A1 Package for accommodating semiconductor element, semiconductor device provided with same, and electronic device |
| 01/31/2013 | WO2013015158A1 Heat dissipating component for semiconductor element |
| 01/31/2013 | WO2013015073A1 Wiring board and electronic device |
| 01/31/2013 | WO2013015031A1 Semiconductor device and method for producing a semiconductor device |
| 01/31/2013 | WO2013014978A1 Mounting substrate and light-emitting module |
| 01/31/2013 | WO2013014542A1 A system and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks |