| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/07/2013 | US20130032942 Semiconductor device and manufacturing method therefor |
| 02/07/2013 | US20130032941 Routing layer for mitigating stress in a semiconductor die |
| 02/07/2013 | US20130032940 Chip package structure |
| 02/07/2013 | US20130032939 Chip package structure |
| 02/07/2013 | US20130032938 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device |
| 02/07/2013 | US20130032937 Semiconductor device and associated method |
| 02/07/2013 | US20130032936 Package for a mems sensor and manufacturing process thereof |
| 02/07/2013 | US20130032935 Implementing enhanced thermal conductivity in stacked modules |
| 02/07/2013 | US20130032934 Packaged microelectronic elements having blind vias for heat dissipation |
| 02/07/2013 | US20130032933 Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device |
| 02/07/2013 | US20130032932 Bonded wire semiconductor device |
| 02/07/2013 | US20130032931 Layer structure with emi shielding effect |
| 02/07/2013 | US20130032930 Semiconductor device comprising through-electrode interconnect |
| 02/07/2013 | US20130032929 Method of protecting deep trench sidewall from process damage |
| 02/07/2013 | US20130032925 Semiconductor device |
| 02/07/2013 | US20130032889 Silicon Chip Having Through Via and Method for Making the Same |
| 02/07/2013 | US20130032800 Semiconductor device |
| 02/07/2013 | US20130032799 Apparatus and Methods for De-Embedding Through Substrate Vias |
| 02/07/2013 | US20130032712 Overlay alignment mark and method of detecting overlay alignment error using the mark |
| 02/07/2013 | DE102012213208A1 Halbleiteranordnung Semiconductor device |
| 02/07/2013 | DE102011109596A1 Schaltungsanordnung zum Schutz gegen elektrostatische Entladungen Circuitry to protect against electrostatic discharges |
| 02/07/2013 | DE102011109594A1 Vorrichtung mit einem Gehäuse, zumindest zwei Leiterplatten und zumindest einem Wärmeableitelement Device comprising a housing, at least two circuit boards and at least one heat dissipating member |
| 02/07/2013 | DE102011080545A1 Semiconductor substrate mounted with electronic components such as integrated circuit, has expansion joint partially arranged within connection surface and/or maximum surface area to reduce mechanical stresses due to thermal expansion |
| 02/07/2013 | DE102011080439A1 Halbleiterbauelement mit Metallgateelektrodenstrukturen und Nicht-FET's mit unterschiedlicher Höhe durch frühe Anpassung einer Gatestapeltopographie A semiconductor device with metal gate electrode structures and non-FETs with different heights by early adaptation of a gate stack topography |
| 02/07/2013 | DE102011080299A1 Circuit substrate for mounting semiconductor chip of e.g. semiconductor device, has filler metal that is partially filled in intermediate space provided between the ceramic materials |
| 02/07/2013 | DE102007011163B4 Verbindungsstruktur und Verfahren zum Herstellen derselben, nicht-flüchtige Halbleiterspeichervorrichtung, elektrische Speicherkarte und elektrisches Gerät Connection structure and method of manufacturing the same, non-volatile semiconductor memory device, memory card and electrical electrical device |
| 02/07/2013 | DE102004014744B4 Halbleiterbaugruppe mit einem Graben zum Treiben eines Schaltselement und Vermeiden eines Latch-up Durchbruchs Semiconductor device having a trench for driving a switching element and avoiding a latch-up breakdown |
| 02/07/2013 | DE10152533B4 Hochfrequenz-Schaltungsplatineneinheit, Hochfrequenz-Modul, bei dem die Einheit verwendet ist, elektronische Vorrichtung, bei der das Modul verwendet ist, und Verfahren zur Herstellung der Hochfrequenz-Schaltungsplatineneinheit High-frequency circuit board unit, high-frequency module in which the unit is used, electronic device in which the module is used, and processes for making the high-frequency circuit board unit |
| 02/07/2013 | CA2839361A1 Use of an anisotropic fluoropolymer for the conduction of heat |
| 02/06/2013 | EP2555602A1 Multilayer wiring board and method for manufacturing multilayer wiring board |
| 02/06/2013 | EP2555599A1 Membrane wiring board |
| 02/06/2013 | EP2555426A1 Base of surface-mount-type electronic component-use package, and surface-mount-type electronic component-use package |
| 02/06/2013 | EP2555240A1 Packaging substrate having embedded interposer and fabrication method thereof |
| 02/06/2013 | EP2555239A2 Thermal package with heat slug for die stacks |
| 02/06/2013 | EP2555237A2 Semiconductor device |
| 02/06/2013 | EP2555236A1 High-frequency circuit board |
| 02/06/2013 | EP2554711A1 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof |
| 02/06/2013 | EP2554689A1 Magnesium-based composite member, heat dissipation member, and semiconductor device |
| 02/06/2013 | EP2554601A1 Sealant for optical semiconductors and optical semiconductor device |
| 02/06/2013 | EP2553722A2 Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same |
| 02/06/2013 | EP1911080B1 Flip-chip package with air cavity |
| 02/06/2013 | CN202721127U High-voltage thyristor valve bank module integrated with dynamic and static voltage-sharing loops |
| 02/06/2013 | CN202721126U Integrated optical sensor package |
| 02/06/2013 | CN202721124U 6500V diode high-voltage module |
| 02/06/2013 | CN202721119U Improved triode lead frame |
| 02/06/2013 | CN202721118U Anode thyristor seat used for serially-connected thyristors |
| 02/06/2013 | CN202721117U A high-efficient radiator equipped with heat pipes and helical fins |
| 02/06/2013 | CN202721116U Insulated TO220AB power device based on aluminum radiating fin |
| 02/06/2013 | CN202721115U Semiconductor structure |
| 02/06/2013 | CN202720977U Long-life electronic component |
| 02/06/2013 | CN202720669U Strip of non-contact large chip smart card |
| 02/06/2013 | CN202720568U Three-runner water-cooling and air-cooling mixing device of computer central processing unit (CPU) |
| 02/06/2013 | CN202720566U Multiple-runner water and air cooling mixed device structure of computer central processing unit (CPU) |
| 02/06/2013 | CN202720565U Three-runner water cooling module of central processing unit (CPU) |
| 02/06/2013 | CN202720559U Three-flow-passageway water cooling structure of computer central processing unit (CPU) |
| 02/06/2013 | CN1822385B Display device and electronic device comprising same |
| 02/06/2013 | CN1783470B 半导体装置 Semiconductor device |
| 02/06/2013 | CN102918646A Cooling device for a heat-emitting element |
| 02/06/2013 | CN102918644A 半导体装置 Semiconductor device |
| 02/06/2013 | CN102918643A 半导体集成电路装置 The semiconductor integrated circuit device |
| 02/06/2013 | CN102918637A Semiconductor device and product employing flip-chip mounting |
| 02/06/2013 | CN102918608A Through via inductor or transformer in a high-resistance substrate with programmability |
| 02/06/2013 | CN102918106A Semiconductor-sealing epoxy resin composition and semiconductor device using same |
| 02/06/2013 | CN102916044A High electron mobility transistors and methods of manufacturing the same |
| 02/06/2013 | CN102916012A Integrated circuit assembled by multilayer substrates |
| 02/06/2013 | CN102916010A IC die, semiconductor package, printed circuit board and IC die manufacturing method |
| 02/06/2013 | CN102916008A Semiconductor device, DC/DC converter and power supply |
| 02/06/2013 | CN102916007A 3-D (three-dimension) Hall sensor and manufacturing method thereof |
| 02/06/2013 | CN102916003A Triggering and rectifying integrated component |
| 02/06/2013 | CN102916002A Semiconductor packaging device with magnetic shielding function and production method thereof |
| 02/06/2013 | CN102916001A Layer structure with emi shielding effect |
| 02/06/2013 | CN102916000A Via chain testing structure and method |
| 02/06/2013 | CN102915999A Over-etching step test pattern for polysilicon in groove and forming method of over-etching step test pattern |
| 02/06/2013 | CN102915998A Via structure |
| 02/06/2013 | CN102915997A High Voltage Resistor with High Voltage Junction Termination |
| 02/06/2013 | CN102915996A Interconnecting mechanism for 3D integrated circuit |
| 02/06/2013 | CN102915995A Semiconductor packaging part, substrate and manufacturing method thereof |
| 02/06/2013 | CN102915994A Carrier band for ultrathin non-contact module, non-contact module and encapsulation method |
| 02/06/2013 | CN102915993A Integrated circuit with sensor and method of manufacturing such an integrated circuit |
| 02/06/2013 | CN102915992A Semiconductor device and associated method |
| 02/06/2013 | CN102915991A Pad structures in BSI image sensor chips |
| 02/06/2013 | CN102915990A Chip package structure |
| 02/06/2013 | CN102915989A Chip package structure |
| 02/06/2013 | CN102915988A Lead frame and flip chip packaging device using same |
| 02/06/2013 | CN102915987A Semiconductor arrangement |
| 02/06/2013 | CN102915986A 芯片封装结构 Chip package structure |
| 02/06/2013 | CN102915985A Double-sided adhering structure of power electronic device and production method of double-sided adhering structure |
| 02/06/2013 | CN102915984A Semiconductor packaging structure and manufacturing method therefor |
| 02/06/2013 | CN102915983A Packaging substrate having embedded interposer and fabrication method thereof |
| 02/06/2013 | CN102915982A 半导体器件 Semiconductor devices |
| 02/06/2013 | CN102915981A Semiconductor device and packaging method thereof |
| 02/06/2013 | CN102915980A Substrate, electronic device, and electronic apparatus |
| 02/06/2013 | CN102915979A Chip package structure and production method thereof |
| 02/06/2013 | CN102915978A 半导体封装结构 The semiconductor package structure |
| 02/06/2013 | CN102915977A Circuit substrate, circuit substrate device, and method for manufacturing circuit substrate |
| 02/06/2013 | CN102915976A Anti-high-overload integrated circuit |
| 02/06/2013 | CN102915966A Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies |
| 02/06/2013 | CN102915958A Copper interconnection structure and making method thereof |
| 02/06/2013 | CN102915955A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/06/2013 | CN102915954A Low-K dielectric layer and porogen |