| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/13/2013 | CN101823105B Upright and close arrangement method and application device thereof for fins of cylindrical radiator |
| 02/13/2013 | CN101742813B Mount board and semiconductor module |
| 02/13/2013 | CN101667392B Image display apparatus |
| 02/13/2013 | CN101630685B Thin film transistor array substrate |
| 02/13/2013 | CN101552257B Semiconductor device capable of switching operation modes |
| 02/13/2013 | CN101521160B A method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate |
| 02/13/2013 | CN101510553B Image sensor and method of manufacturing the same |
| 02/13/2013 | CN101483176B Magnetic memory device |
| 02/13/2013 | CN101480116B Circuit board, electronic device and method for manufacturing circuit board |
| 02/13/2013 | CN101236969B Static RAM component |
| 02/13/2013 | CN101128543B Resin composition and coating film forming material containing the same |
| 02/13/2013 | CN101110462B Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 02/12/2013 | US8373428 Probe card assembly and kit, and methods of making same |
| 02/12/2013 | US8373288 Alignment mark, method of manufacturing semiconductor device, and mask set |
| 02/12/2013 | US8373287 Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| 02/12/2013 | US8373286 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 02/12/2013 | US8373285 Chip module |
| 02/12/2013 | US8373284 Semiconductor device |
| 02/12/2013 | US8373283 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 02/12/2013 | US8373282 Wafer level chip scale package with reduced stress on solder balls |
| 02/12/2013 | US8373281 Semiconductor module and portable apparatus provided with semiconductor module |
| 02/12/2013 | US8373280 Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component |
| 02/12/2013 | US8373279 Die package |
| 02/12/2013 | US8373278 Semiconductor device having stacked dice disposed on base substrate |
| 02/12/2013 | US8373277 Stacked die in die BGA package |
| 02/12/2013 | US8373276 Printed wiring board and method for manufacturing the same |
| 02/12/2013 | US8373275 Fine pitch solder bump structure with built-in stress buffer |
| 02/12/2013 | US8373274 Method of forming wiring structure and semiconductor device comprising underlying refractory metal layers |
| 02/12/2013 | US8373273 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby |
| 02/12/2013 | US8373272 Device under bonding pad using single metallization |
| 02/12/2013 | US8373271 Interconnect structure with an oxygen-doped SiC antireflective coating and method of fabrication |
| 02/12/2013 | US8373270 Semiconductor integrated circuit device and method of manufacturing same |
| 02/12/2013 | US8373269 Jigs with controlled spacing for bonding dies onto package substrates |
| 02/12/2013 | US8373268 Semiconductor package including flip chip controller at bottom of die stack |
| 02/12/2013 | US8373267 Electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure |
| 02/12/2013 | US8373266 Heat sink mounted on a vehicle-transmission case |
| 02/12/2013 | US8373265 Package substrate having a through hole and method of fabricating the same |
| 02/12/2013 | US8373264 Semiconductor package with integrated interference shielding and method of manufacture thereof |
| 02/12/2013 | US8373263 Interconnection structure and its design method |
| 02/12/2013 | US8373262 Source driver, method for manufacturing same, and liquid crystal module |
| 02/12/2013 | US8373261 Chip stack package and method of fabricating the same |
| 02/12/2013 | US8373260 Chip package |
| 02/12/2013 | US8373259 Optical connection through single assembly overhang flip chip optics die with micro structure alignment |
| 02/12/2013 | US8373258 Semiconductor device and production method thereof |
| 02/12/2013 | US8373257 Top exposed clip with window array |
| 02/12/2013 | US8373256 Semiconductor device |
| 02/12/2013 | US8373254 Structure for reducing integrated circuit corner peeling |
| 02/12/2013 | US8373249 Programmable capacitor associated with an input/output pad |
| 02/12/2013 | US8373232 Device to detect and measure static electric charge |
| 02/12/2013 | US8373231 Semiconductor device |
| 02/12/2013 | US8373202 Integrated circuit chips with fine-line metal and over-passivation metal |
| 02/12/2013 | US8373201 Semiconductor device and method for fabricating the same |
| 02/12/2013 | US8373197 Circuit device |
| 02/12/2013 | US8373172 Semiconductor device and method for manufacturing semiconductor device |
| 02/12/2013 | US8372760 Method and system for using ion implantation for treating a low-k dielectric film |
| 02/12/2013 | US8372729 Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same |
| 02/12/2013 | US8372695 Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
| 02/12/2013 | US8372693 Semiconductor device including semiconductor chips with different thickness |
| 02/12/2013 | US8372692 Method of stacking flip-chip on wire-bonded chip |
| 02/12/2013 | US8372005 Analyte monitoring device and methods of use |
| 02/12/2013 | CA2508190C Process for producing a flat panel radiation detector and a flat panel radiation detector |
| 02/07/2013 | WO2013020106A1 Dynamic thermal interface material |
| 02/07/2013 | WO2013019612A1 Heat sink assembly for electronic components |
| 02/07/2013 | WO2013019608A1 Optoelectronic devices with thin barrier films with crystalline characteristics that are conformally coated onto complex surfaces to provide protection against moisture |
| 02/07/2013 | WO2013019541A2 Low-stress vias |
| 02/07/2013 | WO2013019040A2 Photo-curable organic-inorganic hybrid resin composition |
| 02/07/2013 | WO2013018847A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device |
| 02/07/2013 | WO2013018783A1 Semiconductor device and fabrication method for same |
| 02/07/2013 | WO2013018674A1 High-frequency module |
| 02/07/2013 | WO2013018667A1 Cooling device and electronic device using same |
| 02/07/2013 | WO2013018589A1 Semiconductor integrated circuit device |
| 02/07/2013 | WO2013018525A1 Epoxy resin composition for cast molding and electrical device using same |
| 02/07/2013 | WO2013018504A1 Semiconductor device and method for producing same |
| 02/07/2013 | WO2013018485A1 Lead frame, method for manufacturing lead frame and semiconductor device using same |
| 02/07/2013 | WO2013018357A1 Semiconductor power module, method for manufacturing semiconductor power module, and circuit board |
| 02/07/2013 | WO2013018344A1 Substrate for mounting elements and method for producing same, and semiconductor module and method for producing same |
| 02/07/2013 | WO2013018330A1 Substrate for mounting elements, and semiconductor power module |
| 02/07/2013 | WO2013018329A1 Heat sink and method for manufacturing heat sink |
| 02/07/2013 | WO2013018258A1 Film-forming apparatus and film-forming method |
| 02/07/2013 | WO2013018172A1 Multilayer sintered ceramic wiring board, and semiconductor package including wiring board |
| 02/07/2013 | WO2013018137A1 Display panel device and method for manufacturing same |
| 02/07/2013 | WO2013017917A1 Semiconductor assembly |
| 02/07/2013 | WO2013017750A1 Cooling device provided with a thermoelectric sensor |
| 02/07/2013 | WO2013017748A1 Device for localizing hot spots with heat flow meters |
| 02/07/2013 | WO2013017231A1 Use of an anisotropic fluoropolymer for the conduction of heat |
| 02/07/2013 | WO2013016975A1 Test pattern for trench poly over-etched step and formation method thereof |
| 02/07/2013 | US20130032956 Semiconductor device and method for manufacturing the same |
| 02/07/2013 | US20130032955 Low-K Dielectric Layer and Porogen |
| 02/07/2013 | US20130032954 Stackable integrated circuit package system |
| 02/07/2013 | US20130032953 Method of manufacturing a plurality of electronic assemblies |
| 02/07/2013 | US20130032952 Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die |
| 02/07/2013 | US20130032951 Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising same |
| 02/07/2013 | US20130032950 Techniques for Interconnecting Stacked Dies Using Connection Sites |
| 02/07/2013 | US20130032949 Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication |
| 02/07/2013 | US20130032948 Semiconductor device including substrate having grooves |
| 02/07/2013 | US20130032947 Semiconductor package and method of manufacturing the same |
| 02/07/2013 | US20130032946 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies |
| 02/07/2013 | US20130032945 Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication |
| 02/07/2013 | US20130032944 Microelectronic package with stacked microelectronic elements and method for manufacture thereof |
| 02/07/2013 | US20130032943 Semiconductor device |