| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/14/2013 | US20130037774 Semiconductor device |
| 02/14/2013 | US20130037761 Thick film paste containing lead-tellurium-lithium-titanium-oxide and its use in the manufacture of semiconductor devices |
| 02/14/2013 | US20130037748 Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same |
| 02/14/2013 | DE102011086354A1 Multichip-baugruppe auf waferebene Multi-chip module at wafer level |
| 02/14/2013 | DE102011080861A1 Leistungselektronisches System mit einer Schalt- und einer Ansteuereinrichtung Power electronic system with a switch and a control device |
| 02/14/2013 | DE102011080705A1 Verbindungselement für ein Multichipmodul und Multichipmodul Connecting element for a multi-chip module, and multi chip module |
| 02/14/2013 | DE10154771B4 Zusammensetzung auf Siliziumbasis, Film mit niedriger Dielektrizitätskonstante und Verfahren zu dessen Herstellung Composition based on silicon, low dielectric constant film and process for its preparation |
| 02/14/2013 | DE10136743B4 Verfahren zur hermetischen Verkapselung eines Bauelementes Process for hermetic encapsulation of a component |
| 02/13/2013 | EP2557594A1 Semiconductor device reducing risks of a wire short-circuit and a wire flow |
| 02/13/2013 | EP2557593A1 Integrated-terminal-type metal base package module and a method for packaging an integrated terminal for a metal base package module |
| 02/13/2013 | EP2557592A1 Electronic device, display device, and television receiver |
| 02/13/2013 | EP2556535A1 Stacked dual inductor structure |
| 02/13/2013 | EP2556534A2 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages |
| 02/13/2013 | EP2543750A9 Heat sink material |
| 02/13/2013 | EP2138021B1 Electrical connection of components |
| 02/13/2013 | CN202738347U Improved shaft sleeve structure and heat dissipation module thereof |
| 02/13/2013 | CN202736928U Diode |
| 02/13/2013 | CN202736916U Fast recovery rectifier bridge |
| 02/13/2013 | CN202736913U Semiconductor packaging body and mobile phone having the semiconductor packaging body arranged inside |
| 02/13/2013 | CN202736911U Bidirectional thyristor with symmetrical trigger current |
| 02/13/2013 | CN202736910U Semiconductor device |
| 02/13/2013 | CN202736909U Pagoda type IC chip stacking package piece of lead wire frame |
| 02/13/2013 | CN202736908U Coated structure on surface of printed circuit board or semiconductor chip |
| 02/13/2013 | CN202736907U 半导体结构 The semiconductor structure |
| 02/13/2013 | CN202736906U Single tube installation structure |
| 02/13/2013 | CN202736905U Insulating protective sleeve for diode welded pin |
| 02/13/2013 | CN202736904U Copper pour silicon basal plate |
| 02/13/2013 | CN202736611U Reusable electric element |
| 02/13/2013 | CN102934535A Heat sink, and method for producing same |
| 02/13/2013 | CN102934528A Flow channel member, heat exchanger using same, and electronic component device |
| 02/13/2013 | CN102934344A Control device for electric power converter |
| 02/13/2013 | CN102934297A 触点夹持器 Contact holder |
| 02/13/2013 | CN102934228A Miniature surface mount device |
| 02/13/2013 | CN102934227A Stacked ic comprising integrated voltage regulator with embedded passive device |
| 02/13/2013 | CN102934226A Stacked dual inductor structure |
| 02/13/2013 | CN102934225A Semiconductor device and process for manufacture thereof |
| 02/13/2013 | CN102934224A Microelectronic package and method of manufacturing same |
| 02/13/2013 | CN102934223A Bumpless build-up layer package design with an interposer |
| 02/13/2013 | CN102934222A 冷却器 Cooler |
| 02/13/2013 | CN102934221A Surface-mounted electronic component |
| 02/13/2013 | CN102933678A Seal material, solar cell module and photoelectric diode |
| 02/13/2013 | CN102931852A Power transducer |
| 02/13/2013 | CN102931331A A light-emitting device equipped with a heat pipe |
| 02/13/2013 | CN102931219A Semiconductor device and production method thereof |
| 02/13/2013 | CN102931186A Wafer with narrower scribing slots |
| 02/13/2013 | CN102931182A Packaging device of compact single-phase integrated drive circuit and single-phase integrated drive circuit |
| 02/13/2013 | CN102931181A Packaging manufacture method of integrating two bidirectional triode thyristor chips in one photoelectric coupler |
| 02/13/2013 | CN102931175A Thyristor module |
| 02/13/2013 | CN102931174A Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier |
| 02/13/2013 | CN102931173A Multi-chip wafer level package |
| 02/13/2013 | CN102931172A Test device, test device manufacturing method, semiconductor device and semiconductor device manufacturing method |
| 02/13/2013 | CN102931171A Pattern mark and corresponding manufacture method thereof |
| 02/13/2013 | CN102931170A Detecting structure, forming method and detecting method |
| 02/13/2013 | CN102931169A Embedded semiconductor power module and package thereof |
| 02/13/2013 | CN102931168A Packaging substrate and manufacturing method thereof |
| 02/13/2013 | CN102931167A Method for transmitting large driving current signal between stacked chips |
| 02/13/2013 | CN102931166A Semiconductor package structure with low inductance |
| 02/13/2013 | CN102931165A Package substrate and manufacturing method thereof |
| 02/13/2013 | CN102931164A Packaging element of semiconductor device |
| 02/13/2013 | CN102931163A Semiconductor device having an inductor |
| 02/13/2013 | CN102931162A 封装结构及其制作方法 Package structure and production methods |
| 02/13/2013 | CN102931161A Semiconductor packaging member and making method of same |
| 02/13/2013 | CN102931160A Flat foot structure of semiconductor device for removing defective gum |
| 02/13/2013 | CN102931159A 半导体封装结构 The semiconductor package structure |
| 02/13/2013 | CN102931158A 芯片封装结构 Chip package structure |
| 02/13/2013 | CN102931157A Embedded package and method for manufacturing same |
| 02/13/2013 | CN102931156A Structure and manufacturing method of semiconductor chip |
| 02/13/2013 | CN102931155A Bump pad structure |
| 02/13/2013 | CN102931154A Semiconductor apparatus |
| 02/13/2013 | CN102931153A Radiator for microgroove column group |
| 02/13/2013 | CN102931152A Radiating device and buckling structure thereof |
| 02/13/2013 | CN102931151A Heat dissipation device for reactive compensation device |
| 02/13/2013 | CN102931150A Packaging structure without external pin |
| 02/13/2013 | CN102931149A Nano-silicon dioxide and nano-silicon nitride composite material and preparation method thereof |
| 02/13/2013 | CN102931148A Semiconductor package substrate |
| 02/13/2013 | CN102931147A Optical component and manufacturing method for same |
| 02/13/2013 | CN102931146A Optoelectric integrated circuit substrate and method of fabricating same |
| 02/13/2013 | CN102931145A Method for forming pad structure |
| 02/13/2013 | CN102931118A Epitaxy defect analyzing structure and manufacturing method thereof as well as epitaxy defect analyzing method |
| 02/13/2013 | CN102931111A Method for forming semiconductor packaging structures |
| 02/13/2013 | CN102931110A Method for packaging semiconductor component |
| 02/13/2013 | CN102931107A A method for inhibiting growth of intermetallic compounds |
| 02/13/2013 | CN102931105A Tube core bonding method of semiconductor device |
| 02/13/2013 | CN102931104A Compact intelligent power driving module and packaging method thereof |
| 02/13/2013 | CN102931095A Manufacturing method for package substrate and semiconductor packaging structure |
| 02/13/2013 | CN102931094A Wafer level packaging structure with large contact area and preparation method thereof |
| 02/13/2013 | CN102929051A Anti-static liquid crystal display and manufacture method thereof |
| 02/13/2013 | CN102928669A Resistivity test method and resistivity test structure for semiconductor silicon wafer |
| 02/13/2013 | CN102927429A Strip plate section form for machining T-section metal strips |
| 02/13/2013 | CN102922173A Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device |
| 02/13/2013 | CN102201391B Semiconductor device and method of manufacturing the same |
| 02/13/2013 | CN102142402B Flip-chip construction maintaining solder positioning |
| 02/13/2013 | CN102122624B Wafer packaging method |
| 02/13/2013 | CN102104029B Integrated circuit patch for being attached on smart card |
| 02/13/2013 | CN102074537B Chip packaging cell |
| 02/13/2013 | CN102034765B Mounting structure, electro-optical apparatus, and touch panel |
| 02/13/2013 | CN101950738B 集成电路结构 Integrated circuit structure |
| 02/13/2013 | CN101919053B Integrated circuit package having integrated faraday shield |
| 02/13/2013 | CN101853057B 主板 Motherboard |
| 02/13/2013 | CN101851388B Liquid resin composition for electronic component and electronic component device |