| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/19/2013 | US8378477 Integrated circuit packaging system with film encapsulation and method of manufacture thereof |
| 02/19/2013 | US8378476 Integrated circuit packaging system with stacking option and method of manufacture thereof |
| 02/19/2013 | US8378475 Optoelectronic chip carriers |
| 02/19/2013 | US8378474 Devices with faraday cages and internal flexibility sipes |
| 02/19/2013 | US8378473 Semiconductor device having semiconductor chip within multilayer substrate |
| 02/19/2013 | US8378472 Mounting structure for semiconductor element with underfill resin |
| 02/19/2013 | US8378471 Semiconductor chip bump connection apparatus and method |
| 02/19/2013 | US8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof |
| 02/19/2013 | US8378469 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
| 02/19/2013 | US8378468 Semiconductor device and method of manufacturing the same |
| 02/19/2013 | US8378467 Semiconductor device and method of manufacturing the same |
| 02/19/2013 | US8378466 Wafer-level semiconductor device packages with electromagnetic interference shielding |
| 02/19/2013 | US8378465 Method and apparatus for optical modulation |
| 02/19/2013 | US8378462 Semiconductor device having through substrate vias |
| 02/19/2013 | US8378460 Method of batch trimming circuit elements |
| 02/19/2013 | US8378459 Semiconductor device, semiconductor wafer and manufacturing method of the same |
| 02/19/2013 | US8378447 Electrically programmable fuse and fabrication method |
| 02/19/2013 | US8378433 Semiconductor device with a controlled cavity and method of formation |
| 02/19/2013 | US8378422 Electrostatic discharge protection device comprising a plurality of highly doped areas within a well |
| 02/19/2013 | US8378368 Light-emitting diode structure |
| 02/19/2013 | US8378346 Circuit architecture for the parallel supplying during electric or electromagnetic testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 02/19/2013 | US8378234 Housing for an electrical device |
| 02/19/2013 | US8378229 Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 02/19/2013 | US8378226 Wired circuit board |
| 02/19/2013 | US8377822 Semiconductor device and manufacturing method thereof |
| 02/19/2013 | US8377753 Method of fabricating a semiconductor device having a resin with warpage compensated structures |
| 02/19/2013 | US8377750 Integrated circuit packaging system with multiple row leads and method of manufacture thereof |
| 02/19/2013 | US8377748 Method of manufacturing cooling fin and package substrate with cooling fin |
| 02/19/2013 | US8375577 Method of making foil based semiconductor package |
| 02/19/2013 | US8375576 Method for manufacturing wafer scale heat slug system |
| 02/19/2013 | CA2498669C Method for selectively covering a micro machined surface |
| 02/14/2013 | WO2013023157A2 Thin film structure for high density inductors and redistribution in wafer level packaging |
| 02/14/2013 | WO2013022477A2 Lead carrier with multi-material print formed package components |
| 02/14/2013 | WO2013022404A1 Leadframe manufacture |
| 02/14/2013 | WO2013021983A1 Semiconductor device and method for manufacturing same |
| 02/14/2013 | WO2013021922A1 Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device |
| 02/14/2013 | WO2013021921A1 Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device |
| 02/14/2013 | WO2013021870A1 Cooling device and method for producing same |
| 02/14/2013 | WO2013021869A1 Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition |
| 02/14/2013 | WO2013021847A1 Semiconductor device manufacturing method, semiconductor device, and jig for forming wiring |
| 02/14/2013 | WO2013021750A1 Wiring substrate and method for manufacturing same and semiconductor device |
| 02/14/2013 | WO2013021647A1 Semiconductor module, semiconductor device provided with semiconductor module, and method for manufacturing semiconductor module |
| 02/14/2013 | WO2013021255A1 Methods of forming bonded semiconductor structures in 3d integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods |
| 02/14/2013 | WO2013020920A1 Connecting element for a multi-chip module, and multi-chip module |
| 02/14/2013 | WO2013020306A1 Liquid crystal plate and chip-on-film tape coiling substrate |
| 02/14/2013 | WO2012012338A8 Embedded structures and methods of manufacture thereof |
| 02/14/2013 | US20130039112 Semiconductor device |
| 02/14/2013 | US20130037968 Semiconductor apparatus and substrate |
| 02/14/2013 | US20130037967 Semiconductor package substrate |
| 02/14/2013 | US20130037966 Semiconductor device die bonding |
| 02/14/2013 | US20130037965 Three-dimensional integrated circuit, processor, semiconductor chip, and manufacturing method of three-dimensional integrated circuit |
| 02/14/2013 | US20130037964 Semiconductor package |
| 02/14/2013 | US20130037963 Conductive routings in integrated circuits using under bump metallization |
| 02/14/2013 | US20130037962 Wafer level packaging structure with large contact area and preparation method thereof |
| 02/14/2013 | US20130037961 Semiconductor device and method for fabricating the same |
| 02/14/2013 | US20130037960 Methods of forming bonded semiconductor structures in 3d integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods |
| 02/14/2013 | US20130037959 Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods |
| 02/14/2013 | US20130037958 CMOS Image Sensor and Method for Forming the Same |
| 02/14/2013 | US20130037957 Flux composition, process for producing electrically connected structures, electrically connected structure, and semiconductor device |
| 02/14/2013 | US20130037956 Thin film structure for high density inductors and redistribution in wafer level packaging |
| 02/14/2013 | US20130037955 Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof |
| 02/14/2013 | US20130037954 Metallization and Its Use In, In Particular, an IGBT or a Diode |
| 02/14/2013 | US20130037953 Through silicon via structure and manufacturing method thereof |
| 02/14/2013 | US20130037952 Semiconductor package and method for manufacturing the same |
| 02/14/2013 | US20130037951 Semiconductor package structure with low inductance |
| 02/14/2013 | US20130037950 Multi-Chip Wafer Level Package |
| 02/14/2013 | US20130037949 Semiconductor assemblies with multi-level substrates and associated methods of manufacturing |
| 02/14/2013 | US20130037948 Semiconductor device having a through-substrate via |
| 02/14/2013 | US20130037947 Semiconductor device and method of manufacturing the same |
| 02/14/2013 | US20130037946 Semiconductor chip including bump having barrier layer, and manufacturing method thereof |
| 02/14/2013 | US20130037945 Semiconductor device |
| 02/14/2013 | US20130037944 Chip Stack Packages Having Aligned Through Silicon Vias of Different Areas |
| 02/14/2013 | US20130037943 Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package |
| 02/14/2013 | US20130037942 Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages |
| 02/14/2013 | US20130037941 Semiconductor device reducing risks of a wire short-circuit and a wire flow |
| 02/14/2013 | US20130037940 Method for inhibiting growth of intermetallic compounds |
| 02/14/2013 | US20130037939 Semiconductor package and stack-type semiconductor package having the same |
| 02/14/2013 | US20130037938 Embedded package and method for manufacturing the same |
| 02/14/2013 | US20130037937 Bump pad structure |
| 02/14/2013 | US20130037936 Semiconductor Device and Method of Forming a Stackable Semiconductor Package with Vertically-Oriented Discrete Electrical Devices as Interconnect Structures |
| 02/14/2013 | US20130037935 Wafer level package structure and the fabrication method thereof |
| 02/14/2013 | US20130037934 Integrated circuit chip with reduced ir drop |
| 02/14/2013 | US20130037932 Flange for Semiconductor Die |
| 02/14/2013 | US20130037931 Semiconductor package with a heat spreader and method of making |
| 02/14/2013 | US20130037930 Semiconductor chip and semiconductor package having the same |
| 02/14/2013 | US20130037929 Stackable wafer level packages and related methods |
| 02/14/2013 | US20130037928 Semiconductor package and system |
| 02/14/2013 | US20130037927 Lead carrier with multi-material print formed package components |
| 02/14/2013 | US20130037926 Lead Assembly for a Flip-Chip Power Switch |
| 02/14/2013 | US20130037925 Area array qfn |
| 02/14/2013 | US20130037924 Antenna switch modules and methods of making the same |
| 02/14/2013 | US20130037923 Semiconductor package and method of manufacturing the same |
| 02/14/2013 | US20130037922 Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices |
| 02/14/2013 | US20130037917 Wafer level chip scale package with thick bottom metal exposed and preparation method thereof |
| 02/14/2013 | US20130037916 Break pattern of silicon wafer, silicon wafer, and silicon substrate |
| 02/14/2013 | US20130037910 Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof |
| 02/14/2013 | US20130037875 Semiconductor memory device including multi-layer gate structure |
| 02/14/2013 | US20130037859 Semiconductor device and programming method thereof |
| 02/14/2013 | US20130037803 Monitoring pad and semiconductor device including the same |
| 02/14/2013 | US20130037802 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication |