| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/20/2013 | EP2560201A2 Semiconductor packaging structure and method of fabricating the same |
| 02/20/2013 | EP2560200A2 Diode Structure |
| 02/20/2013 | EP2560199A1 Process for manufacturing a through insulated interconnection in a body of semiconductor material |
| 02/20/2013 | EP2560198A1 Light-reflective anisotropic conductive adhesive agent, and light emitting device |
| 02/20/2013 | EP2560191A1 Semiconductor substrate having dot markings, and method for producing same |
| 02/20/2013 | EP2560073A1 Semiconductor device predictive dynamic thermal management |
| 02/20/2013 | EP2559938A2 Heat sink for LED lamp |
| 02/20/2013 | EP2559732A2 Epoxy encapsulating and lamination adhesive and method of making same |
| 02/20/2013 | EP2559065A1 Surface mount device thin package |
| 02/20/2013 | EP2559064A1 High density gallium nitride devices using island topology |
| 02/20/2013 | EP2559063A1 A flow distributor |
| 02/20/2013 | EP2559062A2 Forming functionalized carrier structures with coreless packages |
| 02/20/2013 | DE202011051987U1 Trägerstruktur für elektronische Bauelemente, wie lichtemittierende Dioden, und Basismaterial zur Herstellung einer Basisplatte für eine solche Struktur Carrier structure for electronic components, such as light emitting diodes, and a base material for manufacturing a base plate for such a structure |
| 02/20/2013 | CN202750386U Heat-radiating device |
| 02/20/2013 | CN202749373U Infrared remote control receiving amplifier with double-layer structure |
| 02/20/2013 | CN202749371U Stacked transient voltage suppression diode |
| 02/20/2013 | CN202749370U Stacking type diode |
| 02/20/2013 | CN202749369U Infrared remote control amplifier |
| 02/20/2013 | CN202749368U Encapsulating structure of preamplifier circuit of radio-cassette recorder |
| 02/20/2013 | CN202749367U Multi-contact smart card carrier tape with golden fingers |
| 02/20/2013 | CN202749366U Bridge type rectifier DF frame |
| 02/20/2013 | CN202749365U Rectifier bridge frame |
| 02/20/2013 | CN202749364U Annular heat pipe section material superconducting radiator |
| 02/20/2013 | CN202749363U High-power whole wafer insulated gate bipolar transistor (IGBT) packaging structure |
| 02/20/2013 | CN202749362U 半导体封装 The semiconductor package |
| 02/20/2013 | CN202749361U High-power whole wafer insulated gate bipolar transistor (IGBT) ceramic packaging structure |
| 02/20/2013 | CN202749360U Silicon-table-top semiconductor device having PN-junction protection |
| 02/20/2013 | CN202749359U Highly reliable wafer-level cylindrical bump packaging structure |
| 02/20/2013 | CN202748724U Multi-channel mixed water-cooling and air-cooling device for CPU of computer |
| 02/20/2013 | CN202747871U Heat pipe radiator |
| 02/20/2013 | CN202747869U Heat radiation structure for heat radiation unit |
| 02/20/2013 | CN102939651A Moisture barrier potting compound |
| 02/20/2013 | CN102939646A Beverage product with stable dairy foam |
| 02/20/2013 | CN102939313A Curable resin composition and cured product thereof |
| 02/20/2013 | CN102938997A 散热装置 Cooling devices |
| 02/20/2013 | CN102938401A Stack packages having fastening element and halogen-free inter-package connector |
| 02/20/2013 | CN102938400A Inductor structure |
| 02/20/2013 | CN102938399A Metal interconnection layer with adjustable dielectric constants and manufacture method of metal interconnection layer |
| 02/20/2013 | CN102938398A Packaging structure for kernel module of intelligent electricity meter |
| 02/20/2013 | CN102938397A Conductive electrode provided with linear material, electronic device and manufacturing method thereof |
| 02/20/2013 | CN102938396A Silicon through hole structure and manufacture method thereof |
| 02/20/2013 | CN102938395A Honeycomb type cooling fin structure |
| 02/20/2013 | CN102938390A Chip package process and chip package structure |
| 02/20/2013 | CN102938382A Array substrate manufacturing method, array substrate and display device |
| 02/20/2013 | CN102938366A Polyresistor structures, preparation method thereof and polyresistor |
| 02/20/2013 | CN102938365A Polyresistor structures, preparation method thereof and polyresistor |
| 02/20/2013 | CN102938364A Method using alignment mark in copper wiring metal injection molding (MIM) capacitance process |
| 02/20/2013 | CN102938086A High temperature and acid-base resistant flexible electronic label and manufacturing process thereof |
| 02/20/2013 | CN102937663A Packaging structure and method for kernel module of intelligent electricity meter |
| 02/20/2013 | CN102231383B Ceramic packing device and method of image sensor |
| 02/20/2013 | CN102148204B Multi-direction design for bump pad structures |
| 02/20/2013 | CN102027591B Semiconductor module, method for manufacturing semiconductor module and portable apparatus |
| 02/20/2013 | CN101933138B Metal housing part and method for producing the housing part |
| 02/20/2013 | CN101908554B Organic electro-luminescence display device and method for fabricating the same |
| 02/20/2013 | CN101887875B Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| 02/20/2013 | CN101754656B Uniform temperature plate |
| 02/20/2013 | CN101742892B Heat pipe radiator |
| 02/20/2013 | CN101742888B Radiation device and electronic equipment using same |
| 02/20/2013 | CN101742884B Fins and heat-radiating device using fins |
| 02/20/2013 | CN101730451B Heat radiation device |
| 02/20/2013 | CN101662921B Heat radiation device and computer equipment with same |
| 02/20/2013 | CN101568246B Fixing piece and heat dissipating device using same |
| 02/20/2013 | CN101505164B Audio encoding and decoding module for mobile terminal |
| 02/20/2013 | CN101463982B LED lamp |
| 02/20/2013 | CN101452917B 光源装置 The light source device |
| 02/20/2013 | CN101410974B Electrically enhanced wirebond package |
| 02/20/2013 | CN101252106B Wafer structure with buffer layer |
| 02/20/2013 | CN101236923B Integrated circuit (IC) chip with vertical plate capacitors and method of making the capacitors |
| 02/20/2013 | CN101166023B Impulse output circuit, shift register and displaying device |
| 02/19/2013 | USRE44019 Stacked semiconductor module |
| 02/19/2013 | US8380273 Analyte monitoring device and methods of use |
| 02/19/2013 | US8379402 Wiring board having lead pin, and lead pin |
| 02/19/2013 | US8378508 Integrally molded die and bezel structure for fingerprint sensors and the like |
| 02/19/2013 | US8378507 Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate |
| 02/19/2013 | US8378506 Packaged electronic device having metal comprising self-healing die attach material |
| 02/19/2013 | US8378505 Semiconductor substrate structure and semiconductor device |
| 02/19/2013 | US8378504 Microelectronic package with self-heating interconnect |
| 02/19/2013 | US8378503 Apparatus for thermal control of semiconductor chip assembly and underfill |
| 02/19/2013 | US8378502 Integrated circuit package system with image sensor system |
| 02/19/2013 | US8378501 Semiconductor package and semiconductor package module |
| 02/19/2013 | US8378500 Stacked semiconductor device including a serial path |
| 02/19/2013 | US8378498 Chip assembly with a coreless substrate employing a patterned adhesive layer |
| 02/19/2013 | US8378497 Contact structures and semiconductor devices including the same |
| 02/19/2013 | US8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection |
| 02/19/2013 | US8378495 Integrated circuit (IC) having TSVS with dielectric crack suppression structures |
| 02/19/2013 | US8378494 Method for fabrication of a semiconductor device and structure |
| 02/19/2013 | US8378493 Generation of metal holes by via mutation |
| 02/19/2013 | US8378492 Semiconductor package |
| 02/19/2013 | US8378491 Integrated circuit including interconnect levels |
| 02/19/2013 | US8378490 Semiconductor apparatus including a metal alloy between a first contact and a second contact |
| 02/19/2013 | US8378488 Semiconductor device and method of manufacturing the same |
| 02/19/2013 | US8378486 Semiconductor device and method of manufacturing semiconductor device |
| 02/19/2013 | US8378485 Solder interconnect by addition of copper |
| 02/19/2013 | US8378484 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device |
| 02/19/2013 | US8378483 Fabrication process and device of multi-chip package having spliced substrates |
| 02/19/2013 | US8378482 Wiring board |
| 02/19/2013 | US8378481 Semiconductor module with micro-buffers |
| 02/19/2013 | US8378480 Dummy wafers in 3DIC package assemblies |
| 02/19/2013 | US8378479 Semiconductor device and method for fabricating semiconductor device |
| 02/19/2013 | US8378478 Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts |