| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/26/2013 | US8384204 Circuit carrier and semiconductor package using the same |
| 02/26/2013 | US8384203 Packaging structural member |
| 02/26/2013 | US8384202 Semiconductor device, and communication apparatus and electronic apparatus having the same |
| 02/26/2013 | US8384201 Wafer and method for improving yield rate of wafer |
| 02/26/2013 | US8384200 Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies |
| 02/26/2013 | US8384199 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system |
| 02/26/2013 | US8384197 Semiconductor device and method for manufacturing same |
| 02/26/2013 | US8384189 High performance system-on-chip using post passivation process |
| 02/26/2013 | US8384185 Semiconductor device and a method of manufacturing the same |
| 02/26/2013 | US8384158 Chip and electrostatic discharge protection device thereof |
| 02/26/2013 | US8384132 System for separation of an electrically conductive connection |
| 02/26/2013 | US8384117 Light emitting device package and lighting system including the same |
| 02/26/2013 | US8384116 Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display |
| 02/26/2013 | US8384103 Increasing contrast in electronic color displays via surface texturing of LEDs |
| 02/26/2013 | US8383964 Terminal structure, printed wiring board, module substrate, and electronic device |
| 02/26/2013 | US8383962 Exposed die pad package with power ring |
| 02/26/2013 | US8383949 Method to form lateral pad on edge of wafer |
| 02/26/2013 | US8383514 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 02/26/2013 | US8383507 Method for fabricating air gap interconnect structures |
| 02/26/2013 | US8383478 High-density nonvolatile memory and methods of making the same |
| 02/26/2013 | US8383462 Method of fabricating an integrated circuit package |
| 02/26/2013 | US8383458 Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof |
| 02/26/2013 | US8383007 Seeding resins for enhancing the crystallinity of polymeric substructures |
| 02/26/2013 | CA2550015C Metal-based carbon fiber composite material and method for producing the same |
| 02/21/2013 | WO2013025982A1 Liquid cooling of stacked die through substrate lamination |
| 02/21/2013 | WO2013025981A2 Selective plating of frame lid assembly |
| 02/21/2013 | WO2013025728A1 Semiconductor laser mounting with intact diffusion barrier layer |
| 02/21/2013 | WO2013025573A2 Solder bump bonding in semiconductor package using solder balls having high-temperature cores |
| 02/21/2013 | WO2013025338A1 Multi-chip package and interposer with signal line compression |
| 02/21/2013 | WO2013025205A1 Offset interposers for large-bottom packages and large-die package-on-package structures |
| 02/21/2013 | WO2013025130A1 Heat removal device |
| 02/21/2013 | WO2013024813A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module |
| 02/21/2013 | WO2013024677A1 Semiconductor device, manufacturing method thereof, and mobile telephone |
| 02/21/2013 | WO2013024561A1 Light-emitting device |
| 02/21/2013 | WO2013024560A1 Light-emitting device |
| 02/21/2013 | WO2013023388A1 Embeded circuit board and method for manufacturing the same |
| 02/21/2013 | WO2013023386A1 Chip on film tape baseplate of liquid crystal panel, and liquid crystal panel |
| 02/21/2013 | WO2013023360A1 Test pin array with electrostatic discharge protection |
| 02/21/2013 | WO2013023321A1 Mixing manifold and method |
| 02/21/2013 | WO2012175627A3 Thermal management system with variable-volume material |
| 02/21/2013 | WO2012143770A3 Cooling fin structure |
| 02/21/2013 | US20130045572 Flexible routing for high current module application |
| 02/21/2013 | US20130045329 Manufacturing method thereof and a semiconductor device |
| 02/21/2013 | US20130043940 Back-to-back stacked dies |
| 02/21/2013 | US20130043897 Testing stacked die |
| 02/21/2013 | US20130043604 Semiconductor device and method for manufacturing the same |
| 02/21/2013 | US20130043603 Method of forming a conductive image on a non-conductive surface |
| 02/21/2013 | US20130043602 Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer |
| 02/21/2013 | US20130043601 Universal printed circuit board and memory card including the same |
| 02/21/2013 | US20130043600 Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate |
| 02/21/2013 | US20130043599 Chip package process and chip package structure |
| 02/21/2013 | US20130043598 Bond pad structure to reduce bond pad corrosion |
| 02/21/2013 | US20130043597 Semiconductor Constructions and Methods of Forming Interconnects |
| 02/21/2013 | US20130043596 Semiconductor device |
| 02/21/2013 | US20130043595 Semiconductor Package Containing Silicon-On-Insulator Die Mounted In Bump-On-Leadframe Manner To Provide Low Thermal Resistance |
| 02/21/2013 | US20130043594 Method for manufacturing semiconductor device and semiconductor device |
| 02/21/2013 | US20130043593 Semiconductor Arrangement |
| 02/21/2013 | US20130043591 Tungsten metallization: structure and fabrication of same |
| 02/21/2013 | US20130043590 Semiconductor structure and method of manufacturing |
| 02/21/2013 | US20130043589 Methods of Forming a Non-Planar Cap Layer Above Conductive Lines on a Semiconductor Device |
| 02/21/2013 | US20130043588 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate |
| 02/21/2013 | US20130043587 Package-on-package structures |
| 02/21/2013 | US20130043586 Method for encapsulating electronic components on a wafer |
| 02/21/2013 | US20130043585 Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus |
| 02/21/2013 | US20130043584 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements |
| 02/21/2013 | US20130043583 Dummy Flip Chip Bumps for Reducing Stress |
| 02/21/2013 | US20130043582 Multiple die in a face down package |
| 02/21/2013 | US20130043581 Semiconductor device |
| 02/21/2013 | US20130043579 Power semiconductor arrangement, power semiconductor module with multiple power semiconductor arrangements, and module assembly comprising multiple power semiconductor modules |
| 02/21/2013 | US20130043578 Presspin, power semiconducter module and semiconducter module assembly with multiple power semiconducter modules |
| 02/21/2013 | US20130043577 Manufacturing method thereof and a semiconductor device |
| 02/21/2013 | US20130043576 Semiconductor device |
| 02/21/2013 | US20130043575 Chip-packaging module for a chip and a method for forming a chip-packaging module |
| 02/21/2013 | US20130043574 Multi-Die Semiconductor Package With One Or More Embedded Die Pads |
| 02/21/2013 | US20130043573 Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores |
| 02/21/2013 | US20130043572 Bump-On-Leadframe Semiconductor Package With Low Thermal Resistance |
| 02/21/2013 | US20130043571 Power overlay structure with leadframe connections |
| 02/21/2013 | US20130043570 Chip package and method for forming the same |
| 02/21/2013 | US20130043569 Integrated Circuit Devices and Methods and Apparatuses for Designing Integrated Circuit Devices |
| 02/21/2013 | US20130043568 Memory device and a fabricating method thereof |
| 02/21/2013 | US20130043566 Semiconductor device and flip-chip package |
| 02/21/2013 | US20130043565 Integrated circuit system with sub-geometry removal and method of manufacture thereof |
| 02/21/2013 | US20130043556 Size-filtered multimetal structures |
| 02/21/2013 | US20130043541 Low power/high speed tsv interface design |
| 02/21/2013 | US20130043514 Multiphase ultra low k dielectric material |
| 02/21/2013 | US20130043470 Crack stop structure and method for forming the same |
| 02/21/2013 | US20130042912 Solder bonded body, method of producing solder bonded body, element, photovoltaic cell, method of producing element and method of producing photovoltaic cell |
| 02/21/2013 | DE102012213407A1 Halbleiteranordnung Semiconductor device |
| 02/21/2013 | DE102012107403A1 Chip-Gehäuse-Modul für einen Chip und ein Verfahren zum Herstellen eines Chip-Gehäuse-Moduls Chip package for a chip module and a method of manufacturing a chip package module |
| 02/21/2013 | DE102012105764A1 Housing stack structure for wireless mobile phone, has intermediate housing terminals to transfer data signals and address/control signals and to provide power supply voltage for address/control circuit and data circuit, respectively |
| 02/21/2013 | DE102011111032A1 Method for manufacturing power-semiconductor module, involves copper layer made of electrically conductive material differs from material and isolated on connecting surfaces and bonding wires |
| 02/21/2013 | DE102011081100A1 Anordnung mit Photozellen Arrangement with photocell |
| 02/21/2013 | DE102009019313B4 Anordnung und Verfahren zum Kühlen einer wärmeerzeugenden Baueinheit Apparatus and method for cooling a heat generating unit |
| 02/21/2013 | DE102008025599B4 Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat Packaged active microstructures with direct contacting a substrate |
| 02/21/2013 | DE102005010337B4 Bauelementanordnung mit einem Bipolartransistor und einem Lastunterbrechungsdetektor Component arrangement with a bipolar transistor and a load interruption detector |
| 02/21/2013 | CA2844789A1 Semiconductor laser mounting with intact diffusion barrier layer |
| 02/21/2013 | CA2844563A1 Mixing manifold and method |
| 02/20/2013 | EP2560204A2 Power semiconducter module and semiconducter module assembly with multiple power semiconducter modules |
| 02/20/2013 | EP2560203A1 Power semiconductor arrangement |
| 02/20/2013 | EP2560202A2 Heat sinking plate |