| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/27/2013 | EP2562805A1 Glass substrate for semiconductor device via |
| 02/27/2013 | EP2562293A1 Silver anti-tarnishing agent, silver anti-tarnishing resin composition, silver anti-tarnishing method, and light-emitting diode using same |
| 02/27/2013 | EP2561729A1 Printed circuit board with cavity |
| 02/27/2013 | EP2561559A1 Solid state light emitting diode packages with leadframes and ceramic material and methods of forming the same |
| 02/27/2013 | EP2561373A1 Methods and devices for stressing an integrated circuit |
| 02/27/2013 | CN202758894U High frequency circuit transistor |
| 02/27/2013 | CN202758888U Sensor sealing module |
| 02/27/2013 | CN202758883U Stacked semiconductor device assembly |
| 02/27/2013 | CN202758882U Trimming device of analog/digital analogy mixed signal processing chip |
| 02/27/2013 | CN202758881U Framework of SMD type diode |
| 02/27/2013 | CN202758880U Lead frame |
| 02/27/2013 | CN202758879U Improved lead frame |
| 02/27/2013 | CN202758878U Integrated chip having multiple zigzag connection lines |
| 02/27/2013 | CN202758877U Five-pin integrated chip encapsulation structure |
| 02/27/2013 | CN202758876U Integrated IC internally provided with alloy connection wires |
| 02/27/2013 | CN202758875U Integrated chip having conical solder balls |
| 02/27/2013 | CN202758874U Integrated chip |
| 02/27/2013 | CN202758873U Integrated chip having connection wire of dog-legged shape |
| 02/27/2013 | CN202758872U Stripe unit used for installing double-interface intelligent card chip |
| 02/27/2013 | CN202758871U Semiconductor structure and packaging construction |
| 02/27/2013 | CN202758870U Semiconductor structure |
| 02/27/2013 | CN202758869U Wafer scale package structure of image sensor |
| 02/27/2013 | CN202758868U Integrated chip based on bonding weld lines |
| 02/27/2013 | CN202758867U An integrated circuit chip structure |
| 02/27/2013 | CN202758866U Glass seal structure for metal sealing device of semiconductor |
| 02/27/2013 | CN202758865U Electronic component separating device |
| 02/27/2013 | CN202758306U Central processing unit (CPU) heat dissipating device |
| 02/27/2013 | CN102948266A Printed circuit board with cavity |
| 02/27/2013 | CN102947933A Structure for attaching heat sink, and heat sink attached using the structure |
| 02/27/2013 | CN102947932A Heat transfer sheet, manufacturing method for heat transfer sheet, and heat radiation device |
| 02/27/2013 | CN102947931A Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same |
| 02/27/2013 | CN102947930A Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device |
| 02/27/2013 | CN102947929A Film for back surface of flip-chip semiconductor |
| 02/27/2013 | CN102947871A Semiconductor device and process for production thereof |
| 02/27/2013 | CN102947393A Typical metal containing polysiloxane composition, process for production of same, and uses thereof |
| 02/27/2013 | CN102945849A Semiconductor capacitor structure and manufacture method thereof |
| 02/27/2013 | CN102945848A Semiconductor device |
| 02/27/2013 | CN102945843A Detection structure and resistance measurement method |
| 02/27/2013 | CN102945842A Alignment mark and manufacturing method thereof |
| 02/27/2013 | CN102945841A Structure and method for testing effective channel length of metal oxide semiconductor (MOS) transistor |
| 02/27/2013 | CN102945840A Semiconductor chip packaging structure and packaging method |
| 02/27/2013 | CN102945839A High-voltage interconnection structure with practically-screened field plate |
| 02/27/2013 | CN102945838A High voltage interconnection structure |
| 02/27/2013 | CN102945837A Semiconductor module structure and connecting and fixing method for bonding wires therein |
| 02/27/2013 | CN102945836A Semiconductor package structure |
| 02/27/2013 | CN102945835A Electronic packaging housing |
| 02/27/2013 | CN102945825A Copper interconnection structure with metal cap cover and manufacture method thereof |
| 02/27/2013 | CN102945794A Two-dimensional electronic material device and mixed photoetching method thereof |
| 02/27/2013 | CN102944959A Array substrate, producing method and testing method thereof and display device |
| 02/27/2013 | CN102944709A Electric meter module structure realized by adopting multi-chip system-level packaging technology and packaging method thereof |
| 02/27/2013 | CN102171821B Waterproof structure for bonding pad, waterproof bonding pad and method for forming waterproof structure |
| 02/27/2013 | CN102150262B Mainboard assembly including a package overlying a die directly attached to the mainboard |
| 02/27/2013 | CN102142429B Plasma induced damage (PID) detection structure and manufacture method thereof |
| 02/27/2013 | CN102131874B Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 02/27/2013 | CN102076734B Modified resin composition, method for producing the same, and curable resin composition containing the same |
| 02/27/2013 | CN102034772B Diamond-bottom semiconductor device and relevant method thereof |
| 02/27/2013 | CN102015883B Resin composition and sheet using the same |
| 02/27/2013 | CN101982875B Packaging structure of N substrate diode half bridges with common anodes in TO-220 |
| 02/27/2013 | CN101952953B Method for formation of siliceous film and siliceous film formed by the method |
| 02/27/2013 | CN101894827B Test wafer for gluing and edge cleaning detection |
| 02/27/2013 | CN101826561B Method of forming stacked capacitor dram cells |
| 02/27/2013 | CN101796636B Chip connection method |
| 02/27/2013 | CN101789439B Resistive random access memory used in flexible circuits and production method thereof |
| 02/27/2013 | CN101640201B Method of manufacturing high-integrated semiconductor device and semiconductor device manufactured using the same |
| 02/27/2013 | CN101635305B Organic light-emitting display device |
| 02/27/2013 | CN101547588B Cooling device for accommodated printed circuit board in a chassis |
| 02/27/2013 | CN101390253B Ceramic antenna module and methods of manufacture thereof |
| 02/27/2013 | CN101316499B Cooling substrates and cooling material |
| 02/27/2013 | CN101290905B Display panel and wire manufacturing method thereof |
| 02/26/2013 | US8386990 Unique identifier derived from an intrinsic characteristic of an integrated circuit |
| 02/26/2013 | US8386979 Method and apparatus to design an interconnection device in a multi-layer shielding mesh |
| 02/26/2013 | US8386801 Authentication of integrated circuits |
| 02/26/2013 | US8385067 In-line memory and circuit board cooling system |
| 02/26/2013 | US8384508 Method for making high-performance RF integrated circuits |
| 02/26/2013 | US8384506 Magnetic device having a conductive clip |
| 02/26/2013 | US8384426 Semiconductor device and structure |
| 02/26/2013 | US8384231 Method of forming a semiconductor die |
| 02/26/2013 | US8384230 Semiconductor device |
| 02/26/2013 | US8384229 Semiconductor device and method for manufacturing the same |
| 02/26/2013 | US8384228 Package including wires contacting lead frame edge |
| 02/26/2013 | US8384227 Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die |
| 02/26/2013 | US8384226 Hybrid bump capacitor |
| 02/26/2013 | US8384225 Through silicon via with improved reliability |
| 02/26/2013 | US8384223 Backside mold process for ultra thin substrate and package on package assembly |
| 02/26/2013 | US8384222 Semiconductor device and manufacturing method thereof |
| 02/26/2013 | US8384221 Semiconductor device, LED head and method of manufacturing the same |
| 02/26/2013 | US8384220 Semiconductor integrated circuit device and fabrication process thereof |
| 02/26/2013 | US8384219 Semiconductor having interconnects with improved mechanical properties by insertion of nanoparticles |
| 02/26/2013 | US8384218 Back side metallization with superior adhesion in high-performance semiconductor devices |
| 02/26/2013 | US8384215 Wafer level molding structure |
| 02/26/2013 | US8384214 Semiconductor structure, pad structure and protection structure |
| 02/26/2013 | US8384213 Semiconductor device, circuit board, and electronic instrument |
| 02/26/2013 | US8384212 Semiconductor equipment and method of manufacturing the same |
| 02/26/2013 | US8384211 Semiconductor apparatus with improved efficiency of thermal radiation |
| 02/26/2013 | US8384210 Thermal interface material and semiconductor component including the thermal interface material |
| 02/26/2013 | US8384209 Semiconductor device and method for manufacturing semiconductor device |
| 02/26/2013 | US8384208 Semiconductor device and method of fabricating the same |
| 02/26/2013 | US8384207 Semiconductor integrated circuit device having insulated through wires |
| 02/26/2013 | US8384206 Semiconductor package |
| 02/26/2013 | US8384205 Electronic device package and method of manufacture |