| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2015 | US20150021764 Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers |
| 01/22/2015 | US20150021763 Epoxy resin composition and semiconductor apparatus prepared using the same |
| 01/22/2015 | US20150021762 Semiconductor substrate having stress-absorbing surface layer |
| 01/22/2015 | US20150021761 Multi-chip package |
| 01/22/2015 | US20150021760 Mechanisms for forming bonding structures |
| 01/22/2015 | US20150021759 Mechanisms for forming package structure |
| 01/22/2015 | US20150021758 Mechanisms for forming bump structures over wide metal pad |
| 01/22/2015 | US20150021757 Systems and Methods for Reducing Contact Resistivity of Semiconductor Devices |
| 01/22/2015 | US20150021756 Semiconductor device |
| 01/22/2015 | US20150021755 Stacked package and method of manufacturing the same |
| 01/22/2015 | US20150021754 Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management |
| 01/22/2015 | US20150021753 Packaging structure of a semiconductor device |
| 01/22/2015 | US20150021752 Semiconductor device |
| 01/22/2015 | US20150021751 Semiconductor device with plated pillars and leads |
| 01/22/2015 | US20150021750 Semiconductor device and method for manufacturing the same |
| 01/22/2015 | US20150021749 Semiconductor device and manufacturing method thereof |
| 01/22/2015 | US20150021748 Semiconductor device |
| 01/22/2015 | US20150021744 Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same |
| 01/22/2015 | US20150021736 Electronic fuse line with modified cap |
| 01/22/2015 | US20150021733 Semiconductor wafer, semiconductor ic chip and manufacturing method of the same |
| 01/22/2015 | US20150021713 Guard ring structure of semiconductor arrangement |
| 01/22/2015 | US20150021707 Electromagnetic shield and associated methods |
| 01/22/2015 | US20150021647 Luminous element |
| 01/22/2015 | US20150021618 Semiconductor device |
| 01/22/2015 | US20150021617 Semiconductor device |
| 01/22/2015 | US20150021612 Array substrate, display device and manufacturing method of array substrate |
| 01/22/2015 | US20150021602 Thin film transistor display panel and manufacturing method thereof |
| 01/22/2015 | US20150021376 Wire bonding capillary with working tip protrusion |
| 01/22/2015 | DE112013002390T5 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation |
| 01/22/2015 | DE112010003451B4 Selektives Züchten einer einzelnen Nanoröhre innerhalb eines Durchgangskontaktes unter Verwendung eines lonenstrahls Selective breeding of a single nanotube within a passage contact using an ion beam |
| 01/22/2015 | DE10301091B4 Leistungs-Halbleiterbauelement und Verfahren zur Verbindung von einem gemeinsamen Substratträger zugeordneten Halbleitereinrichtungen Power semiconductor device and process for connecting a common substrate carrier associated semiconductor devices |
| 01/22/2015 | DE102014109870A1 Elektronische Vorrichtung und Verfahren zum Herstellen einer elektronischen Vorrichtung An electronic device and method for manufacturing an electronic device |
| 01/22/2015 | DE102014109230A1 Infrarot-dämpfende oder blockierende Schicht in optischem Nähesensor Infrared-absorbing or blocking layer in optical proximity sensor |
| 01/22/2015 | DE102013216035B3 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module |
| 01/22/2015 | DE102013107727A1 Dämmschicht für eine flächige Wärmeabschirmeinrichtung Insulation for a flat Thermal shield |
| 01/22/2015 | DE102011103516B4 Verfahren zum Befüllen eines Hohlraums mit einer Atmosphäre Method for filling a cavity with an atmosphere |
| 01/22/2015 | DE102009016842B4 Leitungsgitter für Elektronikgehäuse und Herstellungsverfahren Grid of wires for electronics housing and manufacturing processes |
| 01/22/2015 | DE102007015534B4 Leistungshalbleitermodul The power semiconductor module |
| 01/22/2015 | DE102007012155B4 Formkörper und Nutzen mit Halbleiterchips und Verfahren zur Herstellung des Nutzens Shaped body and benefits with semiconductor chips and processes for making the benefits |
| 01/22/2015 | DE102006009021B4 Halbleiterbauelement mit Elektrodenteil A semiconductor device having electrode part |
| 01/21/2015 | EP2827375A1 Detection device comprising an improved cold finger |
| 01/21/2015 | EP2827366A1 Power semiconductor module |
| 01/21/2015 | EP2827365A1 Image forming apparatus and chip |
| 01/21/2015 | EP2827364A1 Semiconductor device |
| 01/21/2015 | EP2826818A1 Sealant paste and sealing method |
| 01/21/2015 | EP2826066A1 Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
| 01/21/2015 | CN204119708U 散热器 Heat sink |
| 01/21/2015 | CN204118077U 一种用于开关电源的新型快恢复二极管 A new switching power fast recovery diode |
| 01/21/2015 | CN204118074U 一种电流控制装置 A current control device |
| 01/21/2015 | CN204118072U 电子器件 Electronic devices |
| 01/21/2015 | CN204118069U 一种电源开关电路芯片结构 A power supply switching circuit chip structure |
| 01/21/2015 | CN204118065U 采用引线键合的仿形屏蔽结构 Using wire bonding contoured shield structure |
| 01/21/2015 | CN204118064U 一种芯片倾斜堆叠的圆片级封装单元 A chip wafer level package inclined stacking unit |
| 01/21/2015 | CN204118063U 一种芯片倾斜堆叠的圆片级封装单元 A chip wafer level package inclined stacking unit |
| 01/21/2015 | CN204118062U 钎焊接合结构 Brazing structure |
| 01/21/2015 | CN204118061U 一种直流换流阀散热器电极的提取工装 A DC converter valve radiator electrode extraction tooling |
| 01/21/2015 | CN204118060U 一种水冷散热装置 One kind of water cooling device |
| 01/21/2015 | CN204118059U 应用于晶圆级半导体器件的散热结构 Radiating structure is applied to the wafer-level semiconductor devices |
| 01/21/2015 | CN204118058U 间歇工作型cpu散热器 Intermittent type cpu heatsink |
| 01/21/2015 | CN204118057U 一种使用热管的压接式igbt封装结构 A method of using a heat pipe crimping igbt package structure |
| 01/21/2015 | CN204118056U 一种晶圆保护膜及其涂刷装置 One kind of protective film and brushing device wafer |
| 01/21/2015 | CN204118055U 双光电二极管裸封结构 Bare seal double photodiode structure |
| 01/21/2015 | CN204118054U 一种制备柔性屏显示基板的中间结构 An intermediate structure flexible screen display substrate preparation |
| 01/21/2015 | CN204118053U 基于lcp基板的封装外壳 Based on the package substrate shell lcp |
| 01/21/2015 | CN204117076U 一种被动式散热机箱 A passive cooling chassis |
| 01/21/2015 | CN104303412A 冷却构造体和电力转换装置 Cooling structure and the power conversion means |
| 01/21/2015 | CN104303319A 用于防止半导体层堆叠、薄衬底cpv电池和太阳能电池组件中电短路的方法 For preventing the semiconductor layer stack, thin substrate cpv cells and solar cell modules in an electrical short Method |
| 01/21/2015 | CN104303296A 电路组件 Circuit Components |
| 01/21/2015 | CN104303295A 冷却构造体和电力转换装置 Cooling structure and the power conversion means |
| 01/21/2015 | CN104303294A 冷却构造体和电力转换装置 Cooling structure and the power conversion means |
| 01/21/2015 | CN104303293A 冷却装置的连接结构、冷却装置和连接冷却装置的方法 Connection structure of the cooling apparatus, cooling apparatus and method for connecting a cooling device |
| 01/21/2015 | CN104303292A 热绝缘组合物及使用该热绝缘组合物组装的电子装置 Thermal insulation composition and use of electronic devices that heat insulation composition assembled |
| 01/21/2015 | CN104303291A 可表面安装的半导体器件 The surface of the semiconductor device can be mounted |
| 01/21/2015 | CN104303290A 热传导性片材供给体及热传导性片材的供给方法 The method of supplying heat conductive sheet feed body and thermal conductivity of the sheet |
| 01/21/2015 | CN104303289A 电子模块及其制造方法 Electronic module and manufacturing method thereof |
| 01/21/2015 | CN104303288A 指纹传感器封装件及其制造方法 Fingerprint sensor package and method for manufacturing |
| 01/21/2015 | CN104303287A 指纹传感器封装件及其制造方法 Fingerprint sensor package and method for manufacturing |
| 01/21/2015 | CN104302723A 带有凸块电极的半导体器件制造用粘合剂片材及半导体器件的制造方法 The semiconductor device having a bump electrode for producing an adhesive sheet and a method of manufacturing a semiconductor device |
| 01/21/2015 | CN104302474A 伸缩性散热片和贴附有该伸缩性散热片的物品 Stretchable and attached with the heat sink fins stretchable articles |
| 01/21/2015 | CN104299964A 一种层叠封装结构及其制备方法 A laminated packaging structure and its preparation method |
| 01/21/2015 | CN104299963A 一种mos静电保护结构及保护方法 One kind mos electrostatic protection structure and protection methods |
| 01/21/2015 | CN104299962A 静电电荷消散系统 Electrostatic charge dissipation system |
| 01/21/2015 | CN104299961A 一种阵列基板及其制备方法 One kind of array substrate and its preparation method |
| 01/21/2015 | CN104299960A 半导体装置和半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 01/21/2015 | CN104299959A 倒装芯片的测试结构、倒装芯片和倒装芯片的制作方法 Production methods flip chip test structures, flip chip and flip chip |
| 01/21/2015 | CN104299958A 互连结构及互连结构的形成方法 The method of forming an interconnect structure and the interconnect structure |
| 01/21/2015 | CN104299957A 多晶硅熔丝监控结构及监控方法 Polysilicon fuse monitoring structures and monitoring method |
| 01/21/2015 | CN104299956A 使用cmos兼容反铁电高k材料的复杂电路组件及电容器 Use cmos compatible antiferroelectric complex high-k material and capacitor circuit components |
| 01/21/2015 | CN104299955A 一种方形扁平无引脚封装 One kind of quad flat no-lead package |
| 01/21/2015 | CN104299954A 一种用于半导体焊接的铜线 A copper wire for welding of semiconductor |
| 01/21/2015 | CN104299953A 电子器件和用于制造电子器件的方法 The method of manufacturing an electronic device and an electronic device for |
| 01/21/2015 | CN104299952A 在宽金属焊盘上方形成凸块结构的机制 Mechanism at the top of the wide metal pad bump structure formation |
| 01/21/2015 | CN104299951A 芯片封装连接器组件 Chip package connector assembly |
| 01/21/2015 | CN104299950A 晶圆级芯片封装结构 Wafer-level chip package structure |
| 01/21/2015 | CN104299949A 晶圆级芯片封装结构 Wafer-level chip package structure |
| 01/21/2015 | CN104299948A 具有芯片贴装焊盘的腔体封装 Cavity package with die attach pad |
| 01/21/2015 | CN104299947A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/21/2015 | CN104299946A 盖体部、采用该盖体部的电子器件用封装以及电子器件 Lid portion, the use of the lid portion of the electronic device and an electronic device with a sealing |
| 01/21/2015 | CN104299945A 固态成像设备及其制造方法 The solid-state imaging device and manufacturing method thereof |
| 01/21/2015 | CN104299942A 过孔制作方法、阵列基板制作方法及阵列基板、显示装置 Vias production methods, production methods and array substrate array substrate, a display device |