| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/06/2013 | EP2565919A1 Heat sink |
| 03/06/2013 | EP2565918A1 Power module and method for manufacturing power module |
| 03/06/2013 | EP2565913A2 Method for encapsulating semiconductor and structure thereof |
| 03/06/2013 | EP2565912A2 Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits |
| 03/06/2013 | EP2565635A1 Sensor chip and method for manufacturing a sensor chip |
| 03/06/2013 | EP2564417A2 Hermetic wafer-to-wafer bonding with electrical interconnection |
| 03/06/2013 | CN202772133U Structure for improving performance of passive devices of power integrated circuit |
| 03/06/2013 | CN202772132U Multi-chip stacked flat packaging part based on stamping frame |
| 03/06/2013 | CN202772131U Single chip flat packaging part based on square groove |
| 03/06/2013 | CN202772130U Packaging piece for single-chip packaging based on AAQFN |
| 03/06/2013 | CN202772129U Semiconductor device system-level packaging structure and packaging module thereof |
| 03/06/2013 | CN202772128U IGBT water-cooled heat dissipation device |
| 03/06/2013 | CN202772127U Straight-through type radiator for high-power thyristor |
| 03/06/2013 | CN202772126U Heat radiation structure for chip of flat machine PCB |
| 03/06/2013 | CN202772125U Plastic packaging member with built-in radiating fin |
| 03/06/2013 | CN202772124U Sheet structure type radiator |
| 03/06/2013 | CN202772123U Transistor heat-dissipation structure |
| 03/06/2013 | CN202772122U Heat dissipation device installation structure |
| 03/06/2013 | CN202772121U Semiconductor package |
| 03/06/2013 | CN202772120U Power module installation structure adopting upper and lower guide slots |
| 03/06/2013 | CN102959708A Electronic devices with yielding substrates |
| 03/06/2013 | CN102959702A Cooling apparatus for electronic components and method for manufacturing same |
| 03/06/2013 | CN102959701A A heat sink and a method of making a cooled device with a heat sink |
| 03/06/2013 | CN102959700A Electrical connector between die pad and z-interconnect for stacked die assemblies |
| 03/06/2013 | CN102959699A Circuit board and method for manufacturing same |
| 03/06/2013 | CN102959686A 氮化物半导体装置 The nitride semiconductor device |
| 03/06/2013 | CN102959015A Curable organopolysiloxane composition and optical semiconductor device |
| 03/06/2013 | CN102959006A Epoxy resin composition and semiconductor device |
| 03/06/2013 | CN102958860A Lead-free glass for sealing semiconductor |
| 03/06/2013 | CN102958318A Fixing structure of radiating element |
| 03/06/2013 | CN102957418A Low power/high speed tsv interface design |
| 03/06/2013 | CN102956712A Display, method of manufacturing the same and electric apparatus |
| 03/06/2013 | CN102956634A 集成电路芯片 IC chip |
| 03/06/2013 | CN102956629A Back-to-back stacked dies |
| 03/06/2013 | CN102956623A Controlling device performance by forming a stressed backside dielectric layer |
| 03/06/2013 | CN102956622A Inductor structure |
| 03/06/2013 | CN102956621A Photographic device and camera module |
| 03/06/2013 | CN102956620A Testing structure and characterization method for junction capacitance of MOS (metal oxide semiconductor) transistor |
| 03/06/2013 | CN102956619A Semiconductor device |
| 03/06/2013 | CN102956618A Integrated circuits with leakage current test structure |
| 03/06/2013 | CN102956617A Method for manufacturing zero-layer photoetching alignment marks |
| 03/06/2013 | CN102956616A Semiconductor chip, packages, and method of fabricating semiconductor chip and packages |
| 03/06/2013 | CN102956615A Installing substrate and circuit device using same |
| 03/06/2013 | CN102956614A Semiconductor device and method of manufacturing same |
| 03/06/2013 | CN102956613A Bond pad configurations for controlling semiconductor chip package interactions |
| 03/06/2013 | CN102956612A Electric fuse structure |
| 03/06/2013 | CN102956611A Air gap/graphene interconnection structure and preparation method thereof |
| 03/06/2013 | CN102956610A Semiconductor arrangement |
| 03/06/2013 | CN102956609A Structure and method for bump to landing trace ratio |
| 03/06/2013 | CN102956608A Vertically oriented semiconductor device and shielding structure thereof |
| 03/06/2013 | CN102956607A Vertically oriented semiconductor device and shielding structure thereof |
| 03/06/2013 | CN102956606A Vertically oriented semiconductor device and shielding structure thereof |
| 03/06/2013 | CN102956605A Semiconductor component and manufacturing method thereof |
| 03/06/2013 | CN102956604A Thin nickel-palladium-gold layer, packaging structure thereof with leads, and making method thereof |
| 03/06/2013 | CN102956603A Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus |
| 03/06/2013 | CN102956602A Bond pad structure to reduce bond pad corrosion |
| 03/06/2013 | CN102956601A Base plate structure with elastic lugs and manufacturing method of base plate structure |
| 03/06/2013 | CN102956600A Lead frame structure |
| 03/06/2013 | CN102956599A Lead frame structure |
| 03/06/2013 | CN102956598A Welding frame structure for side pins |
| 03/06/2013 | CN102956597A Lead frame structure |
| 03/06/2013 | CN102956596A Lead frame structure |
| 03/06/2013 | CN102956595A Insertion and extraction band of lead frame structure |
| 03/06/2013 | CN102956594A Power overlay structure with leadframe connections |
| 03/06/2013 | CN102956593A Power electronics system with a switching device and a control device |
| 03/06/2013 | CN102956592A Chip packaging piece and chip packaging method |
| 03/06/2013 | CN102956591A Semiconductor device and method for manufacturing the same |
| 03/06/2013 | CN102956590A Dummy flip chip bumps for reducing stress |
| 03/06/2013 | CN102956589A Semiconductor packaging structure and method of fabricating same |
| 03/06/2013 | CN102956588A Semiconductor device having through-substrate via |
| 03/06/2013 | CN102956587A Semiconductor package, package stack structure and upper package thereof |
| 03/06/2013 | CN102956586A High performance liquid cooled heatsink for igbt modules |
| 03/06/2013 | CN102956585A Semiconductor package member and fabrication method thereof |
| 03/06/2013 | CN102956584A Semiconductor device |
| 03/06/2013 | CN102956583A Temperature equalization plate structure and manufacturing method thereof |
| 03/06/2013 | CN102956582A Radiating device |
| 03/06/2013 | CN102956581A Buckle and electronic device using same |
| 03/06/2013 | CN102956580A Fixing structure of radiating unit |
| 03/06/2013 | CN102956579A Fixing structure of radiating device |
| 03/06/2013 | CN102956578A Resin-diamagnetic material composite structure, method for producing the same, and semiconductor device using the same |
| 03/06/2013 | CN102956577A Electronic element with insulating radiating substrate |
| 03/06/2013 | CN102956576A Heat radiation device and manufacturing method thereof |
| 03/06/2013 | CN102956575A Package structure and manufacture method thereof |
| 03/06/2013 | CN102956574A Small-substrate memory card package structure |
| 03/06/2013 | CN102956573A Triode with firm structure |
| 03/06/2013 | CN102956572A Novel package of electronic device |
| 03/06/2013 | CN102956571A Power semiconductor arrangement, power semiconductor module comprising a plurality of power semiconductor arrangements and module assembly comprising a plurality of the modules |
| 03/06/2013 | CN102956570A Power semiconducter module and semiconducter module assembly with multiple power semiconducter modules |
| 03/06/2013 | CN102956569A Semiconductor device and method of manufacture thereof |
| 03/06/2013 | CN102956568A Fixed curvature force loading of mechanically spalled films |
| 03/06/2013 | CN102956567A Crack stop structure and method for forming the same |
| 03/06/2013 | CN102956564A Non-volatile memory device and method for fabricating the same |
| 03/06/2013 | CN102956547A Semiconductor package structure and manufacturing method thereof |
| 03/06/2013 | CN102956546A Copper interconnection structure and forming method thereof |
| 03/06/2013 | CN102956539A Copper interconnection structure and manufacturing method thereof |
| 03/06/2013 | CN102956514A Method for manufacturing semiconductor device and semiconductor device |
| 03/06/2013 | CN102956511A Semiconductor package structure and manufacturing method thereof |
| 03/06/2013 | CN102956509A Power device and method for packaging same |
| 03/06/2013 | CN102956506A Heat radiation fin having rough surface and manufacturing method thereof |
| 03/06/2013 | CN102956477A Method for optimizing photoetching registration accuracy of emitting electrode of silicon germanium HBT (heterojunction bipolar transistor) |