| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/06/2013 | CN102956440A Capacitor and method for making same |
| 03/06/2013 | CN102956437A Capacitor and method for manufacturing capacitor on semiconductor device with metal grid electrode |
| 03/06/2013 | CN102955972A GSM (global system for mobile communications) mobile phone communication card and package method and device therefor |
| 03/06/2013 | CN102954903A Preparation method of germanium-silicon film monitoring sheet, and monitoring method through adopting sheet |
| 03/06/2013 | CN102954337A Cross-sectional shape of strip plate for machining sheet metal strip having U-shaped cross section |
| 03/06/2013 | CN102952511A Epoxy encapsulation and lamination adhesive and method of making same |
| 03/06/2013 | CN102952502A Adhesive composition for semiconductors, adhesive film, and semiconductor device |
| 03/06/2013 | CN102324415B Sequentially etched and plated lead frame structure without island prepacked plastic sealed material and producing method thereof |
| 03/06/2013 | CN102324413B Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| 03/06/2013 | CN102324412B Island-free lead frame structure prefilled with plastic encapsulating material, plated firstly and etched later and production method thereof |
| 03/06/2013 | CN102290117B Low temperature-sintered nano silver paste and preparation method thereof |
| 03/06/2013 | CN102231370B High power fin cold plate radiator and manufacturing method thereof |
| 03/06/2013 | CN102208390B High-density bump substrate and manufacturing method thereof |
| 03/06/2013 | CN102208381B Circulation cooling pipeline of three-level power module of integrated gate commutated thyristor (IGCT) |
| 03/06/2013 | CN102088015B Semiconductor packaging piece and manufacture method thereof |
| 03/06/2013 | CN102064118B Method and packaging mould for manufacturing semiconductor packaging piece |
| 03/06/2013 | CN102057484B Semiconductor device mounting substrate |
| 03/06/2013 | CN102054833B 薄膜晶体管基板及其制造方法 The thin film transistor substrate and a method of manufacturing |
| 03/06/2013 | CN102051147B Single-component environmentally-friendly organic silicon-acrylate electronic glue and application thereof |
| 03/06/2013 | CN102050950B Isocyanuric ring-containing polysiloxane having vinyl groups at the terminals |
| 03/06/2013 | CN101996979B Interposer, module and electronic device including the same |
| 03/06/2013 | CN101996929B Forming method of dual-damascene structure and semiconductor structure |
| 03/06/2013 | CN101982876B Semiconductor packaging part and manufacturing method thereof |
| 03/06/2013 | CN101965617B Conductive material, conductive paste, circuit board, and semiconductor device |
| 03/06/2013 | CN101958313B 半导体模块 Semiconductor Modules |
| 03/06/2013 | CN101796619B Circuit board and display device |
| 03/06/2013 | CN101779527B Split wave compensation for open stubs |
| 03/06/2013 | CN101754655B Radiating die set |
| 03/06/2013 | CN101728820B Circuit and method for power clamp triggered dual scr ESD protection |
| 03/06/2013 | CN101728343B TCP-type semiconductor device and method of testing thereof |
| 03/06/2013 | CN101668383B Circuit board and circuit board package structure |
| 03/06/2013 | CN101516922B Benzoxazine-containing formulations polymerizable/curable at low temperature |
| 03/06/2013 | CN101488493B Package for electronic component and method for manufacturing the same |
| 03/06/2013 | CN101399252B Semiconductor device and layout method thereof |
| 03/06/2013 | CN101266954B Semiconductor device and manufacturing method thereof |
| 03/06/2013 | CN101252133B Semiconductor device and method for manufacturing the same |
| 03/05/2013 | US8391945 Analyte monitoring device and methods of use |
| 03/05/2013 | US8391065 Semiconductor memory device reducing resistance fluctuation of data transfer line |
| 03/05/2013 | US8391017 Thin-film capacitor structures embedded in semiconductor packages and methods of making |
| 03/05/2013 | US8391016 Carbon nanotube-reinforced solder caps, and chip packages and systems containing same |
| 03/05/2013 | US8391006 Water jacket for cooling an electronic device on a board |
| 03/05/2013 | US8390999 Cooling a computing device |
| 03/05/2013 | US8390135 Semiconductor device |
| 03/05/2013 | US8390134 Semiconductor device having surface protective films on bond pad |
| 03/05/2013 | US8390133 Semiconductor device and manufacturing method thereof |
| 03/05/2013 | US8390132 Chip card, and method for the production thereof |
| 03/05/2013 | US8390131 Semiconductor device with reduced contact resistance |
| 03/05/2013 | US8390130 Through via recessed reveal structure and method |
| 03/05/2013 | US8390129 Semiconductor device with a plurality of mark through substrate vias |
| 03/05/2013 | US8390128 Semiconductor package and stack semiconductor package having the same |
| 03/05/2013 | US8390127 Contact trenches for enhancing stress transfer in closely spaced transistors |
| 03/05/2013 | US8390126 Method and arrangement for reduced thermal stress between substrates |
| 03/05/2013 | US8390125 Through-silicon via formed with a post passivation interconnect structure |
| 03/05/2013 | US8390124 Semiconductor device and method of manufacturing semiconductor device including wiring via and switch via for connecting first and second wirings |
| 03/05/2013 | US8390123 ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer |
| 03/05/2013 | US8390122 Sputtering targets including excess cadmium for forming a cadmium stannate layer |
| 03/05/2013 | US8390121 Semiconductor device and method of manufacture thereof |
| 03/05/2013 | US8390120 Semiconductor device and method of fabricating the same |
| 03/05/2013 | US8390119 Flip chip package utilizing trace bump trace interconnection |
| 03/05/2013 | US8390118 Semiconductor package having electrical connecting structures and fabrication method thereof |
| 03/05/2013 | US8390117 Semiconductor device and method of manufacturing the same |
| 03/05/2013 | US8390116 Flip chip bump structure and fabrication method |
| 03/05/2013 | US8390115 Wiring board and semiconductor device using the wiring board |
| 03/05/2013 | US8390114 Semiconductor package |
| 03/05/2013 | US8390113 Thermoelectric conversion module |
| 03/05/2013 | US8390112 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing |
| 03/05/2013 | US8390111 Wafer bonding method |
| 03/05/2013 | US8390110 Integrated circuit packaging system with cavity and method of manufacture thereof |
| 03/05/2013 | US8390108 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof |
| 03/05/2013 | US8390107 Semiconductor device and methods of manufacturing semiconductor devices |
| 03/05/2013 | US8390106 Circuit board with built-in semiconductor chip and method of manufacturing the same |
| 03/05/2013 | US8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus |
| 03/05/2013 | US8390104 Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure |
| 03/05/2013 | US8390103 Apparatus for integrated circuit packaging |
| 03/05/2013 | US8390102 Optoisolator leadframe assembly |
| 03/05/2013 | US8390099 Interconnection substrate having first and second insulating films with an adhesion enhancing layer therebetween |
| 03/05/2013 | US8390092 Area-efficient high voltage bipolar-based ESD protection targeting narrow design windows |
| 03/05/2013 | US8390071 ESD protection with increased current capability |
| 03/05/2013 | US8390068 Electrostatic discharge protection device and method of fabricating same |
| 03/05/2013 | US8390035 Massively parallel interconnect fabric for complex semiconductor devices |
| 03/05/2013 | US8390034 Methods for isolating portions of a loop of pitch-multiplied material and related structures |
| 03/05/2013 | US8390003 Electronic element wafer module with reduced warping |
| 03/05/2013 | US8389874 Electric connection box |
| 03/05/2013 | US8389401 Contact elements of semiconductor devices formed on the basis of a partially applied activation layer |
| 03/05/2013 | US8389383 Patterned semiconductor bases, and patterning methods |
| 03/05/2013 | US8389370 Radiation-tolerant integrated circuit device and method for fabricating |
| 03/05/2013 | US8389337 Patch on interposer assembly and structures formed thereby |
| 03/05/2013 | US8389334 Foil-based method for packaging intergrated circuits |
| 03/05/2013 | US8389333 Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die |
| 03/05/2013 | US8389330 Integrated circuit package system with package stand-off and method of manufacture thereof |
| 03/05/2013 | US8389329 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 03/05/2013 | US8389306 Light emission device package and method of fabricating the same |
| 03/05/2013 | US8389119 Composite thermal interface material including aligned nanofiber with low melting temperature binder |
| 03/05/2013 | US8389099 Asymmetrical wafer configurations and method for creating the same |
| 03/05/2013 | US8389078 Three-dimensional effect printing method and electronic device treated using the method |
| 03/05/2013 | CA2551299C Heat exchanger |
| 02/28/2013 | WO2013028745A1 Packaging dram and soc in an ic package |
| 02/28/2013 | WO2013028194A1 Microelectronic package having a coaxial connector |
| 02/28/2013 | WO2013027826A1 Semiconductor device and semiconductor device manufacturing method |
| 02/28/2013 | WO2013027819A1 Semiconductor module |