Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2013
03/12/2013US8395243 Surface passivation by quantum exclusion using multiple layers
03/12/2013US8395241 Through silicon via guard ring
03/12/2013US8395232 Semiconductor device and method of manufacturing the same
03/12/2013US8395229 MEMS-based getter microdevice
03/12/2013US8395214 Floating body field-effect transistors, and methods of forming floating body field-effect transistors
03/12/2013US8395190 Three-dimensional semiconductor memory device
03/12/2013US8395061 Electrical junction box
03/12/2013US8395057 Substrate-penetrating electrical connections
03/12/2013US8394715 Method of fabricating coaxial through-silicon via
03/12/2013US8394680 Layout for semiconductor device and method of fabricating the semiconductor device
03/12/2013US8394678 Semiconductor chip stacked body and method of manufacturing the same
03/12/2013US8394676 Marking method for semiconductor device and semiconductor device provided with markings
03/12/2013US8394574 Metrology systems and methods for lithography processes
03/12/2013US8394194 Single crystal reo buffer on amorphous SiOx
03/12/2013CA2665361C Plastic surface mount large area power device
03/12/2013CA2563240C Tamper respondent covering
03/12/2013CA2519893C Electrical connections in substrates
03/11/2013DE202013100293U1 Intergral ausgebildete hocheffiziente mehrschichtige lichtemittierende Vorrichtung Intergral trained highly efficient multi-layer light-emitting device
03/07/2013WO2013033628A1 Testing through-silicon-vias
03/07/2013WO2013033601A2 Enhanced clad metal base plate
03/07/2013WO2013033124A1 Die-cut through-glass via and methods for forming same
03/07/2013WO2013032750A1 Method of manufacturing a heat transfer system for aircraft structures
03/07/2013WO2013032749A1 Heat transfer system for aircraft structures
03/07/2013WO2013032748A2 Thermal management system for an aircraft avionics bay
03/07/2013WO2013032726A2 Glass as a substrate material and a final package for mems and ic devices
03/07/2013WO2013032725A2 Glass as a substrate material and a final package for mems and ic devices
03/07/2013WO2013032664A2 Laminated heat sinks
03/07/2013WO2013032280A2 Substrate for chip packages and method of manufacturing substrate for chip packages
03/07/2013WO2013032277A2 Method of manufacturing substrate for chip packages and method of manufacturing chip package
03/07/2013WO2013032056A1 Radio integrated circuit package, method for manufacturing same, and device for testing a radio integrated circuit
03/07/2013WO2013031944A1 Piezoelectric device
03/07/2013WO2013031823A1 Active matrix substrate and liquid crystal display panel
03/07/2013WO2013031602A1 Circuit module and composite circuit module
03/07/2013WO2013031593A1 Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic parts
03/07/2013WO2013031554A1 Etching liquid composition and etching method
03/07/2013WO2013031147A1 Power conversion device
03/07/2013WO2013030968A1 Rectangular, aluminum-, gold-, palladium- or platinum-coated copper ribbon for semiconducter element
03/07/2013WO2013030624A1 Integrated circuit package
03/07/2013WO2013030001A1 Semiconductor component with a heat sink
03/07/2013WO2013029852A1 Method for bonding semiconductor components
03/07/2013WO2013029656A1 Method for permanently bonding wafers by a connecting layer by means of solid-state diffusion or phase transformation
03/07/2013WO2013029273A1 Methods for forming color images on memory devices and memory devices formed thereby
03/07/2013WO2013010038A3 Heat transfer system with integrated evaporator and condenser
03/07/2013WO2013003257A3 Secondary device integration into coreless microelectronic device packages
03/07/2013WO2012170339A3 Signal routing using through-substrate vias
03/07/2013WO2012168902A3 Method to trace conductive tracks
03/07/2013WO2012143784A3 Semiconductor device and manufacturing method thereof
03/07/2013WO2012135406A9 High density microelectronics packaging
03/07/2013WO2012116271A3 High pin count no-lead ic packages with heat-dissipating pad
03/07/2013US20130057784 Electronic device, display device, and television receiver
03/07/2013US20130057312 SYSTEM AND METHOD FOR ELECTRICAL TESTING OF THROUGH SILICON VIAS (TSVs)
03/07/2013US20130056886 Method and Apparatus of Providing Overlay
03/07/2013US20130056885 Encapsulated semiconductor device and method for manufacturing the same
03/07/2013US20130056884 Semiconductor device and method of manufacturing the same
03/07/2013US20130056883 Semiconductor device and method of manufacturing the same
03/07/2013US20130056882 Semiconductor package having support member
03/07/2013US20130056880 System in package and method of fabricating same
03/07/2013US20130056879 Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
03/07/2013US20130056878 Semiconductor device and method for fabricating the same
03/07/2013US20130056877 Chip-housing module and a method for forming a chip-housing module
03/07/2013US20130056875 Semiconductor device and method for manufacturing the same
03/07/2013US20130056874 Protection of intermetal dielectric layers in multilevel wiring structures
03/07/2013US20130056873 Semiconductor device
03/07/2013US20130056872 Packaging and Function Tests for Package-on-Package and System-in-Package Structures
03/07/2013US20130056871 Thermally Enhanced Structure for Multi-Chip Device
03/07/2013US20130056870 Flip-chip, face-up and face-down wirebond combination package
03/07/2013US20130056869 Pillar structure having a non-planar surface for semiconductor devices
03/07/2013US20130056868 Routing under bond pad for the replacement of an interconnect layer
03/07/2013US20130056867 Semiconductor device and method of forming FO-WLCSP with recessed interconnect area in peripheralregion of semiconductor die
03/07/2013US20130056866 Stacked wafer-level package device
03/07/2013US20130056865 Method of Three Dimensional Integrated Circuit Assembly
03/07/2013US20130056864 Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
03/07/2013US20130056863 Integrated circuit packaging system with stiffener and method of manufacture thereof
03/07/2013US20130056862 Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure
03/07/2013US20130056861 Semiconductor devices and methods of assembling same
03/07/2013US20130056860 Resin-encapsulated semiconductor device
03/07/2013US20130056859 Semiconductor device having grooves on a side surface and method of manufacturing the same
03/07/2013US20130056857 Device chip and manufacturing method therefor
03/07/2013US20130056848 Inductive loop formed by through silicon via interconnection
03/07/2013US20130056846 Semiconductor device and method of manufacturing semiconductor device
03/07/2013US20130056803 Semiconductor device
03/07/2013US20130056791 Semiconductor device
03/07/2013US20130056261 Lead frame strip with improved package separability
03/07/2013DE202013001294U1 Kühlmodul Cooling module
03/07/2013DE112010005547T5 Halbleiterbauelement Semiconductor device
03/07/2013DE112010002692T5 Stapelchip-Pakete in elner Paket-auf-Paket-Vorrichtung, Verfahren zu ihrem Zusammensetzen,und Systeme, die sie enthalten. Stacked die packages in Elner package on package device, method for its assembly, and systems that contain them.
03/07/2013DE102012215438A1 System mit einem High-Power-Chip und einem Low-Power-Chip, das niedrige Verbindungsparasitäten aufweist Having system with a high-power chip and a low-power chip, low Verbindungsparasitäten
03/07/2013DE102012215272A1 Temperaturauswerteschaltung Temperature evaluation
03/07/2013DE102012215052A1 Elastische Montage von Leistungsmodulen Elastic mounting of power modules
03/07/2013DE102012212611A1 Halbleiterpackung und Verfahren zur Herstellung derselben Semiconductor package and method for manufacturing the same
03/07/2013DE102012108075A1 Chip-aufnehmendes Modul und Verfahren zum Ausbilden eines Chip-aufnehmenden Moduls Chip receiving module and method for forming a chip receiving module
03/07/2013DE102011112659A1 Oberflächenmontierbares elektronisches Bauelement Surface mount electronic component
03/07/2013DE102011112476A1 Bauelement und Verfahren zum Herstellen eines Bauelements Device and method for manufacturing a device
03/07/2013DE102011081964A1 Verfahren zum Bonden von Halbleiterbauelementen A method for bonding semiconductor components,
03/07/2013DE102008031309B4 Halbleiterbauteil und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
03/07/2013DE102007005234B4 Leistungselektronisches Modul mit einer Keramikumhüllung Power electronic module with a ceramic sheath
03/07/2013DE102005034873B4 Anordnung eines elektrischen Bauelements und eines auf dem Bauelement auflaminierten Folienverbunds und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component and a laminated composite film on the component and method of manufacturing the arrangement
03/07/2013DE102004032928B4 RF-Modul mit verbesserter Integration RF module with improved integration
03/06/2013EP2565926A1 Backside illuminated image sensor
03/06/2013EP2565920A1 Heat dissipation device and semiconductor device
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