Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2013
03/13/2013CN102969314A Semiconductor device and method of manufacturing the same
03/13/2013CN102969313A Semiconductor device and method of manufacturing the same
03/13/2013CN102969309A 半导体封装 The semiconductor package
03/13/2013CN102969306A Power module and manufacturing method thereof
03/13/2013CN102969304A Three-dimension integrated miniature transformer
03/13/2013CN102969303A Semiconductor packaging structure and production method thereof
03/13/2013CN102969302A Electron beam aligning mark based on hafnium oxide and manufacturing method of mark
03/13/2013CN102969301A Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods
03/13/2013CN102969300A Alignment precision detection pattern and usage method thereof
03/13/2013CN102969299A Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof
03/13/2013CN102969298A Method of processing at least one die and die arrangement
03/13/2013CN102969297A Pouring basin type lead frame structure
03/13/2013CN102969296A Lead frame structure
03/13/2013CN102969295A Lead frame structure
03/13/2013CN102969294A Method for saving consumable material of lead frame structure
03/13/2013CN102969293A Common-anode small-power silicon-controlled module and manufacturing process thereof
03/13/2013CN102969292A Integrated power module
03/13/2013CN102969291A Quad flat no-lead (QFN) device and lead frame thereof
03/13/2013CN102969290A 封装结构 Package structure
03/13/2013CN102969289A Semiconductor device and method for manufacturing the same
03/13/2013CN102969288A Semiconductor device with buried electrode
03/13/2013CN102969287A Radiator
03/13/2013CN102969286A Semiconductor chip packaging structure and method
03/13/2013CN102969285A Semiconductor device and method of manufacturing the same
03/13/2013CN102969284A Chip-housing module and a method for forming a chip-housing module
03/13/2013CN102969283A Elastic mounting of power modules
03/13/2013CN102969276A Semiconductor device and manufacturing method thereof
03/13/2013CN102969272A Semiconductor device and production method thereof
03/13/2013CN102969270A Semiconductor device and production method thereof
03/13/2013CN102969269A Semiconductor device and production method thereof
03/13/2013CN102969252A Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
03/13/2013CN102969251A Component substrate and manufacture method thereof
03/13/2013CN102969228A Polycrystalline silicon resistor structure and manufacturing method thereof
03/13/2013CN102967813A Testing structure and testing method
03/13/2013CN102964837A Composition of transparent film, and method of forming transparent film and transparent film
03/13/2013CN102148214B Methods for double-pattern-compliant standard cell design
03/13/2013CN102130118B Spiral inductor structure and preparation method thereof
03/13/2013CN102130091B Composite through-hole interconnecting structure for integrated circuit chip
03/13/2013CN102130085B Semiconductor package with electrical connection structure and manufacturing method thereof
03/13/2013CN102130078B Heat-conducting insulated composite film and chip stacking structures
03/13/2013CN102130072B 承载板及其制法 Bearing plate Jiqizhifa
03/13/2013CN102105983B 半导体装置 Semiconductor device
03/13/2013CN102065639B Capacitor loading structure with integrity-improved system-level packaged signals
03/13/2013CN102054751B Dual-inlay structure and forming method thereof
03/13/2013CN102047416B Refrigeration apparatus
03/13/2013CN102044531B Apparatus and method for vertically-structured passive components
03/13/2013CN102044487B Tungsten dual-damascene process
03/13/2013CN102034821B Metal oxide half-field effect transistor layout structure and method
03/13/2013CN101971326B Electromagnetic shield formation for integrated circuit die package
03/13/2013CN101964332B Chip scale surface mounted semiconductor device package and process of manufacture
03/13/2013CN101930986B Semiconductor device, camera module and method of manufacturing semiconductor device
03/13/2013CN101911270B A heat sink and method of forming a heatsink using a wedge-lock system
03/13/2013CN101877356B Semiconductor device and method of manufacturing the same
03/13/2013CN101866896B Alpha shielding techniques and configurations
03/13/2013CN101847642B Pixel unit and array base plate
03/13/2013CN101840924B Semiconductor device and backside illumination solid-state imaging device
03/13/2013CN101802990B Semiconductor packaging process using through silicon vias
03/13/2013CN101785093B Semiconductor assemblies and methods of manufacturing such assemblies
03/13/2013CN101776941B Radiating device
03/13/2013CN101719494B Delay circuit
03/13/2013CN101714545B 半导体装置 Semiconductor device
03/13/2013CN101688051B Epoxy resin-forming liquid preparation containing inorganic particle
03/13/2013CN101627473B Methods of forming a single layer substrate for high capacity memory cards
03/13/2013CN101615598B Protection sealing ring used for preventing stress caused by cutting die
03/13/2013CN101593731B Liquid crystal display, active element array substrate and method for manufacturing active element array substrate
03/13/2013CN101582419B Device and system for mini surface-mount device
03/13/2013CN101562158B Heat removal system for high-power semiconductor device
03/13/2013CN101443906B Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
03/13/2013CN101373722B Semiconductor device and manufacturing method for the same
03/13/2013CN101356644B Electronic assembly with detachable components
03/13/2013CN101304012B Semiconductor substrate with metal contact layer and corresponding production method
03/13/2013CN101276792B Semicoductor epitaxy substrate, compound semiconductor device and manufacturing method thereof
03/12/2013US8395897 Electrical power component attached to chassis of an electrical power apparatus
03/12/2013US8395892 Air duct and computer system with the air duct
03/12/2013US8395889 Cooling unit and electronic device
03/12/2013US8395692 Solid-state imaging device, manufacturing method thereof, and electronic apparatus
03/12/2013US8395609 Organic light emitting display device and mother substrate for performing sheet unit test and testing method thereof
03/12/2013US8395268 Semiconductor memory device
03/12/2013US8395267 Through-substrate via and redistribution layer with metal paste
03/12/2013US8395266 Semiconductor memory device
03/12/2013US8395265 Metal silicide nanowires and methods of their production
03/12/2013US8395264 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
03/12/2013US8395263 Semiconductor light emitting device and method for manufacturing the same
03/12/2013US8395262 Semiconductor device and method for manufacturing the same
03/12/2013US8395261 Semiconductor device
03/12/2013US8395259 Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
03/12/2013US8395258 Semiconductor element, semiconductor device, and fabrication method thereof
03/12/2013US8395257 Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material
03/12/2013US8395256 Packaging for low-cost, high-performance microwave and millimeter wave modules
03/12/2013US8395255 Semiconductor device having a cooling function component
03/12/2013US8395254 Integrated circuit package system with heatspreader
03/12/2013US8395253 Hermetic surface mounted power package
03/12/2013US8395252 Integrated MEMS and CMOS package and method
03/12/2013US8395251 Integrated circuit package to package stacking system
03/12/2013US8395250 Plasma processing apparatus with an exhaust port above the substrate
03/12/2013US8395249 Sealed cavity
03/12/2013US8395248 Semiconductor device and manufacturing method therefor
03/12/2013US8395247 Method and apparatus for placing quartz SAW devices together with clock/oscillator
03/12/2013US8395246 Two-sided die in a four-sided leadframe based package
03/12/2013US8395245 Semiconductor package module
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