Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2013
03/14/2013US20130062771 Design method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device
03/14/2013US20130062770 Semiconductor structure and method for making same
03/14/2013US20130062769 Microstructure Modification in Copper Interconnect Structures
03/14/2013US20130062768 Method for the production of a substrate having a coating comprising copper, and coated substrate and device prepared by this method
03/14/2013US20130062767 Via structure and via etching process of forming the same
03/14/2013US20130062766 System and Method for 3D Integrated Circuit Stacking
03/14/2013US20130062765 Low loop wire bonding
03/14/2013US20130062764 Semiconductor package with improved pillar bump process and structure
03/14/2013US20130062763 De-pop on-device decoupling for bga
03/14/2013US20130062762 In-grid on-device decoupling for bga
03/14/2013US20130062761 Packaging Methods and Structures for Semiconductor Devices
03/14/2013US20130062760 Packaging Methods and Structures Using a Die Attach Film
03/14/2013US20130062759 Electronic device package
03/14/2013US20130062758 Semiconductor device
03/14/2013US20130062757 No Flow Underfill or Wafer Level Underfill and Solder Columns
03/14/2013US20130062756 Substrate structure with compliant bump and manufacturing method thereof
03/14/2013US20130062755 Elongated bump structure in semiconductor device
03/14/2013US20130062754 Wiring substrate and semiconductor package
03/14/2013US20130062753 C-rich carbon boron nitride dielectric films for use in electronic devices
03/14/2013US20130062752 Ring structure for chip packaging
03/14/2013US20130062751 Power Module and Power Module Manufacturing Method
03/14/2013US20130062750 Semiconductor device including cladded base plate
03/14/2013US20130062749 Semiconductor module
03/14/2013US20130062748 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
03/14/2013US20130062747 Semiconductor device and manufacturing method of the same
03/14/2013US20130062746 Soldering Relief Method and Semiconductor Device Employing Same
03/14/2013US20130062745 Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device
03/14/2013US20130062744 Power module package
03/14/2013US20130062743 Power module package and method for manufacturing the same
03/14/2013US20130062742 Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
03/14/2013US20130062741 Semiconductor Devices and Methods of Manufacturing and Packaging Thereof
03/14/2013US20130062740 Tunable radiation source
03/14/2013US20130062732 Interconnect structures with functional components and methods for fabrication
03/14/2013US20130062724 Power Module and Power Converter Containing Power Module
03/14/2013US20130062722 Chip module and a method for manufacturing a chip module
03/14/2013US20130062697 Semiconductor device
03/14/2013US20130062605 Semiconductor chip
03/14/2013US20130062604 Photodetector with Controllable Spectral Response
03/14/2013US20130062331 Method and apparatus for maintaining operational temperature of an integrated circuit
03/14/2013DE19615481C5 Gewölbtes Metall-Keramik-Substrat Corrugated metal-ceramic substrate
03/14/2013DE102012204159A1 Power semiconductor module for controlling electric machine in e.g. motor mode, has punching lattice provided with metal strips, where covers of lattice comprise connection between surfaces of electrode with terminal surfaces
03/14/2013DE102012200325A1 Halbleiteranordnung mit plattierter Basisplatte A semiconductor device comprising plated base plate
03/14/2013DE102012100793A1 Halbleitervorrichtung und Verfahren zum Herstellen und Montieren derselben A semiconductor device and method of manufacturing and mounting the same
03/14/2013DE102011113255A1 Chipmodul und ein Verfahren zur Herstellung eines Chipmoduls Chip module and a method for producing a chip module
03/14/2013DE102011054961A1 Stapelsubstratmodul Substrate stack module
03/14/2013DE102011053536A1 Semiconductor component i.e. integrated circuit, has metallization system whose capacitor structure comprises electrode structures, where two sets of metal line sections of electrode structures are aligned in respective lateral directions
03/14/2013DE102011053472A1 Electronics module for exterior door handle of vehicle i.e. motor car, has electronics unit surrounded with casting material, and prevention unit for preventing flotation of electronics unit within tub when introducing casting material
03/14/2013DE102008034468B4 Leistungshalbleitermodul The power semiconductor module
03/13/2013EP2568499A2 Semiconductor device including insulating resin film provided in a space between semiconductor chips
03/13/2013EP2568498A2 Bond pad support structure for semiconductor device
03/13/2013EP2568497A1 Temperature controlling device, cooling device, and method for manufacturing temperature controlling device
03/13/2013EP2568496A2 Method and apparatus for maintaining operational temperature of an integrated circuit
03/13/2013EP2568268A1 Method for estimating the temperature of a semiconductor chip
03/13/2013EP2567401A1 Process for minimizing chipping when separating mems dies on a wafer
03/13/2013EP2567400A2 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps
03/13/2013EP2567105A2 Pick and bond method and apparatus for transferring adhesive element to substrate
03/13/2013EP2567104A2 Pick and bond method for attachment of adhesive element to substrate
03/13/2013EP2567103A2 Method and apparatus for placing adhesive element on a matrix
03/13/2013EP2566908A2 Potting for electronic components
03/13/2013CN202798009U Low voltage ride through thyristor high-speed switch valve group
03/13/2013CN202797033U Photovoltaic counter current protector
03/13/2013CN202796935U Double-iron-electrode rectification chip
03/13/2013CN202796933U Multi-row matrix type discrete device lead frame
03/13/2013CN202796932U Lead frame
03/13/2013CN202796931U Device structure of power metal-oxide-semiconductor field effect transistor (MOSFET)
03/13/2013CN202796930U Packaging body for metal-oxide-semiconductor field effect transistor (MOSFET) chip
03/13/2013CN202796929U Paster type lead frame
03/13/2013CN202796928U Copper-iron-phosphorous alloy profile for lead frame
03/13/2013CN202796927U Paper lead framework
03/13/2013CN202796926U Half cut bottom rib lead frame
03/13/2013CN202796925U Double-row lead frame
03/13/2013CN202796924U 半导体装置 Semiconductor device
03/13/2013CN202796923U TO3PB lead frame
03/13/2013CN202796922U Pin structure of double-pole electronic element
03/13/2013CN202796921U Power module electrode terminal
03/13/2013CN202796920U Multi-chip quad flat no-lead (QFN) packaging structure
03/13/2013CN202796919U Non-pin metal-oxide semiconductor field effect transistor (MOSFET) packaging structure
03/13/2013CN202796918U Square flat no-pin metal oxide semiconductor (MOS) packaging structure
03/13/2013CN202796917U Non-pin power metal-oxide semiconductor field effect transistor (MOSFET) device
03/13/2013CN202796916U Plastic packaging non-insulation power semiconductor module
03/13/2013CN202796915U Heat radiating assembly
03/13/2013CN202796914U Assembling component for series connection of thyristors
03/13/2013CN202796913U Large radiating fin semiconductor power discrete device
03/13/2013CN202796912U Radiator
03/13/2013CN202796911U Heat dissipation module
03/13/2013CN202796910U Power electronic system with cooling device
03/13/2013CN202796909U Chip packaging structure capable of positioning cooling fin
03/13/2013CN202796908U External connection type silicon controlled rectifier module
03/13/2013CN202796907U Metal oxide semiconductor (MOS) tube module with radiating and isolating functions
03/13/2013CN202796906U Substrate
03/13/2013CN202796905U Double-face bonding structure of power electronic device
03/13/2013CN102971847A Electrical connector
03/13/2013CN102971846A Enhanced thermal management of 3-D stacked die packaging
03/13/2013CN102971845A Substrate for mounting semiconductor element and method for manufacturing the substrate
03/13/2013CN102971838A Interposer and method for producing holes in an interposer
03/13/2013CN102971365A Thermally conductive sheet and process for producing same
03/13/2013CN102971354A Potting for electronic components
03/13/2013CN102969361A Illumination stability amorphous metallic oxide thin film transistor (TFT) device and display device
03/13/2013CN102969344A Semiconductor device
03/13/2013CN102969336A Semiconductor wafer and laminate structure including the same
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