| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/20/2013 | CN202816920U TO-252 packaging lead framework structure |
| 03/20/2013 | CN202816919U SOT223-3L packaging lead framework |
| 03/20/2013 | CN202816918U Surface contact type switch element chip |
| 03/20/2013 | CN202816917U Multi-chip semiconductor device |
| 03/20/2013 | CN202816916U Inversion packaging device |
| 03/20/2013 | CN202816915U Improved transistor |
| 03/20/2013 | CN202816914U Dual-chip glass sealed diode |
| 03/20/2013 | CN202816913U Microchannel liquid-cooled heat sink device |
| 03/20/2013 | CN202816912U Diode anode heat radiation structure |
| 03/20/2013 | CN202816911U Cold plate capable of locally enhancing heat exchange |
| 03/20/2013 | CN202816910U Radiator for large-power semiconductor device |
| 03/20/2013 | CN202816909U Heat dissipation device for chip of variable frequency air conditioner |
| 03/20/2013 | CN202816908U A heat dissipation device |
| 03/20/2013 | CN202816907U Semiconductor chip |
| 03/20/2013 | CN202816906U Heat dissipation structure of integrated circuit ceramic package |
| 03/20/2013 | CN202816905U A novel heat dissipation device for an electrodeless lamp ballast MOS tube |
| 03/20/2013 | CN202816904U Encapsulation structure of naked-die device |
| 03/20/2013 | CN202816903U Resin-encapsulated semiconductor device |
| 03/20/2013 | CN202816902U Integrated photosensitive sensor chip |
| 03/20/2013 | CN202816901U Chip packaged DIP8 double-base island pressure plate fixture |
| 03/20/2013 | CN202816880U A high vacuum press seal machine |
| 03/20/2013 | CN202815893U Intelligent card and intelligent-card contact pad supporting plate |
| 03/20/2013 | CN102986026A Power module and power converter using same |
| 03/20/2013 | CN102986025A Encapsulated semiconductor device and method for producing same |
| 03/20/2013 | CN102986024A Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both |
| 03/20/2013 | CN102986014A A method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology |
| 03/20/2013 | CN102986013A Hermetic wafer-to-wafer bonding with electrical interconnection |
| 03/20/2013 | CN102985781A 热量和能量交换 Heat and energy exchange |
| 03/20/2013 | CN102985510A Fully-cured thermally or electrically-conductive form-in-place gap filler |
| 03/20/2013 | CN102985486A 树脂组合物 Resin composition |
| 03/20/2013 | CN102985460A Curing agent composition for epoxy resin, curable resin composition, and cured product thereof |
| 03/20/2013 | CN102985458A Method for producing cured product and cured product |
| 03/20/2013 | CN102984918A Heat sink |
| 03/20/2013 | CN102984889A Method used for assembling printed circuit board |
| 03/20/2013 | CN102983137A Semiconductor structure and method |
| 03/20/2013 | CN102983130A An electro-static discharge protection circuit for an integrated circuit and a manufacturing method thereof |
| 03/20/2013 | CN102983122A Stacked-type semiconductor package structure and manufacturing method thereof |
| 03/20/2013 | CN102983121A Production method and structure of three-dimensional inductance loader with metal core part |
| 03/20/2013 | CN102983120A Integrated circuit and sealing ring in integrated circuit |
| 03/20/2013 | CN102983119A Recessed type alignment mark used for electron beam alignment on SOI (Silicon On Insulator) and manufacturing method thereof |
| 03/20/2013 | CN102983118A Semiconductor device and method of manufacturing the same |
| 03/20/2013 | CN102983117A Horizontal interdigitated capacitor structure with vias |
| 03/20/2013 | CN102983116A Semiconductor substrate and integrated circuit provided with semiconductor substrate and manufacturing method of integrated circuit |
| 03/20/2013 | CN102983115A Intelligent card packaging framework |
| 03/20/2013 | CN102983114A High performance power transistor having ultra-thin package |
| 03/20/2013 | CN102983113A Package systems including passive electrical components |
| 03/20/2013 | CN102983112A Stacked wafer-level package device |
| 03/20/2013 | CN102983111A Stepped package for image sensor and method of making same |
| 03/20/2013 | CN102983110A 散热装置 Cooling devices |
| 03/20/2013 | CN102983109A Thermally enhanced structure for multi-chip device |
| 03/20/2013 | CN102983108A Packaging structure and packaging technology |
| 03/20/2013 | CN102983107A Diode packaged by soft material ring and hard epoxy resin and fabrication method of diode |
| 03/20/2013 | CN102983100A Semiconductor device and method for fabricating the same |
| 03/20/2013 | CN102983083A Lead wire frame and production method thereof |
| 03/20/2013 | CN102982932A Voltage induction variable resistance film envelope capable of absorbing instant electric pulse energy as well as manufacturing method and application of film |
| 03/20/2013 | CN102981326A Fan-out line |
| 03/20/2013 | CN102978485A Novel high-silicon aluminum alloy electronic packaging material and preparation method thereof |
| 03/20/2013 | CN102978432A Lead support used for semiconductor devices |
| 03/20/2013 | CN102978430A Method for manufacturing lead frame |
| 03/20/2013 | CN102978429A Copper alloy for manufacturing frame |
| 03/20/2013 | CN102977809A Circuit member connecting adhesive and semiconductor device |
| 03/20/2013 | CN102977798A Adhesive and connecting structure using the same |
| 03/20/2013 | CN102977281A Manufacturing method of electronic device packaging resin |
| 03/20/2013 | CN102977280A Electronic device packaging resin |
| 03/20/2013 | CN102364712B Synthetic jet heat radiating device |
| 03/20/2013 | CN102244076B Electrostatic discharge protective device for radio frequency integrated circuit |
| 03/20/2013 | CN102208403B Half-bridge power module |
| 03/20/2013 | CN102176433B Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 03/20/2013 | CN102148192B Method for growing blocking layer and seed layer on surface of silicon through hole |
| 03/20/2013 | CN102104011B Electronic element packager and manufacturing method thereof |
| 03/20/2013 | CN102097335B Packaging structure and packaging process thereof |
| 03/20/2013 | CN102065632B Electromagnetic bandgap structure and printed circuit board comprising the same |
| 03/20/2013 | CN102024784B Block contact plugs for mos devices |
| 03/20/2013 | CN102024772B Heat-dissipating substrate and fabricating method thereof |
| 03/20/2013 | CN101964312B Manufacturing method of a resin seal type electronic component and the resin seal type electronic component |
| 03/20/2013 | CN101937885B Semiconductor packaging piece and manufacture method thereof |
| 03/20/2013 | CN101925996B Method for reversibly mounting device wafer to carrier substrate |
| 03/20/2013 | CN101866887B Heat radiator |
| 03/20/2013 | CN101789417B Through-silicon via sidewall isolation structure |
| 03/20/2013 | CN101742819B Circuit board compobination |
| 03/20/2013 | CN101615606B Chip bonding pad of integrated circuit, manufacture method thereof and integrated circuit comprising bonding pad |
| 03/20/2013 | CN101599491B Esd保护电路和半导体器件 Esd protection circuits and semiconductor devices |
| 03/20/2013 | CN101594765B Heat radiating device and fixing structure thereof |
| 03/20/2013 | CN101576238B Method and equipment for welding LED lamp bead |
| 03/20/2013 | CN101533801B Optical device manufacturing method |
| 03/20/2013 | CN101499480B 半导体芯片及半导体装置 The semiconductor chip and semiconductor device |
| 03/20/2013 | CN101473059B Cu-Mn alloy sputtering target and semiconductor wiring |
| 03/20/2013 | CN101399254B 半导体装置 Semiconductor device |
| 03/20/2013 | CN101364579B Semiconductor package, method of manufacturing the same and system containing the package |
| 03/20/2013 | CN101345240B Contact structure of MOS transistor, adjacent contact structure and semiconductor SRAM unit |
| 03/20/2013 | CN101339933B Semiconductor device and method for manufacturing semiconductor device |
| 03/20/2013 | CN101312179B 半导体器件 Semiconductor devices |
| 03/20/2013 | CN101246890B Semiconductor device and method of manufacturing the same |
| 03/20/2013 | CN101160033B Heat transfer composite, associated device and method |
| 03/19/2013 | US8402406 Controlling plating stub reflections in a chip package |
| 03/19/2013 | US8401600 Superconducting multi-bit digital mixer |
| 03/19/2013 | US8400780 Stacked microfeature devices |
| 03/19/2013 | US8400779 Semiconductor package having multi pitch ball land |
| 03/19/2013 | US8400774 Packaging techniques and configurations |
| 03/19/2013 | US8400634 Semiconductor wafer alignment markers, and associated systems and methods |