| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/27/2013 | CN101687980B Heat curable resin compositon |
| 03/27/2013 | CN101687896B Cobalt nitride layers for copper interconnects and methods for forming them |
| 03/27/2013 | CN101686625B Air exhaust device |
| 03/27/2013 | CN101646489B A method for the sorption of gaseous contaminants by means of nanostructured sorbers in the form of a fiber |
| 03/27/2013 | CN101626001B Semiconductor device and method of manufacturing the same |
| 03/27/2013 | CN101615378B El display panel, electronic instrument and panel driving method |
| 03/27/2013 | CN101580580B 热固化性组合物 Heat-curable composition |
| 03/27/2013 | CN101521184B 半导体器件 Semiconductor devices |
| 03/27/2013 | CN101499486B Organic light emitting display and method for manufacturing the same |
| 03/27/2013 | CN101459153B 电子器件 Electronic devices |
| 03/27/2013 | CN101451265B Gaas single crystal substrate and epitaxial wafer using the same |
| 03/27/2013 | CN101436579B Semiconductor device and method for manufacturing the same |
| 03/27/2013 | CN101425520B Array substrate and display panel having the same |
| 03/27/2013 | CN101415760B Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
| 03/27/2013 | CN101409241B Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 03/27/2013 | CN101400241B Evaporation chamber for inner container type evaporative cooling device |
| 03/27/2013 | CN101388392B Semiconductor device having electrostatic discharge protection circuit and method of manufacturing the same |
| 03/27/2013 | CN101383339B 晶片 Wafers |
| 03/27/2013 | CN101304014B 半导体芯片及其制造方法 A semiconductor chip and its manufacturing method |
| 03/27/2013 | CN101232779B Printed circuit board and method for producing the printed circuit board |
| 03/27/2013 | CN101202258B Power semiconductor module with contact springs |
| 03/27/2013 | CN101138085B Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties |
| 03/26/2013 | US8406834 Injection locked Long Josephson Junction pulse source |
| 03/26/2013 | US8405992 Power-electronic arrangement |
| 03/26/2013 | US8405483 Fuse of semiconductor memory device |
| 03/26/2013 | US8405234 Thin film transistor array substrate and manufacturing method thereof |
| 03/26/2013 | US8405233 Flexible barrier film, method of forming same, and organic electronic device including same |
| 03/26/2013 | US8405232 Chip package structure |
| 03/26/2013 | US8405231 Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module |
| 03/26/2013 | US8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof |
| 03/26/2013 | US8405228 Integrated circuit packaging system with package underfill and method of manufacture thereof |
| 03/26/2013 | US8405227 Semiconductor device with a semiconductor chip connected in a flip chip manner |
| 03/26/2013 | US8405226 Semiconductor device and method of making semiconductor device |
| 03/26/2013 | US8405225 Three-dimensional integrated circuits with protection layers |
| 03/26/2013 | US8405224 Semiconductor device comprising multilayer interconnect structure with overlapping vias |
| 03/26/2013 | US8405223 Multi-layer via structure |
| 03/26/2013 | US8405221 Semiconductor device and multilayer semiconductor device |
| 03/26/2013 | US8405220 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types |
| 03/26/2013 | US8405219 Semiconductor device |
| 03/26/2013 | US8405218 Semiconductor device and method of patterning resin insulation layer on substrate of the same |
| 03/26/2013 | US8405217 Coating method and solutions for enhanced electromigration resistance |
| 03/26/2013 | US8405216 Interconnect structure for integrated circuits |
| 03/26/2013 | US8405215 Interconnect structure and method for Cu/ultra low k integration |
| 03/26/2013 | US8405214 Semiconductor package structure with common gold plated metal conductor on die and substrate |
| 03/26/2013 | US8405213 Semiconductor package including a stacking element |
| 03/26/2013 | US8405212 Semiconductor package |
| 03/26/2013 | US8405211 Bump pad structure |
| 03/26/2013 | US8405210 Method for producing a plurality of chips and a chip produced accordingly |
| 03/26/2013 | US8405209 Semiconductor device with varying bump density regions and method of manufacturing the same |
| 03/26/2013 | US8405208 Semiconductor device having semiconductor substrate electrode pads, and external electrodes |
| 03/26/2013 | US8405207 Stub minimization for wirebond assemblies without windows |
| 03/26/2013 | US8405206 Low-inductive semiconductor module |
| 03/26/2013 | US8405204 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure |
| 03/26/2013 | US8405203 Semiconductor package with integrated substrate thermal slug |
| 03/26/2013 | US8405202 MEMS packaging scheme using dielectric fence |
| 03/26/2013 | US8405201 Through-silicon via structure |
| 03/26/2013 | US8405200 Electronic-component-housing package and electronic device |
| 03/26/2013 | US8405199 Conductive pillar for semiconductor substrate and method of manufacture |
| 03/26/2013 | US8405198 Stress-engineered interconnect packages with activator-assisted molds |
| 03/26/2013 | US8405197 Integrated circuit packaging system with stacked configuration and method of manufacture thereof |
| 03/26/2013 | US8405195 Arrangement comprising at least one power semiconductor module and a transport packaging |
| 03/26/2013 | US8405194 Semiconductor device including two heat sinks and method of manufacturing the same |
| 03/26/2013 | US8405193 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
| 03/26/2013 | US8405192 Low dielectric constant material |
| 03/26/2013 | US8405190 Component having a silicon carbide coated via |
| 03/26/2013 | US8405178 Solid-state image sensor device |
| 03/26/2013 | US8405151 Protection circuit for semiconductor device |
| 03/26/2013 | US8405109 Low resistance electrode and compound semiconductor light emitting device including the same |
| 03/26/2013 | US8405081 Organic thin film transistor having peripheral metal structures |
| 03/26/2013 | US8405078 Test device and a semiconductor integrated circuit device |
| 03/26/2013 | US8404960 Method for heat dissipation on semiconductor device |
| 03/26/2013 | US8404586 Manufacturing method for semiconductor device |
| 03/26/2013 | US8404582 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps |
| 03/26/2013 | US8404523 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) |
| 03/26/2013 | US8404520 Package-on-package assembly with wire bond vias |
| 03/26/2013 | US8404518 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 03/26/2013 | US8404496 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state |
| 03/26/2013 | US8404314 Plasma CVD apparatus, method for forming thin film and semiconductor device |
| 03/26/2013 | US8403736 Rack enclosure |
| 03/25/2013 | DE202011109473U1 Solarmodul Solar module |
| 03/21/2013 | WO2013040418A2 High precision self aligning die for embedded die packaging |
| 03/21/2013 | WO2013039617A1 Spot plated leadframe and ic bond pad via array design for copper wire |
| 03/21/2013 | WO2013039258A1 Semiconductor device and printed circuit board |
| 03/21/2013 | WO2013039149A1 Electronic device |
| 03/21/2013 | WO2013039099A1 Method for producing semiconductor device, and semiconductor device produced using production method |
| 03/21/2013 | WO2013039081A1 Thermally conductive material |
| 03/21/2013 | WO2013039026A1 Work machine |
| 03/21/2013 | WO2013038952A1 Metal filling apparatus |
| 03/21/2013 | WO2013038749A1 Electrode terminal with wiring sheet, wiring structure body, semiconductor device, and method of manufacturing said semiconductor device |
| 03/21/2013 | WO2013038493A1 Semiconductor module |
| 03/21/2013 | WO2013038276A1 Phased-array transceiver |
| 03/21/2013 | WO2013037989A1 Circuitry arrangement for reducing a tendency towards oscillations |
| 03/21/2013 | WO2013037698A1 Circuit board and electrical components for use in an aggressive environment and method for producing such a circuit board |
| 03/21/2013 | WO2013037188A1 Pre-encapsulated islandless lead frame structures and manufacturing method |
| 03/21/2013 | WO2013037187A1 A pre-encapsulated lead frame structure with island and manufacturing method |
| 03/21/2013 | WO2013037186A1 Islandless pre-encapsulated plating-then-etching lead frame structures and manufacturing method |
| 03/21/2013 | WO2013037185A1 Pre-encapsulated plating-then-etching lead frame structure with island and manufacturing method |
| 03/21/2013 | WO2013037184A1 Islandless pre-encapsulated etching-then-plating lead frame structures and manufacturing method |
| 03/21/2013 | WO2013037183A1 Sequentially etched and plated lead frame structure with island prepacked molding compound and manufacturing method thereof |
| 03/21/2013 | WO2013037146A1 Cof encapsulation method and structure for lcd drive chip |