Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2013
03/27/2013CN103003940A System comprising a semiconductor device and structure
03/27/2013CN103003939A Method and structure to improve the conductivity of narrow copper filled vias
03/27/2013CN103003938A Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip
03/27/2013CN103003937A Silicon carbide substrate, semiconductor device, and SOI wafer
03/27/2013CN103003936A Wafer backside coating process with pulsed UV light source
03/27/2013CN103003935A Method for manufacturing functional component and functional component
03/27/2013CN103003860A Cu alloy film for display device, and display device
03/27/2013CN103003364A Curable organopolysiloxane composition and optical semiconductor device
03/27/2013CN103003357A Thermosetting epoxy resin composition and uses thereof
03/27/2013CN103002698A Motor drive apparatus
03/27/2013CN103002657A Stack-based substrate module
03/27/2013CN103000699A Thin high-power and low-forward surface-mounted packaging diode
03/27/2013CN103000696A Power diode device structure allowing for increasing of testing precision of forward characteristics
03/27/2013CN103000685A Semiconductor device, method for manufacturing the same, power supply apparatus and high-frequency amplification unit
03/27/2013CN103000637A Coated thin film transistor (TFT) substrate, preparation method thereof and TFT
03/27/2013CN103000619A System with a high power chip and a low power chip having low interconnect parasitics
03/27/2013CN103000618A Apparatus for stacked electronic circuitry and associated methods
03/27/2013CN103000617A Semiconductor package and manufacturing method for the same
03/27/2013CN103000616A Method for manufacturing photoetching alignment marks for thin metal layers
03/27/2013CN103000615A Tungsten/copper bolt structure and semi-conductor device comprising same
03/27/2013CN103000614A Semiconductor device components and methods
03/27/2013CN103000613A Composite semiconductor layer
03/27/2013CN103000612A Semiconductor device and method for manufacturing a semiconductor device
03/27/2013CN103000611A Bonding pad structure for semiconductor devices
03/27/2013CN103000610A Chip package structure
03/27/2013CN103000609A Salient point preparing material and salient point preparing method
03/27/2013CN103000608A Chip packaging structure of a plurality of assemblies
03/27/2013CN103000607A Integrated lead frame for multi-gang pot (MGP) mold
03/27/2013CN103000606A TO-252-3LB lead frame structure
03/27/2013CN103000605A SOT26-3LB package lead frame
03/27/2013CN103000604A Improved frame plating structure of three-terminal regulator
03/27/2013CN103000603A Transistor structure and related transistor packaging method thereof
03/27/2013CN103000602A Strain-compensating fill patterns for controlling semiconductor chip package interactions
03/27/2013CN103000601A 半导体芯片 Semiconductor chip
03/27/2013CN103000600A Semiconductor device
03/27/2013CN103000599A Flip-chip package structure and forming method thereof
03/27/2013CN103000598A Elongated bump structure in semiconductor device
03/27/2013CN103000597A Semiconductor devices and methods of manufacturing and packaging thereof
03/27/2013CN103000596A Immersion cooling type semiconductor component
03/27/2013CN103000595A Multidirectional access phase change heat transfer device and manufacturing method thereof
03/27/2013CN103000594A 电子模块 Electronic Modules
03/27/2013CN103000593A Packaging methods and structures for semiconductor devices
03/27/2013CN103000592A 封装结构 Package
03/27/2013CN103000591A Ring structure for chip packaging
03/27/2013CN103000590A Power module without bottom plate
03/27/2013CN103000589A Semiconductor Device, Semiconductor Wafer And Manufacturing Method Of Semiconductor Device
03/27/2013CN103000588A Chip packaging structure and manufacturing method for the same
03/27/2013CN103000587A Manufacturing method for flexible display apparatus
03/27/2013CN103000586A Crack stop structure and method for forming the same
03/27/2013CN103000579A Semiconductor device and preparation method thereof
03/27/2013CN103000575A Copper interconnection structure and forming method thereof
03/27/2013CN103000574A Method of forming semiconductor die with active region responsive to external stimulus
03/27/2013CN103000573A Post-Polymer revealing of through-substrate via tips
03/27/2013CN103000572A Contact for high-K metal gate device
03/27/2013CN103000571A Semiconductor device and manufacturing method thereof
03/27/2013CN103000542A Solder cap bump in semiconductor package and method of manufacturing the same
03/27/2013CN103000539A Semiconductor packaging structure and manufacturing method thereof
03/27/2013CN103000538A Method for manufacturing semiconductor package structure
03/27/2013CN103000537A Wafer-level package structure and production method thereof
03/27/2013CN103000536A Preparation technology for intelligent power modules
03/27/2013CN102994962A Cylindrical sputtering target material, wiring board and thin film transistor using the same
03/27/2013CN102993994A Thermal conductive sheet and producing method thereof
03/27/2013CN102993638A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
03/27/2013CN102993451A Thermal conductive sheet and producing method thereof
03/27/2013CN102324392B Preparation process for anti-oxidation copper-based bonding wires
03/27/2013CN102214600B Method for reducing electromigration of copper in copper interconnection structure and copper interconnection structure
03/27/2013CN102208419B Method for manufacturing semiconductor device and method for manufacturing display device
03/27/2013CN102208379B 液体散热组件 Liquid cooling components
03/27/2013CN102208354B Square plane pin-free semiconductor package component and manufacture method thereof
03/27/2013CN102201427B 发光元件 Emitting element
03/27/2013CN102169871B Structure and manufacturing method of antistatic circuit
03/27/2013CN102169860B Semiconductor structure with passive component structure and manufacturing method thereof
03/27/2013CN102163593B 集成电路芯片 IC chip
03/27/2013CN102163563B Epoxy resin formulations for underfill applications
03/27/2013CN102157522B 半导体装置 Semiconductor device
03/27/2013CN102148172B Semiconductor process, semiconductor component and package structure with semiconductor component
03/27/2013CN102148167B Method for manufacturing stackable packaging structure
03/27/2013CN102142356B Process monitor and apparatus for producing semiconductor
03/27/2013CN102116986B 电子纸显示装置及其制造方法 An electronic paper display device and manufacturing method thereof
03/27/2013CN102112517B Resin composition for semiconductor encapsulation and semiconductor device using the same
03/27/2013CN102097414B Semiconductor device with marked conduction columns
03/27/2013CN102097359B Method for etching contact hole
03/27/2013CN102074544B Through-silicon via structure and a process for forming the same
03/27/2013CN102074512B Ultrathin tube shell
03/27/2013CN102054716B Method and structure for molding leadframe strip
03/27/2013CN102037306B Vapor vortex heat sink
03/27/2013CN102027593B Cooling arrangement comprising two semiconductor components disposed next to one another
03/27/2013CN102027584B Semiconductor component fabrication method and semiconductor component
03/27/2013CN101996972B Integrated circuit and conductive tape
03/27/2013CN101996940B Semiconductor device and method of manufacturing the same
03/27/2013CN101996892B System level photoelectric structure and manufacturing method thereof
03/27/2013CN101971349B Method for producing thin film transistor and thin film transistor
03/27/2013CN101960590B Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
03/27/2013CN101944525B Integrated circuit structure
03/27/2013CN101930973B Electrostatic discharge structures and methods of manufacture
03/27/2013CN101902141B Power module assembly
03/27/2013CN101835365B Thermally conductive EMI shield
03/27/2013CN101743480B An improved ball mounting apparatus and method
03/27/2013CN101740562B Heat spreader structures in scribe lines
03/27/2013CN101692443B Chip on film type semiconductor package and display device
1 ... 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270 271 ... 2262