| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/28/2013 | US20130075901 Semiconductor device and a method of manufacturing the same |
| 03/28/2013 | US20130075900 Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding |
| 03/28/2013 | US20130075899 Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant |
| 03/28/2013 | US20130075898 Surface depressions for die-to-die interconnects and associated systems and methods |
| 03/28/2013 | US20130075897 Semiconductor integrated circuit device for driving display device and manufacturing method thereof |
| 03/28/2013 | US20130075896 Semiconductor device, manufacturing method thereof, and electronic apparatus |
| 03/28/2013 | US20130075895 Semiconductor device and manufacturing method thereof |
| 03/28/2013 | US20130075894 Integrated circuit and method of making |
| 03/28/2013 | US20130075893 Synchronous Buck Converter Having Coplanar Array of Contact Bumps of Equal Volume |
| 03/28/2013 | US20130075892 Method for Three Dimensional Integrated Circuit Fabrication |
| 03/28/2013 | US20130075891 Flip chip type full wave rectification semiconductor device and its manufacturing method |
| 03/28/2013 | US20130075890 Integrated circuit and method of making |
| 03/28/2013 | US20130075889 Integrated circuit packaging system with heat shield and method of manufacture thereof |
| 03/28/2013 | US20130075888 Semiconductor package and method of fabricating the same |
| 03/28/2013 | US20130075887 Stacked semiconductor device |
| 03/28/2013 | US20130075885 Lead frame and packaging method |
| 03/28/2013 | US20130075884 Semiconductor package with high-side and low-side mosfets and manufacturing method |
| 03/28/2013 | US20130075883 Integrated circuit packaging system with dual connection and method of manufacture thereof |
| 03/28/2013 | US20130075882 Package structure |
| 03/28/2013 | US20130075881 Memory card package with a small substrate |
| 03/28/2013 | US20130075880 Packaging structure |
| 03/28/2013 | US20130075879 Semiconductor chip package and method of making same |
| 03/28/2013 | US20130075878 Coaxial power module |
| 03/28/2013 | US20130075876 Sealed porous materials, methods for making them, and semiconductor devices comprising them |
| 03/28/2013 | US20130075873 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device |
| 03/28/2013 | US20130075872 Metal Pad Structures in Dies |
| 03/28/2013 | US20130075871 Multi-layer chip overlay target and measurement |
| 03/28/2013 | US20130075870 Method for protection of a layer of a vertical stack and corresponding device |
| 03/28/2013 | US20130075869 Chip Comprising a Fill Structure |
| 03/28/2013 | US20130075860 Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof |
| 03/28/2013 | US20130075858 Semiconductor device |
| 03/28/2013 | US20130075853 Stacked Die Package for MEMS Resonator System |
| 03/28/2013 | US20130075823 Reliable contacts |
| 03/28/2013 | US20130075795 Aerogel dielectric layer |
| 03/28/2013 | US20130075727 Semiconductor device |
| 03/28/2013 | US20130075726 Protection method for an electronic device and corresponding device |
| 03/28/2013 | US20130075725 Enhanced wafer test line structure |
| 03/28/2013 | US20130075154 Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition |
| 03/28/2013 | DE112011102130T5 MEMS-Strukturen mit planarem Hohlraum und verwandte Strukturen, Herstellungsverfahren und Design-Strukturen MEMS structures with planar cavity and related structures, manufacturing processes and design structures |
| 03/28/2013 | DE112011101941T5 Flexibler Wärmetauscher Flexible heat exchanger |
| 03/28/2013 | DE102012216774A1 Leistungshalbleitermodul mit drahtlosem aow temperatursensor Power semiconductor module with wireless temperature sensor aow |
| 03/28/2013 | DE102012109164A1 Halbleiterstruktur samt Schutzring Semiconductor structure including guard ring |
| 03/28/2013 | DE102011115658A1 Electronic device has main soldering surface structure whose section is partially matched with auxiliary soldering surface structure on which electronic component is mounted |
| 03/28/2013 | DE102011114186A1 Power semiconductor device for use as e.g. pole switch for circuit breaker, has semiconductor element with power FETs that are electrically connected to each other through drain, where gates and sources are disconnected |
| 03/28/2013 | DE102011090163A1 Halbleiterbauelement mit Austauschgateelektrodenstrukturen und selbstjustierten Kontaktelementen, die durch eine späte Kontaktfüllung hergestellt sind Semiconductor component with replacement gate electrode structures and self-aligned contact elements which are produced by a late charge Contact |
| 03/28/2013 | DE102011083627A1 Method for connecting electronic part e.g. transistor, involves applying electrical conductive layer for electrically connecting electrical contact surface of electronic part with electrical strip conductor, and applying covering layer |
| 03/28/2013 | DE102011083598A1 Leistungsmodul und Herstellungsverfahren Power module and manufacturing method |
| 03/28/2013 | DE102011083491A1 Connection assembly for use in scintillation detector of computed tomography system to connect e.g. memory chip with substrate, has two micro-components connected with each other as pair and arranged on functional side opposite to rear face |
| 03/28/2013 | DE102011083419A1 Elektronische Baugruppe, Leiterplatte und Verfahren Electronic assembly, circuit board and method |
| 03/28/2013 | DE102011083247A1 Hermetic encapsulated organic LED arrangement for use in roof of building to introduce daylight and artificial light, has sealing layer comprising inner recess at inner side, and connected with support substrate by hermetic connection |
| 03/28/2013 | DE102011083224A1 Thermal paste useful in power electronics, comprises thermochromic paint components, whose color changes with temperature |
| 03/28/2013 | DE102011083223A1 Leistungshalbleitermodul mit integrierter Dickschichtleiterplatte Power semiconductor module with integrated thick film circuit board |
| 03/28/2013 | DE102004007655B4 Halbleiterschaltungen mit ESD-Schutzvorrichtung mit einer mit einem Substrat- oder Guard-Ring-Kontakt kontaktierten ESD-Schutzschaltung Semiconductor circuits with ESD protection device with a substrate or contacted with a guard ring contact ESD protection circuit |
| 03/27/2013 | EP2574159A1 Cooling device with a plurality of fin pitches |
| 03/27/2013 | EP2574156A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board |
| 03/27/2013 | EP2573814A1 Solid-state image sensor |
| 03/27/2013 | EP2573811A2 Electronic component module and its manufacturing method |
| 03/27/2013 | EP2573810A1 Semiconductor device |
| 03/27/2013 | EP2573809A1 Semiconductor device and method for manufacturing the same |
| 03/27/2013 | EP2573806A1 Integrated circuit with sensor and manufacturing method thereof |
| 03/27/2013 | EP2573805A2 Aerogel dielectric layer |
| 03/27/2013 | EP2573804A1 Integrated circuit with sensor and manufacturing method thereof |
| 03/27/2013 | EP2573514A1 Composite sensor and method for manufacturing same |
| 03/27/2013 | EP2573141A1 Silicone resin sheet, producing method thereof, encapsulating sheet, and light emitting diode device |
| 03/27/2013 | EP2573129A1 Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound |
| 03/27/2013 | EP2572562A1 Set-top box having dissipating thermal loads |
| 03/27/2013 | EP2572561A2 Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material |
| 03/27/2013 | EP2572450A1 High power gallium nitride field effect transistor switches |
| 03/27/2013 | EP2572383A1 Transistor with high electron mobility and inhomogeneous layer resistance of the guide channel |
| 03/27/2013 | EP2572378A1 Electrically broken, but mechanically continuous die seal for integrated circuits |
| 03/27/2013 | EP2572377A1 High q vertical ribbon inductor on semiconducting substrate |
| 03/27/2013 | EP2572376A1 Method and device for thermally coupling a heat sink to a component |
| 03/27/2013 | EP2572375A2 Electrical connector between die pad and z-interconnect for stacked die assemblies |
| 03/27/2013 | EP2572374A1 Method for building a substrate holder |
| 03/27/2013 | EP2572372A1 Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc) |
| 03/27/2013 | EP2571916A1 Uv-curable polymer thick film dielectric compositions with excellent adhesion to ito |
| 03/27/2013 | CN202841815U Heat radiation module used for electronic component |
| 03/27/2013 | CN202839750U Photoelectric device provided with radiator unit and photoelectric system |
| 03/27/2013 | CN202839609U Laminated thick film circuit module possessing shielding function |
| 03/27/2013 | CN202839600U Ultrathin full-wave rectifier |
| 03/27/2013 | CN202839599U Chip-embedded-type three-dimensional wafer-level packaging structure |
| 03/27/2013 | CN202839598U Cover component |
| 03/27/2013 | CN202839597U Three dimensional capacitor structure |
| 03/27/2013 | CN202839596U 半导体元件 Semiconductor device |
| 03/27/2013 | CN202839595U High-power high-density semiconductor device |
| 03/27/2013 | CN202839594U Pin framework of bipolar electronic component |
| 03/27/2013 | CN202839593U Wide pin semiconductor device package structure |
| 03/27/2013 | CN202839592U Semiconductor device |
| 03/27/2013 | CN202839591U Driving IC packaging bump and packaging structure |
| 03/27/2013 | CN202839590U Multi-cell high-power thyristor aluminum gasket structure and thyristor |
| 03/27/2013 | CN202839589U Soaking plate, LED chip packaging structure based on soaking plate and chip support thereof |
| 03/27/2013 | CN202839588U Radiator for semi-conductor refrigeration |
| 03/27/2013 | CN202839587U Surface mounting semiconductor device |
| 03/27/2013 | CN202839586U Outer-pin-free flat semiconductor package structure adopting elastic device |
| 03/27/2013 | CN202839585U Heat radiation structure for power amplification module |
| 03/27/2013 | CN202839187U Stripping device for chip |
| 03/27/2013 | CN202836282U Plate heat exchanger |
| 03/27/2013 | CN1567078B Wiring and making method thereof including the described wired semiconductor device and dry etching process |
| 03/27/2013 | CN1469290B Product management method, program for executing products management and recorded program medium |
| 03/27/2013 | CN103003965A Carrier device for a semiconductor chip with a solder barrier against solder creep, electronic component and optoelectronic component provided therewith |