| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/2015 | US8941226 Sealed semiconductor device having adhesive patch with inwardly sloped side surfaces |
| 01/27/2015 | US8941225 Integrated circuit package and method for manufacturing the same |
| 01/27/2015 | US8941224 Package structure of a chip and a substrate |
| 01/27/2015 | US8941223 MEMS device package with conductive shell |
| 01/27/2015 | US8941222 Wafer level semiconductor package and manufacturing methods thereof |
| 01/27/2015 | US8941221 Semiconductor package |
| 01/27/2015 | US8941220 Power module package and system module having the same |
| 01/27/2015 | US8941219 Etched recess package on package system |
| 01/27/2015 | US8941218 Passivation for group III-V semiconductor devices having a plated metal layer over an interlayer dielectric layer |
| 01/27/2015 | US8941217 Semiconductor device having a through contact |
| 01/27/2015 | US8941216 Semiconductor devices having through-vias and methods for fabricating the same |
| 01/27/2015 | US8941215 Micro device stabilization post |
| 01/27/2015 | US8941213 Semiconductor device |
| 01/27/2015 | US8941207 Surface (lateral) voltage-sustaining region with an insulator film containing conductive particles |
| 01/27/2015 | US8941206 Semiconductor device including a diode and method of manufacturing a semiconductor device |
| 01/27/2015 | US8941157 Semiconductor device and method for fabricating the same |
| 01/27/2015 | US8941134 Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging |
| 01/27/2015 | US8941123 Local interconnects by metal-III-V alloy wiring in semi-insulating III-V substrates |
| 01/27/2015 | US8941110 E-fuses containing at least one underlying tungsten contact for programming |
| 01/27/2015 | US8941109 Test output buffer functional output input, test output, enable input |
| 01/27/2015 | US8941108 Method to perform electrical testing and assembly of electronic devices |
| 01/27/2015 | US8941018 Connecting element and method for manufacturing a connecting element |
| 01/27/2015 | US8941015 Embedded capacitor substrate module |
| 01/27/2015 | US8940638 Substrate wiring method and semiconductor manufacturing device |
| 01/27/2015 | US8940636 Through hole vias at saw streets including protrusions or recesses for interconnection |
| 01/27/2015 | US8940635 Structure and method for forming interconnect structure |
| 01/27/2015 | US8940634 Overlapping contacts for semiconductor device |
| 01/27/2015 | US8940633 Methods of forming semiconductor device with self-aligned contact elements and the resulting devices |
| 01/27/2015 | US8940629 Ball grid array semiconductor package and method of manufacturing the same |
| 01/27/2015 | US8940628 Method of manufacturing interconnection and semiconductor device |
| 01/27/2015 | US8940627 Conductive ink for filling vias |
| 01/27/2015 | US8940621 Methods of forming semiconductor modules including flexible panels |
| 01/27/2015 | US8940586 Mechanism for MEMS bump side wall angle improvement |
| 01/27/2015 | US8940585 Single layer BGA substrate process |
| 01/27/2015 | US8940584 Semiconductor packages and methods of forming the same |
| 01/27/2015 | US8940583 Manufacturing method of a lead frame |
| 01/27/2015 | US8940581 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 01/27/2015 | US8940557 Method of fabricating wafer level package |
| 01/27/2015 | US8940553 Flat panel display device and method for manufacturing flat panel display |
| 01/27/2015 | US8940550 Maintaining laminate flatness using magnetic retention during chip joining |
| 01/27/2015 | US8940403 Alloy wire and methods for manufacturing the same |
| 01/27/2015 | US8940198 Conductive adhesive, and circuit board and electronic component module using the same |
| 01/27/2015 | US8939348 Metal bonded structure and metal bonding method |
| 01/27/2015 | US8939347 Magnetic intermetallic compound interconnect |
| 01/27/2015 | US8939346 Methods and systems involving soldering |
| 01/27/2015 | US8938880 Method of manufacturing an integrated cold plate for electronics |
| 01/27/2015 | US8938878 Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation |
| 01/25/2015 | CA2856490A1 Semiconductor assembly and method of manufacture |
| 01/22/2015 | WO2015010039A1 Method and system for an immersion boiling heat sink |
| 01/22/2015 | WO2015009702A1 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
| 01/22/2015 | WO2015009614A1 Complete system-on-chip (soc) using monolithic three dimensional (3d) integrated circuit (ic) (3dic) technology |
| 01/22/2015 | WO2015009238A1 Method and apparatus for chip-to-wafer integration |
| 01/22/2015 | WO2015009129A1 Sealing composition |
| 01/22/2015 | WO2015008860A1 Package for electrical element |
| 01/22/2015 | WO2015008768A1 Printed circuit board |
| 01/22/2015 | WO2015008658A1 Method for producing flexible electronic device |
| 01/22/2015 | WO2015008326A1 Heat sink and method for manufacturing heat sink |
| 01/22/2015 | WO2015008059A1 Circuit sheet arrangement |
| 01/22/2015 | WO2015007507A1 Power semiconductor module |
| 01/22/2015 | WO2015007054A1 Method and apparatus of manufacturing flexible display device |
| 01/22/2015 | US20150026016 System and method of producing model figure of person with associated clothing |
| 01/22/2015 | US20150024589 Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed |
| 01/22/2015 | US20150024555 Semiconductor device, electronic device, and semiconductor device manufacturing method |
| 01/22/2015 | US20150024554 Chip To Package Interface |
| 01/22/2015 | US20150024553 Power module package |
| 01/22/2015 | US20150024552 Substrate, chip package and method for manufacturing substrate |
| 01/22/2015 | US20150024551 Semiconductor chip bonding apparatus and method of forming semiconductor device using the same |
| 01/22/2015 | US20150024550 Methods for producing semiconductor devices |
| 01/22/2015 | US20150024547 EMI Package and Method for Making Same |
| 01/22/2015 | US20150024545 Stacked package structure and method of manufacturing a package-on-package device |
| 01/22/2015 | US20150024544 Method for manufacturing semiconductor device |
| 01/22/2015 | US20150024535 Semiconductor sensor device with footed lid |
| 01/22/2015 | US20150024520 Semiconductor device manufacturing method and manufacturing device |
| 01/22/2015 | US20150021793 Semiconductor structures and methods of manufacture |
| 01/22/2015 | US20150021792 Electronic device and method for fabricating an electronic device |
| 01/22/2015 | US20150021791 Semiconductor device |
| 01/22/2015 | US20150021790 Semiconductor device |
| 01/22/2015 | US20150021789 Hybrid bonding with through substrate via (tsv) |
| 01/22/2015 | US20150021788 Multi-Function and Shielded 3D Interconnects |
| 01/22/2015 | US20150021787 Semiconductor package |
| 01/22/2015 | US20150021785 Hybrid bonding with through substrate via (tsv) |
| 01/22/2015 | US20150021784 Front-to-back bonding with through-substrate via (tsv) |
| 01/22/2015 | US20150021783 Semiconductor memory system |
| 01/22/2015 | US20150021782 Design method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device |
| 01/22/2015 | US20150021781 Semiconductor device and method of manufacturing semiconductor device |
| 01/22/2015 | US20150021780 Thin power device and preparation method thereof |
| 01/22/2015 | US20150021779 Hard mask for back-end-of-line (beol) interconnect structure |
| 01/22/2015 | US20150021778 Chip package incorporating interfacial adhesion through conductor sputtering |
| 01/22/2015 | US20150021777 Mounting structure and mounting structure manufacturing method |
| 01/22/2015 | US20150021775 Method for manufacturing semiconductor device, semiconductor device, and apparatus for producing semiconductor |
| 01/22/2015 | US20150021774 Molecular Self-Assembly in Substrate Processing |
| 01/22/2015 | US20150021773 Through Semiconductor via Structure with Reduced Stress Proximity Effect |
| 01/22/2015 | US20150021772 Mixed-metal barrier films optimized by high-productivity combinatorial PVD |
| 01/22/2015 | US20150021771 Mechanisms for forming three-dimensional integrated circuit (3dic) stacking structure |
| 01/22/2015 | US20150021770 Back-end-of-line (beol) interconnect structure |
| 01/22/2015 | US20150021769 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 01/22/2015 | US20150021768 Semiconductor device and power supply unit utilizing the same |
| 01/22/2015 | US20150021767 Semiconductor device with plated conductive pillar coupling |
| 01/22/2015 | US20150021766 Substrate for semiconductor package and process for manufacturing |
| 01/22/2015 | US20150021765 Semiconductor Device |