Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2013
04/02/2013US8410610 Connecting terminals with conductive terminal-forming members having terminal portions extending in different directions
04/02/2013US8410608 Interconnect structure device
04/02/2013US8410607 Semiconductor memory structures
04/02/2013US8410605 Extended under-bump metal layer for blocking alpha particles in a semiconductor device
04/02/2013US8410604 Lead-free structures in a semiconductor device
04/02/2013US8410603 Semiconductor device and package
04/02/2013US8410602 Cooling system for semiconductor devices
04/02/2013US8410601 RF package
04/02/2013US8410599 Power MOSFET package
04/02/2013US8410598 Semiconductor package and method of manufacturing the same
04/02/2013US8410596 Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package
04/02/2013US8410595 Semiconductor device with chip mounted on a substrate
04/02/2013US8410594 Inter-stacking module system
04/02/2013US8410593 Process and system for manufacturing an encapsulated semiconductor device
04/02/2013US8410592 Semiconductor device and method for producing the same
04/02/2013US8410591 Semiconductor module with multiple semiconductor chips
04/02/2013US8410590 Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
04/02/2013US8410589 Lead frame, resin package, semiconductor device and resin package manufacturing method
04/02/2013US8410587 Integrated circuit package system
04/02/2013US8410586 Semiconductor package and method of assembling a semiconductor package
04/02/2013US8410585 Leadframe and semiconductor package made using the leadframe
04/02/2013US8410584 Semiconductor device packages with electromagnetic interference shielding
04/02/2013US8410583 Security chip
04/02/2013US8410581 Silicon device structure, and sputtering target used for forming the same
04/02/2013US8410579 Power distribution network
04/02/2013US8410574 Integrated microelectronic device with through-vias
04/02/2013US8410567 Solid image-pickup device with flexible circuit substrate
04/02/2013US8410526 Semiconductor integrated circuit device with reduced cell size
04/02/2013US8410516 Light emitting diode package having interconnection structures
04/02/2013US8410377 Mounted structure
04/02/2013US8410360 Sealing structure for wire lead-out hole
04/02/2013US8409979 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
04/02/2013US8409971 Integrated multicomponent device in a semiconducting die
04/02/2013US8409926 Semiconductor device and method of forming insulating layer around semiconductor die
04/02/2013US8409922 Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
04/02/2013US8409921 Integrated circuit package system including honeycomb molding
04/02/2013US8409918 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting
04/02/2013US8409885 Method for packaging light emitting diode
04/02/2013US8409131 Analyte monitoring device and methods of use
04/02/2013US8408282 Heat exchange device and method
03/2013
03/28/2013WO2013044094A2 Methods for reducing thermal resistance of carbon nanotube arrays or sheets
03/28/2013WO2013043813A1 Carbon-metal thermal management substrates
03/28/2013WO2013043466A1 Embedded capacitor and method of fabricating the same
03/28/2013WO2013043280A1 Pixel guard lines and multi-gate line configuration
03/28/2013WO2013042638A1 Thermally conductive, moisture-curable resin composition
03/28/2013WO2013042629A1 Metal filling device
03/28/2013WO2013042627A1 Electronic component mounting substrate, electronic component accommodating package and electronic device
03/28/2013WO2013042608A1 Semiconductor device and method for manufacturing same
03/28/2013WO2013042491A1 Semiconductor device manufacturing method
03/28/2013WO2013042286A1 Semiconductor device
03/28/2013WO2013041554A1 Package for high frequency circuits
03/28/2013WO2013041288A1 Electrical control device with moulded housing
03/28/2013WO2013040821A1 Thin film, pattern layer and manufacturing method thereof
03/28/2013WO2012151120A3 Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
03/28/2013WO2012147610A9 Heat dissipating substrate
03/28/2013WO2012107482A3 Power semiconductor module
03/28/2013WO2011084706A3 Apparatus and method for controlling semiconductor die warpage
03/28/2013WO2009099912A3 Differential internally matched wire-bond interface
03/28/2013US20130078915 Interposer Package Structure for Wireless Communication Element, Thermal Enhancement, and EMI Shielding
03/28/2013US20130077374 Stacked semiconductor apparatus, system and method of fabrication
03/28/2013US20130077264 Sealed Overmolded Circuit Board With Sensor Seal and Edge Connector Seal and Production Method Of The Same
03/28/2013US20130077239 Semiconductor module and module system having the same
03/28/2013US20130076486 Electronic device including finger sensor and related methods
03/28/2013US20130076387 Semiconductor chip, semiconductor device, and method of measuring the same
03/28/2013US20130075938 Photolithography alignment mark, mask and semiconductor wafer containing the same mark
03/28/2013US20130075937 Apparatus and Methods for Molding Die on Wafer Interposers
03/28/2013US20130075936 Semiconductor Device and Method of Forming Interconnect Substration for FO-WLCSP
03/28/2013US20130075935 Composite layered chip package
03/28/2013US20130075934 Semiconductor device
03/28/2013US20130075933 Package-on-package system with through vias and method of manufacture thereof
03/28/2013US20130075932 Power Semiconductor Module with Integrated Thick-Film Printed Circuit Board
03/28/2013US20130075931 Bond pad structure
03/28/2013US20130075930 Semiconductor substrate, eletronic device and method for manufacturing the same
03/28/2013US20130075929 Semiconductor device and method of manufacturing the same
03/28/2013US20130075928 Integrated circuit and method of making
03/28/2013US20130075927 Integrated circuit packaging system with encapsulation and method of manufacture thereof
03/28/2013US20130075926 Integrated circuit packaging system with package stacking and method of manufacture thereof
03/28/2013US20130075925 Semiconductor device
03/28/2013US20130075924 Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP
03/28/2013US20130075923 Integrated circuit packaging system with encapsulation and method of manufacture thereof
03/28/2013US20130075922 Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
03/28/2013US20130075921 Forming Packages Having Polymer-Based Substrates
03/28/2013US20130075920 Multilayer Connection Structure and Making Method
03/28/2013US20130075919 Semiconductor Device and Method of Forming FO-WLCSP Having Conductive Layers and Conductive Vias Separated by Polymer Layers
03/28/2013US20130075918 Shift register memory
03/28/2013US20130075917 Multi-Chip and Multi-Substrate Reconstitution Based Packaging
03/28/2013US20130075916 Integrated circuit packaging system with external wire connection and method of manufacture thereof
03/28/2013US20130075915 Integrated circuit packaging system with chip stacking and method of manufacture thereof
03/28/2013US20130075913 Structure and method for reducing vertical crack propagation
03/28/2013US20130075912 Semiconductor device and method for manufacturing the same
03/28/2013US20130075911 Semiconductor Device Having Electrode/Film Opening Edge Spacing Smaller Than Bonding Pad/Electrode Edge Spacing
03/28/2013US20130075910 MODULATED DEPOSITION PROCESS FOR STRESS CONTROL IN THICK TiN FILMS
03/28/2013US20130075909 Semiconductor device including metal-containing conductive line and method of manufacturing the same
03/28/2013US20130075908 Semiconductor interconnect structure having enhanced performance and reliability
03/28/2013US20130075907 Interconnection Between Integrated Circuit and Package
03/28/2013US20130075906 Semiconductor device and method for manufacturing semiconductor device
03/28/2013US20130075905 Semiconductor Chips and Semiconductor Packages and Methods of Fabricating the Same
03/28/2013US20130075904 Coplaner waveguide transition
03/28/2013US20130075903 Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
03/28/2013US20130075902 Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
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