| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/03/2013 | CN103022010A Light-emitting device, lighting device and method of manufacturing the light-emitting device |
| 04/03/2013 | CN103022009A 半导体测试结构 Semiconductor test structure |
| 04/03/2013 | CN103022008A Layout for semiconductor memories |
| 04/03/2013 | CN103022007A Titanium doped tantalum base barrier layer for copper interconnection and manufacturing method thereof |
| 04/03/2013 | CN103022006A Epitaxy technology based three-dimensional integrated power semiconductor and manufacturing method thereof |
| 04/03/2013 | CN103022005A Laminated 3D-MCM (3-dimensional multiple chip module) structure based on peripheral vertical interconnect technology |
| 04/03/2013 | CN103022004A Interconnection structure of high-voltage integrated circuit |
| 04/03/2013 | CN103022003A Multi-layer wiring substrate and manufacturing method thereof, active matrix substrate and image display apparatus |
| 04/03/2013 | CN103022002A 半导体器件 Semiconductor devices |
| 04/03/2013 | CN103022001A Fuse element |
| 04/03/2013 | CN103022000A Planar inductor and manufacturing method thereof, and semiconductor device and manufacturing method thereof |
| 04/03/2013 | CN103021999A Semiconductor structure and manufacture method thereof |
| 04/03/2013 | CN103021998A Semiconductor device and electrode terminal |
| 04/03/2013 | CN103021997A Lead support frame, packager and packaging method |
| 04/03/2013 | CN103021996A Flat multichip packaging piece with stamping frame with square groove and production method of flat multichip packaging piece |
| 04/03/2013 | CN103021995A Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece |
| 04/03/2013 | CN103021994A Package using optimized AQFN (advanced quad flat no-lead) secondary plastic packaging and secondary ball placement and manufacturing process thereof |
| 04/03/2013 | CN103021993A Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device |
| 04/03/2013 | CN103021992A Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
| 04/03/2013 | CN103021991A Lead frame and encapsulation method |
| 04/03/2013 | CN103021990A 芯片结构及其制造方法 Chip structure and manufacturing method |
| 04/03/2013 | CN103021989A Multiple-component chip packaging structure |
| 04/03/2013 | CN103021988A Single-chip packaging piece with adhesive film replacing bottom fillers and manufacture process thereof |
| 04/03/2013 | CN103021987A Semiconductor package and method of forming the same |
| 04/03/2013 | CN103021986A Strip for low-capacitance high-speed transmission semiconductor surge protector |
| 04/03/2013 | CN103021985A Electric leading-out structure of sensor chip to be detected and application thereof |
| 04/03/2013 | CN103021984A 晶圆级封装构造及其制造方法 Wafer-level packaging structure and manufacturing method |
| 04/03/2013 | CN103021983A Wafer level chip size package and manufacturing method thereof |
| 04/03/2013 | CN103021982A Integrated circuits and methods of fabricating same |
| 04/03/2013 | CN103021981A Integrated circuits and method of fabricating same |
| 04/03/2013 | CN103021980A Chip module and method for fabricating a chip module |
| 04/03/2013 | CN103021979A Semiconductor device |
| 04/03/2013 | CN103021978A Welding pad structure for packaging on integrated circuit chip |
| 04/03/2013 | CN103021977A Novel power module |
| 04/03/2013 | CN103021976A Sealed circulation water cooling device with conductivity protection function |
| 04/03/2013 | CN103021975A Uniform temperature plate structure and manufacturing method thereof |
| 04/03/2013 | CN103021974A 半导体封装件 The semiconductor package |
| 04/03/2013 | CN103021973A Airtightness packaging radiating structure of integrated circuit |
| 04/03/2013 | CN103021972A Chip encapsulation structure and method |
| 04/03/2013 | CN103021971A Electronic device and heat dissipation structure for image sensors |
| 04/03/2013 | CN103021970A Integrated circuit with sensor and manufacturing method thereof |
| 04/03/2013 | CN103021969A Substrate, semiconductor package and fabrication method thereof |
| 04/03/2013 | CN103021968A High-heat-resistance bonding material and semiconductor structure using same |
| 04/03/2013 | CN103021967A Power semiconductor module with integrated thick-film printed circuit board |
| 04/03/2013 | CN103021966A Substrate with reference marks and chip fixing method using substrate |
| 04/03/2013 | CN103021965A Light-transmitting package structure and package method based on silicon substrate and glass gland |
| 04/03/2013 | CN103021964A Semiconductor substrate, eletronic device and method for manufacturing the same |
| 04/03/2013 | CN103021963A Base plate and semiconductor device |
| 04/03/2013 | CN103021962A Semiconductor chip and processing method thereof |
| 04/03/2013 | CN103021956A PIP (poly-insulator-poly) capacitor of split gate type flash memory and manufacturing method of PIP capacitor |
| 04/03/2013 | CN103021955A Polycrystalline silicon resistance structure and method for manufacturing corresponding semiconductor integrated device |
| 04/03/2013 | CN103021954A Polycrystalline silicon resistance structure and method for manufacturing corresponding semiconductor integrated device |
| 04/03/2013 | CN103021935A Formation method of local air gaps |
| 04/03/2013 | CN103021892A Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof |
| 04/03/2013 | CN103021879A Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof |
| 04/03/2013 | CN103021877A High-density chip radiating method by dual-path heat transfer |
| 04/03/2013 | CN103021874A Semiconductor chip package and method for manufacturing thereof |
| 04/03/2013 | CN103021816A Polyresistor structure, method for manufacturing same and polyresistor |
| 04/03/2013 | CN103021813A MIM (metal-insulator-metal) capacitor and manufacturing method thereof |
| 04/03/2013 | CN103021802A Production method for detection sample of semiconductor device, and detection sample |
| 04/03/2013 | CN103021508A Novel conductive paste |
| 04/03/2013 | CN103019052A Lithography alignment mark, and mask plate and semiconductor chip containing the same |
| 04/03/2013 | CN103013370A Anisotropic conductive adhesive film and electronic device |
| 04/03/2013 | CN103013357A Resin paste composition and semiconductor device |
| 04/03/2013 | CN103013125A Insulated silicon rubber composition |
| 04/03/2013 | CN103011606A Preparation method of electronic-grade superfine E-glass powder for large-scale integrated circuit substrate |
| 04/03/2013 | CN103009724A Laminated body, laminated board, multi-layer laminated board, printed wiring board and manufacturing method for laminated board |
| 04/03/2013 | CN103009723A Laminate body, laminate plate, multilayer laminate plate, printed wiring board and manufacturing method for laminate plate |
| 04/03/2013 | CN103009722A Laminate body, laminate plate, multilayer laminate plate, printed wiring board and manufacturing method for laminate plate |
| 04/03/2013 | CN103009721A Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board |
| 04/03/2013 | CN103009720A Laminate body, laminate plate, multilayer laminate plate, printed wiring board and manufacturing method for laminate plate |
| 04/03/2013 | CN102352090B Flame retarded epoxy resin composite material |
| 04/03/2013 | CN102231361B Semiconductor component and method for manufacturing same |
| 04/03/2013 | CN102222654B Semiconductor device with through substrate via and production method thereof |
| 04/03/2013 | CN102184917B Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package |
| 04/03/2013 | CN102169838B Manufacturing method of carbon nano-tube micro-channel cooler system |
| 04/03/2013 | CN102148206B Semiconductor packaging structure and producing method thereof |
| 04/03/2013 | CN102097415B Semiconductor packaging piece and manufacture method thereof |
| 04/03/2013 | CN101980361B IC having wafer paste sheet adhesive tape and encapsulation method thereof |
| 04/03/2013 | CN101937880B Thin wafer handling structure, and thin wafer bounding and releasing method |
| 04/03/2013 | CN101840926B Solid-state imaging device, method of manufacturing the same, method of driving the same, and electronic apparatus |
| 04/03/2013 | CN101763776B Organic electroluminescent display device and method of manufacturing the same |
| 04/03/2013 | CN101661937B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/03/2013 | CN101483186B Display device and producing method thereof |
| 04/03/2013 | CN101467163B Transfer tape strap process |
| 04/03/2013 | CN101309576B Thermally conductive sheet and method of manufacturing the same |
| 04/03/2013 | CN101232061B Luminous source packaging |
| 04/02/2013 | US8411450 Electronic device package, module, and electronic device |
| 04/02/2013 | US8411440 Cooled universal hardware platform |
| 04/02/2013 | US8411197 Image pickup device and production method thereof |
| 04/02/2013 | US8411006 Display device including scan signal line driving circuits connected via signal wiring |
| 04/02/2013 | US8410620 Primer resin for semiconductor device and semiconductor device |
| 04/02/2013 | US8410619 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device |
| 04/02/2013 | US8410618 Microelectronic assembly with joined bond elements having lowered inductance |
| 04/02/2013 | US8410617 Three dimensional structure memory |
| 04/02/2013 | US8410616 Method of processing resist, semiconductor device, and method of producing the same |
| 04/02/2013 | US8410614 Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same |
| 04/02/2013 | US8410613 Semiconductor device having groove-shaped pattern |
| 04/02/2013 | US8410612 Interconnect regions |
| 04/02/2013 | US8410611 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |