| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/04/2013 | US20130082382 Semiconductor device |
| 04/04/2013 | US20130082381 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 04/04/2013 | US20130082380 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 04/04/2013 | US20130082379 Semiconductor package including an integrated waveguide |
| 04/04/2013 | US20130082378 Resin sealing method of semiconductor device |
| 04/04/2013 | US20130082377 Integrated three-dimensional module heat exchanger for power electronics cooling |
| 04/04/2013 | US20130082376 3d integrated electronic device structure including increased thermal dissipation capabilities |
| 04/04/2013 | US20130082375 Stub minimization for assemblies without wirebonds to package substrate |
| 04/04/2013 | US20130082374 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 04/04/2013 | US20130082373 Low-inductive semiconductor module |
| 04/04/2013 | US20130082372 Package on Packaging Structure and Methods of Making Same |
| 04/04/2013 | US20130082371 Semiconductor package |
| 04/04/2013 | US20130082370 Component built-in wiring board and manufacturing method of component built-in wiring board |
| 04/04/2013 | US20130082369 Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode |
| 04/04/2013 | US20130082368 Emi shielded semiconductor package and emi shielded substrate module |
| 04/04/2013 | US20130082367 Semiconductor package and method of manufacturing the same |
| 04/04/2013 | US20130082366 Semiconductor package and method of manufacturing the same |
| 04/04/2013 | US20130082365 Interposer for ESD, EMI, and EMC |
| 04/04/2013 | US20130082364 EMI Package AND METHOD FOR MAKING SAME |
| 04/04/2013 | US20130082363 Device Having Wirelessly Enabled Functional Blocks |
| 04/04/2013 | US20130082359 Removing conductive material to form conductive features in a substrate |
| 04/04/2013 | US20130082358 Single crystal substrate with multilayer film, manufacturing method for single crystal substrate with multilayer film, and element manufacturing method |
| 04/04/2013 | US20130082350 Silicon-on-insulator chip having multiple crystal orientations |
| 04/04/2013 | US20130082349 Semiconductor device |
| 04/04/2013 | US20130082347 One Time Programmable Structure Using a Gate Last High-K Metal Gate Process |
| 04/04/2013 | US20130082346 Seal ring structure with a metal pad |
| 04/04/2013 | US20130082341 Semiconductor device and semiconductor-device manufacturing method |
| 04/04/2013 | US20130082314 Low resistance stacked annular contact |
| 04/04/2013 | US20130082283 Semiconductor device and method of manufacture thereof |
| 04/04/2013 | US20130082259 Test carrier |
| 04/04/2013 | US20130082258 Method for strip testing of mems devices, testing strip of mems devices and mems device thereof |
| 04/04/2013 | US20130082257 Via chains for defect localization |
| 04/04/2013 | DE202013002486U1 Kühlkörper mit einer im Anschlussblock integrierten Wärmeaustauschfläche für ein Wärmerohr Heat sink with a built-in connector block heat transfer surface area for a heat pipe |
| 04/04/2013 | DE10295940B4 Verfahren zur Herstellung einer Halbleitereinrichtung mit einem plattenförmigen Schaltungsblock A method of manufacturing a semiconductor device with a plate-shaped circuit block |
| 04/04/2013 | DE102012217624A1 Niederinduktives Halbleitermodul Niederinduktives semiconductor module |
| 04/04/2013 | DE102012109374A1 Halbleitergehäuse und Verfahren zum Herstellen desselben Of the same semiconductor package and method for manufacturing |
| 04/04/2013 | DE102011115784A1 Vapor chamber radiator for use in electronic product, has capillary and supporting structures provided in cavity, where capillary structure is formed at walls of cavity and supporting structure is connected with metal and ceramic plates |
| 04/04/2013 | DE102011114774A1 Sensor component e.g. gas sensor component integrated in e.g. ball grid array package, has conductive layer that is made to contact with sensor chip by electrical contacts of conductive layer |
| 04/04/2013 | DE102011114770A1 Cooling device for electronic components e.g. CPU, has cooling structure that is connected with ceramic structure by braze welding, ultrasonic welding, soldering or diffusion bonding |
| 04/04/2013 | DE102011114559A1 Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen An optoelectronic component comprising an adhesive layer Process for the preparation of an adhesive layer in an optoelectronic device and use of an adhesive for forming adhesive layers in optoelectronic devices |
| 04/04/2013 | DE102011114558A1 Bauelement und Verfahren zum Herstellen dieses Bauelementes Device and method of manufacturing this component |
| 04/04/2013 | DE102011083926A1 Schichtverbund aus einer Trägerfolie und einer Schichtanordnung umfassend eine sinterbare Schicht aus mindestens einem Metallpulver und eine Lotschicht Layer composite of a carrier film and a layer arrangement comprising a sinterable layer of at least one metal powder and a solder layer |
| 04/04/2013 | DE102011083911A1 Elektronische Baugruppe mit hochtemperaturstabilem Substratgrundwerkstoff Electronic assembly with high temperature stable substrate base material |
| 04/04/2013 | DE102011083906A1 Fügehilfe für ein Leistungsmodul Joining aid for a power module |
| 04/04/2013 | DE102011083899A1 Schichtverbund zum Verbinden von elektronischen Bauteilen umfassend eine Ausgleichsschicht, Anbindungsschichten und Verbindungsschichten Layer composite including, for connecting electronic components, a leveling layer, link layer and link layer |
| 04/04/2013 | DE102011083719A1 Verfahren zur Herstellung einer Zweichipanordnung und entsprechende Zweichipanordnung A process for producing a two-chip layout and corresponding two-chip system |
| 04/04/2013 | DE102011083691A1 Optoelektronisches halbleiterbauteil The optoelectronic semiconductor component |
| 04/04/2013 | DE102011055549A1 Verfahren zur Herstellung eines optoelektronischen Bauelements mit einer drahtlosen Kontaktierung A process for producing an optoelectronic component with a wireless contacting |
| 04/04/2013 | DE102010038745B4 Teststruktur für Prüfung von Zwischenschichtdielektrikumshohlräumen und Kontaktwiderstandsmessungen in einem Halbleiterbauelement Test structure for testing of Zwischenschichtdielektrikumshohlräumen and contact resistance measurements in a semiconductor device |
| 04/04/2013 | DE102008026212B4 Halbleiterbauelement mit einer chipinternen elektrischen Teststruktur und Verfahren zur Herstellung der Teststruktur A semiconductor device comprising an on-chip electrical test structure and method of manufacturing the test structure |
| 04/04/2013 | DE102006025351B4 Teststruktur zur Überwachung von Leckströmen in einer Metallisierungsschicht und Verfahren Test structure for monitoring leakage currents in a metallization layer and method |
| 04/03/2013 | EP2575418A1 Electronics cooler and method for manufacturing the same |
| 04/03/2013 | EP2575272A2 Signal distribution and radiation in a wireless enabled integrated circuit (IC) |
| 04/03/2013 | EP2575178A2 Compound semiconductor device and manufacturing method therefor |
| 04/03/2013 | EP2575175A2 Image sensor with large chip size |
| 04/03/2013 | EP2575172A2 Semiconductor device |
| 04/03/2013 | EP2575170A2 Semiconductor package including an integrated waveguide |
| 04/03/2013 | EP2575169A2 Joining aid for a power module |
| 04/03/2013 | EP2575168A1 Electronic device |
| 04/03/2013 | EP2575167A2 Electronic device |
| 04/03/2013 | EP2575166A2 Chips having rear contacts connected by through vias to front contacts |
| 04/03/2013 | EP2575165A1 Ceramic packaging base board |
| 04/03/2013 | EP2575164A2 3d integrated electronic device structure including increased thermal dissipation capabilities |
| 04/03/2013 | EP2575138A2 Semiconductor device and system |
| 04/03/2013 | CN202857123U Printed circuit board for set top box |
| 04/03/2013 | CN202856635U Hermetically metal-sealed three-phase bridge type rectification module |
| 04/03/2013 | CN202855743U Semiconductor diode structure |
| 04/03/2013 | CN202855734U Active protector used for intelligent card |
| 04/03/2013 | CN202855733U X-ray radiation protection device for chip memory |
| 04/03/2013 | CN202855732U MOSFET pipe leading wire framework welded by utilizing triode wire welding machine |
| 04/03/2013 | CN202855731U Carrier tape for ultrathin non-contact module and non-contact module |
| 04/03/2013 | CN202855730U IGBT(Insulated Gate Bipolar Transistor) module with bidirectional heat dissipation |
| 04/03/2013 | CN202855729U Power module |
| 04/03/2013 | CN202855728U Non-welding crystal heat radiation structure |
| 04/03/2013 | CN202855727U Combination type heat dissipation box |
| 04/03/2013 | CN202855726U Prism array microchannel heat radiator three-dimensional stacked package |
| 04/03/2013 | CN103026605A Power converter |
| 04/03/2013 | CN103026487A High-frequency module and communications device |
| 04/03/2013 | CN103026486A Method for manufacturing interposer |
| 04/03/2013 | CN103026483A Metal-contamination -free through-substrate via structure |
| 04/03/2013 | CN103026476A Method to form solder alloy deposits on substrates |
| 04/03/2013 | CN103026475A Method to form solder deposits on substrates |
| 04/03/2013 | CN103026371A Electronic device having a chip and method for manufacturing by coils |
| 04/03/2013 | CN103025653A Alignment of graphite nanofibers in thermal interface material |
| 04/03/2013 | CN103025477A Method for manufacturing semiconductor device |
| 04/03/2013 | CN103025126A Liquid cooling system for modular electronic systems |
| 04/03/2013 | CN103025125A Heat radiation structure and back board used by heat radiation structure |
| 04/03/2013 | CN103023279A Semiconductor control device |
| 04/03/2013 | CN103022132A Semiconductor device with semiconductor via |
| 04/03/2013 | CN103022026A Multichip module and manufacturing method thereof |
| 04/03/2013 | CN103022023A Ultrathin miniature bridge rectifier |
| 04/03/2013 | CN103022019A Silicon capacitor capable of reducing equivalent resistance and preparation method thereof |
| 04/03/2013 | CN103022018A Production method of current tuned integrated magnetic film micro inductor and inductance tuning method |
| 04/03/2013 | CN103022017A Semiconductor structure, semiconductor and method for making semiconductor structure |
| 04/03/2013 | CN103022016A Multi-way electrostatic discharge protection device |
| 04/03/2013 | CN103022015A Electrostatic discharge protecting unit and semiconductor device |
| 04/03/2013 | CN103022014A Encapsulation module structure with antenna and manufacturing method of encapsulation module structure |
| 04/03/2013 | CN103022013A Power semiconductor module with wireless SAW temperature sensor |
| 04/03/2013 | CN103022012A Semiconductor storage device |
| 04/03/2013 | CN103022011A Semiconductor encapsulation structure and manufacture method thereof |