| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/09/2013 | US8415793 Wafer and substructure for use in manufacturing electronic component packages |
| 04/09/2013 | US8415792 Electrical contact alignment posts |
| 04/09/2013 | US8415791 Semiconductor device and fabrication method therefor |
| 04/09/2013 | US8415789 Three-dimensionally integrated semicondutor device and method for manufacturing the same |
| 04/09/2013 | US8415787 Integrated circuits having interconnects and heat dissipators based on nanostructures |
| 04/09/2013 | US8415786 Thermally enhanced semiconductor package system |
| 04/09/2013 | US8415785 Metal ring techniques and configurations |
| 04/09/2013 | US8415784 Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method |
| 04/09/2013 | US8415783 Apparatus and methodology for testing stacked die |
| 04/09/2013 | US8415782 Chip card having a plurality of components |
| 04/09/2013 | US8415781 Electronic component and method for manufacturing the same |
| 04/09/2013 | US8415780 Package carrier and manufacturing method thereof |
| 04/09/2013 | US8415779 Lead frame for semiconductor package |
| 04/09/2013 | US8415778 Non-leaded integrated circuit package system with multiple ground sites |
| 04/09/2013 | US8415777 Integrated circuit with millimeter wave and inductive coupling and methods for use therewith |
| 04/09/2013 | US8415776 Semiconductor device |
| 04/09/2013 | US8415775 Magnetic shielding for multi-chip module packaging |
| 04/09/2013 | US8415774 Screened electrical device and a process for manufacturing the same |
| 04/09/2013 | US8415772 Method to prevent surface decomposition of III-V compound semiconductors |
| 04/09/2013 | US8415770 Apparatus and methods for uniform metal plating |
| 04/09/2013 | US8415769 Integrated circuits on a wafer and method for separating integrated circuits on a wafer |
| 04/09/2013 | US8415750 Semiconductor device and method of fabricating the same |
| 04/09/2013 | US8415745 ESD protection device |
| 04/09/2013 | US8415741 High voltage vertical channel transistors |
| 04/09/2013 | US8415714 Programmable nanotube interconnect |
| 04/09/2013 | US8415706 Optical semiconductor package sealing resin material |
| 04/09/2013 | US8415663 System and method for test structure on a wafer |
| 04/09/2013 | US8415657 Enhanced work function layer supporting growth of rutile phase titanium oxide |
| 04/09/2013 | US8415205 Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof |
| 04/09/2013 | US8415200 Method for manufacturing semiconductor package |
| 04/04/2013 | WO2013049810A1 Heat sink for electrical or electronic equipments and method of manufacturing the same |
| 04/04/2013 | WO2013048620A1 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability |
| 04/04/2013 | WO2013048522A1 On-chip capacitors and methods of assembling same |
| 04/04/2013 | WO2013048496A1 Method for handling very thin device wafers |
| 04/04/2013 | WO2013048442A1 Tamper resistant amorphous alloy joining |
| 04/04/2013 | WO2013047807A1 Electronic component package, sealing member for electronic component package, and method for manufacturing sealing member for electronic component package |
| 04/04/2013 | WO2013047696A1 Epoxy resin composition and electronic component device |
| 04/04/2013 | WO2013047671A1 Connection member and electrical connection device |
| 04/04/2013 | WO2013047620A1 Curable resin composition for sealing optical semiconductor element, and cured material of same |
| 04/04/2013 | WO2013047607A1 Semiconductor module |
| 04/04/2013 | WO2013047533A1 Semiconductor device |
| 04/04/2013 | WO2013047520A1 Component embedded substrate mounting body, method for manufacturing same and component embedded substrate |
| 04/04/2013 | WO2013047375A1 Method for producing semiconductor device and semiconductor device |
| 04/04/2013 | WO2013047354A1 Hollow sealing structure |
| 04/04/2013 | WO2013047330A1 Joint |
| 04/04/2013 | WO2013047329A1 Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module |
| 04/04/2013 | WO2013047323A1 Method for producing semiconductor device and semiconductor device |
| 04/04/2013 | WO2013047101A1 Semiconductor device and method for producing semiconductor device |
| 04/04/2013 | WO2013047095A1 Wiring structure for display device |
| 04/04/2013 | WO2013046966A1 Wiring material and semiconductor module using same |
| 04/04/2013 | WO2013046954A1 Power module |
| 04/04/2013 | WO2013046680A1 Circuit device |
| 04/04/2013 | WO2013046675A1 Power converting apparatus |
| 04/04/2013 | WO2013046617A1 Substrate for mounting element thereon, semiconductor module, and method for manufacturing substrate for mounting element thereon |
| 04/04/2013 | WO2013046500A1 Method for manufacturing electronic component module |
| 04/04/2013 | WO2013046400A1 Semiconductor device |
| 04/04/2013 | WO2013046309A1 Cooling device problem detection device and problem detection method |
| 04/04/2013 | WO2013046291A1 Heat-dissipating material and method for producing same, and electronic device and method for producing same |
| 04/04/2013 | WO2013045367A2 Electronic assembly comprising substrate basic material having high thermal stability |
| 04/04/2013 | WO2013045348A1 Method for producing a solder joint |
| 04/04/2013 | WO2013045345A2 Layer composite for connecting electronic components comprising a compensation layer, linking layers and connection layers |
| 04/04/2013 | WO2013045222A1 Contact spring arrangement and method for producing same |
| 04/04/2013 | WO2013044838A1 Semiconductor package |
| 04/04/2013 | WO2013044566A1 Chip encapsulation method and encapsulation structure thereof |
| 04/04/2013 | WO2013044472A1 Electronic equipment heat dissipation structure and electronic equipment |
| 04/04/2013 | WO2013044459A1 Method of manufacturing a data carrier provided with a microcircuit |
| 04/04/2013 | WO2013012682A3 Copper interconnects separated by air gaps and method of making thereof |
| 04/04/2013 | WO2013009853A3 Electronic assembly including die on substrate with heat spreader having an open window on the die |
| 04/04/2013 | US20130083569 Manufacturing method of compound semiconductor device |
| 04/04/2013 | US20130083503 Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure |
| 04/04/2013 | US20130083488 Semiconductor package, wiring board unit, and electronic apparatus |
| 04/04/2013 | US20130083483 Heat dissipation device and electronic device using same |
| 04/04/2013 | US20130083038 Methods of creating spacers by self-assembly |
| 04/04/2013 | US20130082783 Semiconductor Device |
| 04/04/2013 | US20130082408 Method for producing semiconductor device and semiconductor device |
| 04/04/2013 | US20130082407 Integrated Circuit Package And Method |
| 04/04/2013 | US20130082406 Method for producing a two-chip assembly and corresponding two-chip assembly |
| 04/04/2013 | US20130082405 Semiconductor Package |
| 04/04/2013 | US20130082404 Semiconductor device and memory system |
| 04/04/2013 | US20130082403 Wirelessly Communicating Among Vertically Arranged Integrated Circuits (ICs) in a Semiconductor Package |
| 04/04/2013 | US20130082402 Semiconductor device |
| 04/04/2013 | US20130082401 Semiconductor device and manufacturing method of the same |
| 04/04/2013 | US20130082400 Compound semiconductor device and method of manufacturing the same |
| 04/04/2013 | US20130082399 Semiconductor package and method of manufacturing the same |
| 04/04/2013 | US20130082398 Stub minimization for wirebond assemblies without windows |
| 04/04/2013 | US20130082397 Stub minimization for wirebond assemblies without windows |
| 04/04/2013 | US20130082396 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 04/04/2013 | US20130082395 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
| 04/04/2013 | US20130082394 Stub minimization for multi-die wirebond assemblies with parallel windows |
| 04/04/2013 | US20130082393 Semiconductor device and method of manufacturing the same |
| 04/04/2013 | US20130082392 Device with contact elements |
| 04/04/2013 | US20130082391 Stub minimization for wirebond assemblies without windows |
| 04/04/2013 | US20130082390 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 04/04/2013 | US20130082389 Stub minimization for assemblies without wirebonds to package substrate |
| 04/04/2013 | US20130082388 Manufacturing method of semiconductor device and semiconductor device |
| 04/04/2013 | US20130082387 Power semiconductor arrangement and method for producing a power semiconductor arrangement |
| 04/04/2013 | US20130082386 Integrated circuit package and a method for manufacturing an integrated circuit package |
| 04/04/2013 | US20130082385 Die having coefficient of thermal expansion graded layer |
| 04/04/2013 | US20130082384 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
| 04/04/2013 | US20130082383 Electronic assembly having mixed interface including tsv die |